Patent application number | Description | Published |
20100237974 | IMPEDANCE TRANSFORMER AND APPLICATIONS THEREOF - An impedance transformer includes a first winding and a second winding. The first winding includes a first plurality of winding components, wherein each of the first plurality of winding components is on a corresponding layer of a first set of layers of a supporting substrate. The second winding includes a second plurality of winding components, wherein each of the second plurality of winding components is on a corresponding layer of a second set of layers of the supporting substrate and the first and second sets of layers are interleaved. The first winding has a first impedance within a desired frequency range and the second winding has a second impedance within the desired frequency range, where the first and second impedances are based on at least one of spacing, trace width, and trace length of the first and second plurality of winding components. | 09-23-2010 |
20100245191 | MULTIPLE MODE RF TRANSCEIVER AND ANTENNA STRUCTURE - An antenna structure includes first and second antennas. The first antenna has a first geometry corresponding to a first frequency. The second antenna has a second geometry corresponding to a second frequency. The second antenna is proximal to the first antenna and utilizes electrical-magnetic properties of the first antenna to transceive signals at the second frequency. | 09-30-2010 |
20110133835 | DOUBLE TRANSFORMER BALUN FOR MAXIMUM POWER AMPLIFIER POWER - Double transformer balun for maximum PA (Power Amplifier) power. A novel approach is presented herein by which conversion from a differential signal to single-ended signal may be achieved using a double transformer balun design. The secondary coils of the double transformer balun also operate as a choke for the PA supply voltage. The secondary coils can operate as an RF (Radio Frequency) trap or choke to keep any AC (Alternating Current) signal components and to pass any DC (Direct Current) components. By using a double transformer balun design, relatively thinner tracks may be employed thereby ensuring a high degree of electromagnetic coupling efficiency and high performance. Also, these relatively thinner tracks consume a relatively small amount of space on the die. The double transformer balun design also includes a matching Z (impedance) block that is operable to match the Z of an antenna or line that the PA is driving. | 06-09-2011 |
20110182218 | Wireless Bus for Intra-Chip and Inter-Chip Communication, Including Adaptive Link and Route Embodiments - Embodiments of the present invention are directed to a wireless bus for intra-chip and inter-chip communication having adaptable links and routes among wireless-enabled components (WECs) of the wireless bus. Links and routes may be adapted according to one or more of, among other factors, the relative position of WECs, available capabilities (e.g., communication capabilities) at WECs, availability of resources at WECs, and the physical environment. | 07-28-2011 |
20110183604 | Creating A System On The Fly And Applications Thereof - Disclosed herein are systems, apparatuses, and methods for creating a system of wireless-enabled components (WECs). Such a system includes a server and a plurality of wireless-enabled component (WECs). Each WEC includes a functional resource (e.g., a processing resource and/or a memory resource) and is configured for wireless communication with the server and one or more other WECs. A first WEC is configured to wirelessly upload, to the server, an availability of the functional resource of the first WEC. The first WEC is further configured to wirelessly download, from the server, a linking resource for linking with one or more of the plurality of WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips of multiple devices. | 07-28-2011 |
20110183610 | Proximity Coupling Without Ohmic Contact and Applications Thereof - Disclosed herein are systems, apparatuses, and methods for providing a proximity coupling without Ohmic contact. Such a system includes a plurality of wireless-enabled components (WECs) that are wirelessly coupled to each other. Each WEC includes a metal-based element, a substrate, and a semiconductor layer that separates the metal-based element from the substrate. A signal is configured to be transmitted via a proximity coupling (e.g., a magnetic coupling, an electric coupling, and/or an electromagnetic coupling) between the metal-based element and the substrate without an Ohmic contact between the metal-based element and the substrate. In an example, a first subset of the plurality of the WECs is co-located on a first chip, and a second subset of the plurality of the WECs is co-located on a second chip. The first chip and the second chip may be located in a single device or in separate devices. | 07-28-2011 |
20110183615 | System Having Co-Located Functional Resources Amd Applications Thereof - Disclosed herein are systems, apparatuses, and methods for wirelessly coupling functional resources. Such a system includes a plurality of co-located, wireless-enabled functional units of a first type and a plurality of co-located, wireless-enabled functional units of a second type. At least one of the wireless-enabled functional units of the first type is wirelessly coupled with one or more of the wireless-enabled functional units of the second type. The wireless-enabled functional units of the first type may be wireless-enabled processing units, and the wireless-enabled functional units of the second type may be wireless-enabled memory units. In an example, the plurality of wireless-enabled functional units of the first type are co-located on a first chip, and the plurality of wireless-enabled functional units of the second type are co-located on a second chip. The first chip and the second chip may be located in a single device or in separate devices. | 07-28-2011 |
20110183616 | Wireless Bus for Intra-Chip and Inter-Chip Communication, Including Scalable Wireless Bus Embodiments - Embodiments of the present invention are directed to a scalable wireless bus for intra-chip and inter-chip communication. The scalable wireless bus includes a plurality of wireless-enabled components (WECs). In an embodiment, the scalable wireless bus may have at least one of the number of links among WECs and the capacity of said links adapted based on one or more factors. For example, the number of links and the capacity of the links may be adapted according to one or more of, among other factors, expected activity level over the wireless bus, desired power consumption, delay, and interference levels. | 07-28-2011 |
20110183617 | Establishing A Wireless Communications Bus And Applications Thereof - Disclosed herein are systems, apparatuses, and methods for establishing wireless communications among a plurality of wireless-enabled components (WECs), and applications thereof. Such a system includes a plurality of WECs, each configured to transmit and receive over a wireless bus. The wireless bus includes (i) a first channel to identify proximally located WECs and (ii) a second channel to support communications among the proximally located WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips across multiple devices. | 07-28-2011 |
20110183630 | Wireless Bus for Intra-Chip and Inter-Chip Communication, Including Wireless-Enabled Component (WEC) Embodiments - Embodiments of the present invention are directed to a wireless-enabled component (WEC) for enabling a wireless bus for intra-chip and inter-chip communication. A WEC encompasses a functional block of an IC (such as, for example, a processing core of a processing unit), an entire IC (such as, for example, a processing unit), or a device that includes a plurality of ICs (such as, for example, a handheld device). According to embodiments, a WEC may be associated with one or more sub-blocks of an IC, a single IC, or a plurality of ICs. | 07-28-2011 |
20110183699 | Wireless bus for intra-chip and inter-chip communication, including resource borrowing embodiments - Embodiments of the present invention are directed to a wireless resource borrowing environment enabled by a wireless bus comprising a plurality of wireless-enabled components (WECs). In an embodiment, the WECs use the wireless bus to share resource information (including resource availability information) among each others. For example, a WEC may share with other WECs information regarding its processing and memory resources. The WEC may then use the shared resource information to identify resources at other WECs that it may borrow to perform certain tasks. In an embodiment, resource borrowing is performed according to a cost-based method which optimizes resource borrowing according to a cost function. The cost function may be designed to optimize resource borrowing according to any combination of one or more factors, including power consumption, processing speed, delay, interference, error rate, reliability, load at the lender WEC, computing capability at the lender WEC, etc. | 07-28-2011 |
20110185091 | Wireless Bus for Intra-Chip and Inter-Chip Communication, Including Data Center/Server Embodiments - Embodiments of the present invention are directed to a wire-free data center/server. The data center/server is wire-free in the sense that communication within a data unit of the data center/server (i.e., intra-data unit), between data units of the data center/server (inter-data unit), and between the data units and the backplane of the data center/server is performed wirelessly. | 07-28-2011 |
20110185092 | Configurable System of Wireless-Enabled Components And Applications Thereof - Disclosed herein is a configurable system of wireless-enabled components (WECs) and applications thereof. The system includes a plurality of WECs and a controller. Each WEC comprises a functional resource and is adapted to wirelessly communicate with other WECs. The controller is adapted to dynamically configure the functional resource of each WEC and wireless communications among the plurality of WECs to form a field-programmable communications array. The controller may be one of the plurality of WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips of multiple devices. | 07-28-2011 |
20110279327 | PLANAR INVERTED-F ANTENNA - A low profile Planar Inverted-F Antenna (PIFA) comprises a radiating strip, an inductive tuning portion, a vertical feed portion, and a retracted ground plane. The radiating strip is approximately parallel to the ground plane and is suspended above the ground plane by the feed element at a certain distance. Further, the radiating strip, in part or entirely, overhangs the ground plane. In this way, the radiating strip may be suspended very close to the ground plane, but yet exhibits a large bandwidth. | 11-17-2011 |
20110309842 | Identifying Defective Semiconductor Components on a Wafer Using Thermal Imaging - Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation. | 12-22-2011 |
20110309851 | Tagging of Functional Blocks of a Semiconductor Component on a Wafer - Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation. | 12-22-2011 |
20110309852 | Simultaneously Tagging of Semiconductor Components on a Wafer - Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation. | 12-22-2011 |
20110313710 | Simultaneous Testing of Semiconductor Components on a Wafer - Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation. | 12-22-2011 |
20110313711 | Identifying Defective Semiconductor Components on a Wafer Using Component Triangulation - Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation. | 12-22-2011 |
20120112953 | INTEGRATED AND CONFIGURABLE RADAR SYSTEM - An integrated radar system includes a processing module and a radar device. The radar device includes an antenna module, a configurable shaping module, and a configurable transceiver module. The processing module generates an outbound signal and a control signal to configure the integrated radar system. The configured transceiver module converts the outbound signal into an outbound wireless signal. The configured shaping module shapes the outbound wireless signal into a shaped signal. The antenna module transmits the shaped signal and then receives an inbound radar signal. The configured shaping module shapes the inbound radar signal into an inbound wireless signal. The configured transceiver module converts the inbound wireless signal into an inbound symbol stream. The processing module determines location information regarding an object based on the inbound symbol stream. | 05-10-2012 |
20120302181 | RADIO FRONT END AND APPLICATIONS THEREOF - A radio front end includes a transformer and an adjustable load. The transformer includes a first winding and a second winding, wherein the first winding is operably coupled to an antenna and the second winding coupled to at least one of a power amplifier and a low noise amplifier. The adjustable load is operably coupled to the second winding, wherein the adjustable load provides a first impedance based on a first impedance selection signal when the radio front end is in a transmit mode and provides a second impedance based on a second impedance selection signal when the radio front end is in a receive module such that impedance at the first winding is substantially similar in the transmit mode and in the receive mode. | 11-29-2012 |
20130072125 | SWITCH FOR TRANSMIT/RECEIVE MODE SELECTION AND ANTENNA POLARIZATION DIVERSITY - A transceiver circuit includes a transmitter to send communication signals and a receiver to receive communication signals sent by other transmitters. The transceiver circuit also includes a switch to connect the transmitter and the receiver to at least one antenna. The switch controls at least two directions of polarization of the at least one antenna. | 03-21-2013 |
20130072136 | ANTENNA HAVING POLARIZATION DIVERSITY - A compact antenna includes a main antenna patch. A first feed point and a second feed point connect with the main antenna patch to provide current in the main antenna. Excitation of the first feed point produces polarization in a first direction along the main antenna patch and excitation of the second feed point produces polarization in a second direction different from the first direction. | 03-21-2013 |
20130082379 | SEMICONDUCTOR PACKAGE INCLUDING AN INTEGRATED WAVEGUIDE - Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit. | 04-04-2013 |
20130082403 | Wirelessly Communicating Among Vertically Arranged Integrated Circuits (ICs) in a Semiconductor Package - Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit. | 04-04-2013 |
20130082730 | Passive Probing of Various Locations in a Wireless Enabled Integrated Circuit (IC) - Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit. | 04-04-2013 |
20130082767 | SIGNAL DISTRIBUTION AND RADIATION IN A WIRELESS ENABLED INTEGRATED CIRCUIT (IC) - Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit. | 04-04-2013 |
20130082800 | APPARATUS FOR RECONFIGURING AN INTEGRATED WAVEGUIDE - Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit. | 04-04-2013 |
20130082801 | SIGNAL DISTRIBUTION AND RADIATION IN A WIRELESS ENABLED INTEGRATED CIRCUIT (IC) USING A LEAKY WAVEGUIDE - Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit. | 04-04-2013 |
20130191567 | Wireless Bus for Intra-Chip and Inter-Chip Communication, Including Data Center/Server Embodiments - Embodiments of the present invention are directed to a wire-free data center/server. The data center/server is wire-free in the sense that communication within a data unit of the data center/server (i.e., intra-data unit), between data units of the data center/server (inter-data unit), and between the data units and the backplane of the data center/server is performed wirelessly. | 07-25-2013 |
20130285848 | Integrated and Configurable Radar System - An integrated radar system includes a processing module and a radar device. The radar device includes an antenna module, a configurable shaping module, and a configurable transceiver module. The processing module generates an outbound signal and a control signal to configure the integrated radar system. The configured transceiver module converts the outbound signal into an outbound wireless signal. The configured shaping module shapes the outbound wireless signal into a shaped signal. The antenna module transmits the shaped signal and then receives an inbound radar signal. The configured shaping module shapes the inbound radar signal into an inbound wireless signal. The configured transceiver module converts the inbound wireless signal into an inbound symbol stream. The processing module determines location information regarding an object based on the inbound symbol stream. | 10-31-2013 |
20130311127 | Identifying Defective Components on a Wafer Using Component Triangulation - Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation. | 11-21-2013 |
20140027903 | Semiconductor Package Including an Integrated Waveguide - Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit. | 01-30-2014 |