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Jer-Haur Kuo, Tu-Cheng TW

Jer-Haur Kuo, Tu-Cheng TW

Patent application numberDescriptionPublished
20090161340WHITE LIGHT ILLUMINATOR AND READING LAMP USING THE SAME - A reading lamp (06-25-2009
20090161355WHITE LIGHT ILLUMINATOR AND READING LAMP USING THE SAME - A reading lamp (06-25-2009
20090168429LIGHT SOURCE MODULE WITH A THERMOELECTRIC COOLER - A light source module (07-02-2009
20090194778LIGHT EMITTING DIODE - A light emitting diode (08-06-2009
20090237956LIGHT EMITTING DIODE ASSEMBLY - An LED assembly (09-24-2009
20090244851MOUNTING DEVICE FOR MOUNTING HEAT SINK ONTO ELECTRONIC COMPONENT - A mounting device (10-01-2009
20090244863MOUNTING DEVICE FOR MOUNTING HEAT SINK ONTO ELECTRONIC COMPONENT - A mounting device (10-01-2009
20090251863MOUNTING DEVICE FOR MOUNTING HEAT SINK ONTO ELECTRONIC COMPONENT - An electronic apparatus includes a PCB with a heat generating electronic component disposed thereon, a heat sink, and a mounting device for mounting the heat sink onto the heat generating electronic component. The mounting device includes a mounting frame and a wire clip. The mounting frame surrounds the heat sink, and includes two first mounting arms and two second mounting arms disposed above the first mounting arms. The first mounting arms abut on the PCB. A pair of engaging wings are formed on the second mounting arms. The wire clip includes a pivot axis pivotably attached to the mounting frame and two resilient arms at opposite sides of the mounting frame. The resilient arms abut against the heat sink and engage with the engaging wings, thereby exerting a resilient force on the heat sink toward the heat generating electronic component.10-08-2009
20090251901LIGHT EMITTING DIODE LAMP - An LED lamp (10-08-2009
20090268407HEAT SINK CLIP - A heat sink clip (10-29-2009
20090268463LED LAMP WITH HEAT SINK - An LED lamp (10-29-2009
20090279263SECURING DEVICE FOR ASSEMBLING HEAT DISSIPATION MODULE ONTO ELECTRONIC COMPONENT - A securing device (11-12-2009
20090284968LIGHT EMITTING DIODE LAMP - A light emitting diode (LED) lamp includes a lampshade, a light guide pole and a plurality of LEDs. The light guide pole is of light permeable material and received in the lampshade. A plurality of irregular elements is formed on an outer surface of the light guide pole. A distribution density of the irregular elements decreases gradually from two ends of the light guide pole towards a middle of the light guide pole. The LEDs are mounted at the two ends of the light guide pole. Light emitted by the light emitting diodes falls incident into the light guide pole and exits the light guide pole from the outer surface thereof.11-19-2009
20090310306HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat sink and a cooling fan arranged thereon. The cooling fan includes a motor-stator and an impeller mounted around the motor-stator. The motor-stator is arranged on a middle of the heat sink. The heat sink includes a base and a plurality of fins extending upwardly from the base. The heat sink defines a plurality of notches incising the fins. The notches are angled towards the middle of the heat sink immediately under the motor-stator of the cooling fan.12-17-2009
20090316414LED LAMP - An LED lamp (12-24-2009
20100046230LED LAMP - An LED lamp (02-25-2010
20100059210FAN IMPELLER AND HEAT DISSIPATING DEVICE HAVING THE SAME - A heat dissipation device includes an electric fan having a fan impeller with a hub and a heat sink. A plurality of main blades and subsidiary blades extend radially and outwardly from the hub and alternate with each other. The electric fan forms an air inlet and an air outlet. The main blades have connecting portions on the hub which are extended towards a center of the hub at the air outlet. The subsidiary blades have a smaller radial length than the main blades. The subsidiary blades each have a connecting edge on the hub which is extended toward the center of the hub adjacent to the air outlet. The fan impeller drives more air to the center of the air outlet, whereby more air can flow to a center of the heat sink.03-11-2010
20100073878HEAT DISSIPATION APPARATUS - A heat dissipation apparatus includes a heat sink (03-25-2010
20100139888HEAT SPREADER AND HEAT DISSIPATION DEVICE USING SAME - A heat dissipation fan includes a fan frame, a bearing assembly, a stator and a rotor. The fan frame includes a base and a central tube. The central tube includes an open top end and an open bottom end. The base defines a receiving concave at a bottom surface thereof. The receiving concave communicates with the central hole. A top wall is formed by the base over the concave. A sidewall is formed between the top wall and the bottom surface of the base and surrounds the concave. A plurality of first locking units extend from the top wall into the receiving concave. The bearing assembly includes an oil sealing cover for sealing the open bottom end of the central tube. The oil sealing cover includes a plurality of second locking units which are detachably interlocked with the first locking units to mount the oil sealing cover to the base.06-10-2010
20100157537FIN-TYPE HEAT SINK AND ELECTRONIC DEVICE USING SAME - A heat sink includes two heat spreaders spaced from each other and a heat dissipation fin disposed and connected between the two heat spreaders. The heat dissipation fin includes a plurality of hollow tubular heat dissipation units arranged linearly from one of the heat spreaders to the other one of the heat spreaders. The heat dissipation units are connected together with their axes along length directions thereof being parallel to each other. Each of the heat dissipation units can resiliently deform to change a distance between the two heat spreaders. The present disclosure also discloses an electronic device incorporating such a heat sink.06-24-2010
20100157540FIN-TYPE HEAT SINK AND ELECTRONIC DEVICE USING SAME - A heat sink includes two heat spreaders spaced from each other and a plurality of heat dissipation fins connected between the two heat spreaders. The heat dissipation fin is wave-shaped from one of the heat spreaders to the other one of the heat spreaders. The heat dissipation fins are spaced from each other. When a force is applied to two heat spreaders of the heat sink, the heat dissipation fin is resiliently deformed to change a distance between the two heat spreaders. The present disclosure also discloses an electronic device incorporating the heat sink and the heat dissipation fin.06-24-2010
20100157605LIGHT EMITTING DIODE LAMP - A light emitting diode lamp includes a lampshade and a light source. The lampshade is a portion of a hollow ellipsoid with one focus of the ellipsoid located therein. The lampshade is symmetric to a major axis of the ellipsoid. The lampshade has a vertex located on the major axis and defines a light extraction opening at one end thereof opposite to the vertex. A reflecting layer is formed on an inner surface of the lampshade. The light source is received in the lampshade and localized at the one focus of the ellipsoid. The light source includes a plurality of light emitting diodes facing the inner surface of the lampshade and the light extraction opening, respectively.06-24-2010
20100165614LED LAMP AND MANUFACTURING METHOD THEREOF - An LED lamp comprises a lamp enclosure and an LED assembly. The lamp enclosure defines a receiving hole therein, and the LED assembly is received in the lamp enclosure. The lamp enclosure is made of a light penetrable material. A plurality of fluorescent powders are doped integrally and distributed uniformly in the lamp enclosure. The LED assembly comprises a plurality of LEDs. Lights emitted by the LEDs pass through the lamp enclosure for lightening an outside of the LED lamp. A method for manufacturing the lamp is also disclosed.07-01-2010
20100173038INJECTION MOLD AND RUNNER SYSTEM THEREOF - An injection mold has a plurality of cavities and a runner system for injecting material into the cavities. The runner system includes a main-runner and a sub-runner. The sub-runner interconnects the main-runner and the cavities. The sub-runner includes a first runner and a pair of second runners. The first runner connects the main-runner, and the second runners respectively connects ends of the first runner. A buffer rejoin is formed around a joint of the first runner and each second runner for mixing material when the material flows from the first runner into the second runners to make the material have a symmetric speed distribution in the second runners.07-08-2010
20100232931HEAT DISSIPATION FAN - A heat dissipation fan includes a base with a plurality of holes defined therein, a stator mounted on the base and being placed around the holes of the base, and an impeller rotatably attached to the base. The impeller includes a hub and a plurality of blades, the hub includes a top wall with a plurality of holes defined therein and an annular wall depending from the top wall. The blades are arranged around the annular wall of the hub. An axial air passage is defined in the stator. The holes of the base communicate with the holes of the top wall via the air passage.09-16-2010
20100246136HEAT SINK AND ELECTRONIC DEVICE USING THE SAME - A heat sink includes two heat spreaders spaced from each other and a plurality of heat dissipation fins disposed between the heat spreaders. The heat dissipation fin is curved from one of the heat spreaders to the other one of the heat spreaders. A curved air passage is formed between every two adjacent heat dissipation fins. The heat dissipation fin can resiliently deform to change a distance between the heat spreaders. The present disclosure also discloses an electronic device incorporating such a heat sink. The electronic device comprises a shell and an electronic component mounted in the shell. One of the heat spreaders is attached to the electronic component and the other one is attached to the shell.09-30-2010
20110005727THERMAL MODULE AND MANUFACTURING METHOD THEREOF - A thermal module includes a substrate and a heat pipe integrally embedded in the substrate by insert molding technique. An end of the heat pipe protrudes laterally out of the substrate. The heat pipe includes a tube, a wick structure attached to an inner surface of the tube and a working fluid filled in the tube. A method for manufacturing the thermal module includes following steps: providing a tube with a wick structure attached to an inner surface thereof, an end of the tube being open; placing the tube into a mold; injecting a molten metal into the mold to form a substrate with the tube being integrally embedded in the substrate and the open end of the tube protruding laterally out of the substrate; filling a working fluid into the tube via the open end; sealing the open end of the tube.01-13-2011
20110030930HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat sink, an axial fan and a fan cover. The heat sink includes a plurality of fins defining a plurality of longitudinal airflow channels therebetween. The axial fan is mounted on a top side of the heat sink. The axial fan defines an air inlet located adjacent to and communicating with the airflow channels of the heat sink. The fan cover is between the heat sink and the axial fan. The fan cover includes a side plate surrounding a top end of the heat sink to make the axial fan just draw cooling air into the heat sink from a position around a bottom end of the heat sink. The cooling air flows upwardly through the heat sink to the air inlet of the axial fan to thereby take heat away from the heat sink.02-10-2011
20110048682HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat pipe and a heat sink. The heat sink defines a through hole with a diameter slightly smaller then an outer diameter of the heat pipe. The heat pipe is fixedly engaging in the through hole of the heat sink via interference fit. The heat pipe includes a tube defining an interspace therein, a first wick formed on an inner surface of the tube, working fluid received in the interspace of the tube, and a retaining structure. The retaining structure is received in the interspace of the tube and abuts the first wick of the tube to enhance a rigidity of the tube. A second wick is formed on an outer surface of the retaining structure and connects with the first wick of the tube.03-03-2011
20110150651CENTRIFUGAL FAN - A centrifugal fan includes a housing including an air collecting portion, a first frame and a second frame. The air collecting portion has an air outlet defined in one end thereof. The first and second frames are located at two opposite sides of an opposite end of the air collecting portion. The first and second frames each define a receiving space therein for rotatably receiving an impeller. The first and second frames each further define a vent hole therein. The receiving spaces of the first and second frames communicate with the inner space of the air collecting portion via the vent holes thereof. Airflow generated by the two impellers travels to the inner space of the air collecting portion through the vent holes of the first and second frames, and exits the centrifugal fan through the air outlet of the air collecting portion.06-23-2011

Patent applications by Jer-Haur Kuo, Tu-Cheng TW