| Patent application number | Description | Published |
|---|
| 20080268134 | ELECTRODE WITH INCREASED STABILITY AND METHOD OF MANUFACTURING THE SAME - The present invention provides an implantable electrode with increased stability having a clustered structure wherein the surface of the electrode is covered with a material comprising openings which are filled with sticks or posts. | 10-30-2008 |
| 20080314502 | METHOD FOR PROVIDING HERMETIC ELECTRICAL FEEDTHROUGH - A method for fabricating the hermetic electrical feedthrough. The method comprises providing a ceramic sheet having an upper surface and a lower surface, forming at least one via hole in said ceramic sheet extending from said upper surface to said lower surface, inserting a conductive thickfilm paste into said via hole, laminating the ceramic sheet with paste filled via hole between an upper ceramic sheet and a lower ceramic sheet to form a laminated ceramic substrate, firing the laminated ceramic substrate to a temperature to sinter the laminated ceramic substrate and cause the paste filled via hole to form metalized via and cause the laminated ceramic substrate to form a hermetic seal around said metalized via, and removing the upper ceramic sheet and the lower ceramic sheet material from the fired laminated ceramic substrate to expose an upper and a lower surface of the metalized via. | 12-25-2008 |
| 20080314865 | Method for Providing Hermetic Electrical Feedthrough - A method for fabricating the hermetic electrical feedthrough. The method comprises providing a ceramic sheet having an upper surface and a lower surface, forming at least one via hole in said ceramic sheet extending from said upper surface to said lower surface, inserting a conductive thickfilm paste into said via hole, laminating the ceramic sheet with paste filled via hole between an upper ceramic sheet and a lower ceramic sheet to form a laminated ceramic substrate, firing the laminated ceramic substrate to a temperature to sinter the laminated ceramic substrate and cause the paste filled via hole to form metalized via and cause the laminated ceramic substrate to form a hermetic seal around said metalized via, and removing the upper ceramic sheet and the lower ceramic sheet material from the fired laminated ceramic substrate to expose an upper and a lower surface of the metalized via. | 12-25-2008 |
| 20100197082 | Implantable Microelectronic Device and Method of Manufacture - An implantable hermetically sealed microelectronic device and method of manufacture are disclosed. The microelectronic device of the present invention is hermetically encased in a insulator, such as alumina formed by ion bean assisted deposition (“IBAD”), with a stack of biocompatible conductive layers extending from a contact pad on the device to an aperture in the hermetic layer. In a preferred embodiment, one or more patterned titanium layers are formed over the device contact pad, and one or more platinum layers are formed over the titanium layers, such that the top surface of the upper platinum layer defines an external, biocompatible electrical contact for the device. Preferably, the bottom conductive layer is larger than the contact pad on the device, and a layer in the stack defines a shoulder. | 08-05-2010 |
| 20110118808 | BIOCOMPATIBLE BONDING METHOD AND ELECTRONICS PACKAGE SUITABLE FOR IMPLANTATION - The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue. | 05-19-2011 |
| 20110213443 | Biocompatible Bonding Method and Electronics Package Suitable for Implantation - The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue. | 09-01-2011 |
| 20110253432 | Method and Apparatus for Providing Hermetic Electrical Feedthrough - A method and apparatus suitable for forming hermetic electrical feedthroughs in a ceramic sheet having a thickness of .ltoreq.40 mils. More particularly, the method yields an apparatus including a hermetic electrical feedthrough which is both biocompatible and electrochemically stable and suitable for implantation in a patient's body. The method involves: (a) providing an unfired, ceramic sheet having a thickness of .ltoreq.40 mils and preferably comprising .ltoreq.99% aluminum oxide; (b) forming multiple blind holes in said sheet; (c) inserting solid wires, preferably of platinum, in said holes; (d) firing the assembly of sheet and wires to a temperature sufficient to sinter the sheet material but insufficient to melt the wires; and (e) removing sufficient material from the sheet lower surface so that the lower ends of said wires are flush with the finished sheet lower surface. | 10-20-2011 |
| 20110270067 | Biocompatible Bonding Method - The invention is a device and method for connecting a hermetic package to a flexible circuit such as for an electrode array in an implantable device. Attaching metal pads on a flexible circuit to metal pads on a hermetic device by conductive adhesive is known. A smooth metal, such as platinum, does not bond well to conductive epoxy. The invention provides a roughened surface, such as etching or applying high surface area platinum gray, to improve adhesion to platinum or other metal pads. | 11-03-2011 |
