Jeong-Kyu
Jeong Kyu Lee, Suwon KR
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20130146344 | INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD INCLUDING THE SAME - Disclosed herein is an insulating resin composition for a printed circuit board, including 40 to 70 wt % of a liquid crystal oligomer shown in formula 1, 10 to 30 wt % of an epoxy resin, 10 to 30 wt % of a cyanate-based resin, and 0.1 to 0.5 wt % of a curing catalyst, and a printed circuit board including the same. | 06-13-2013 |
20140002226 | INDUCTOR AND METHOD OF MANUFACTURING THE SAME | 01-02-2014 |
20140034367 | EPOXY RESIN COMPOSITION FOR PRITNED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD - Disclosed herein are an epoxy resin composition, an insulating film using the same, and a multilayer printed circuit board; more particularly, an epoxy resin composition including a liquid crystal capable of lowering the coefficient of thermal expansion, improving chemical resistance, and increasing the glass transition temperature, an insulating film or prepreg manufactured by using the epoxy resin composition, and a multilayer printed circuit board including the insulating film or prepreg. | 02-06-2014 |
20140063427 | RESIN COMPOSITION FOR THERMAL RADIATION BOARD AND THERMAL RADIATION BOARD COMPRISING THE SAME - There is provided a resin composition for a thermal radiation board including: 20 wt % to 50 wt % of a liquid crystal oligomer represented by particular Chemical Formulas; 10 wt % to 40 wt % of an epoxy resin; and 10 wt % to 40 wt % of an inorganic filter. | 03-06-2014 |
20140079924 | RESIN COMPOSITION FOR PACKAGE SUBSTRATE AND PACKAGE SUBSTRATE COMPRISING CORE LAYER AND PREPREG USING THE SAME - The present invention relates to a resin composition for a package substrate and a package substrate comprising a core layer and a prepreg using the same, which include a polyester amide liquid crystal oligomer, a bisphenol tetrafunctional epoxy resin, a curing agent, and an inorganic filler, wherein the bisphenol tetrafunctional epoxy resin has a viscosity of greater than 20,000 cps. According to the resin composition for a package substrate in accordance with the present invention can provide a package substrate with reduced substrate warpage by improving heat radiation characteristics of a substrate material. Further, it is possible to improve defects by reducing delamination between a chip and the substrate or occurrence of cracks of solder balls through the reduced substrate warpage characteristics. | 03-20-2014 |
20140106147 | PREPREG, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD - Disclosed herein is a prepreg including: a reinforcement substrate; and a polymer resin layer formed by impregnating a polymer resin containing a liquid crystal oligomer and an inorganic filler on the reinforcement substrate, wherein an impregnation ratio of the polymer resin is 60 to 85 wt., whereby a product manufactured by using the prepreg may have excellent coefficient of thermal expansion and thermal properties. | 04-17-2014 |
Jeong Kyu Lee, Gyunggi-Do KR
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20130337268 | INSULATING EPOXY RESIN COMPOSITION, INSULATING FILM MANUFACTURED THEREFROM, AND MULTILAYER PRINTED CIRCUIT BOARD HAVING THE SAME - Disclosed herein are an insulating resin composition, an insulating film manufactured therefrom, and a multilayer printed circuit board, and more specifically, in a build-up manner of multilayer printed circuit board, an insulating epoxy resin composition including a liquid crystal oligomer or the like capable of decreasing a dissipation factor, a dielectric constant, and a coefficient of thermal expansion, an insulating film manfuactured by using the insulating epoxy resin composition, and a multilayer printed circuit board having multiple layers obtained by allowing inner circuits formed of copper (Cu) to be insulated by using the insulating film. | 12-19-2013 |
20140066545 | EPOXY RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD - Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition including a liquid crystal oligomer having a low coefficient of thermal expansion and an improved glass transition temperature, and the like. | 03-06-2014 |
Jeong Kyu Lim, Seoul KR
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20100130180 | Method of updating user presence information in mobile instant messaging and mobile terminal using the same - A mobile terminal is capable of updating user presence information in mobile instant messaging. The mobile terminal and associated method facilitate updating user presence information in multiple sessions of mobile instant messaging. The method includes: joining multiple IM communities; issuing a command for presence information update in relation to one of the multiple IM communities; and sending a request for presence information update to IM servers of two or more IM communities including the IM community indicated by the issued update command, among the multiple IM communities. | 05-27-2010 |
Jeong Kyu Lim, Gyeonggi-Do KR
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20100153506 | METHOD AND SYSTEM FOR LOGGING IN TO INSTANT MESSENGER - A method and system logging in to an Instant Messenger (IM) a includes: registering login schedule information to an IM server; transmitting, by the IM server, login information to an IM client when a login time included in the login schedule information arrives; and logging in, by the IM client, to the IM server using the login information. A user of the mobile terminal presets the login schedule information so that the mobile terminal may login automatically to an IM community at a preset time. If the user of the mobile terminal forgets to log in at the preset time, the mobile terminal may log in to the IM community automatically. | 06-17-2010 |
Jeong Kyu Park, Gyeonggi-Do KR
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20090030625 | Fuel efficiency measurement system and method for fuel cell vehicle - A fuel efficiency measurement system includes a fuel supply tank for supplying hydrogen to be used as a fuel to a fuel cell of the vehicle during measurement of fuel efficiency and a precision electronic balance for detecting a weight of the fuel supply tank so as to perform the measurement of fuel efficiency based on a vehicle driving distance and a change in weight of the fuel supply tank measured by the electronic balance during measurement of fuel efficiency. According to the fuel efficiency measurement system, it is possible to more accurately calculate fuel efficiency without using hydrogen of a hydrogen tank installed in the vehicle. | 01-29-2009 |
20130003425 | DC/DC CONVERTER, AND ELECTRIC GENERATING SYSTEM USING SOLAR CELL HAVING THE SAME - Disclosed herein is an electric generating system using a solar cell which converts a voltage generated in the solar cell into an Alternating Current (AC) voltage, and applies the converted voltage to a power system. The electric generating system includes; a Direct Current (DC)/DC converter that converts the voltage generated in the solar cell into a DC voltage, and has a synchronous rectifier including a synchronous switch; and a controller that detects one of a phase and a voltage of the power system, and selectively connects the synchronous switch of the synchronous rectifier in accordance with one of the phase and voltage of the power system. Here, the electric generating system reduces a conduction loss, and increases overall efficiency of the electric generation system. | 01-03-2013 |
Jeong Kyu Park, Yongin-Si KR
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20140370409 | COOLING PUMP DRIVING SYSTEM - A cooling pump driving system includes an electric water pump in a coolant passage line for circulating a coolant and having a variable rotation speed. A sensor disposed at an outlet side of the electric water pump checks a coolant pressure passing through the electric water pump. A controller including a reference value for the pressure change is configured to decrease a rotation speed of the electric water pump when the pressure change detected by the sensor is the reference value or higher. | 12-18-2014 |
Jeong-Kyu Kang, Icheon-Si KR
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20100019303 | METHOD FOR FORMING CONDUCTIVE PATTERN, SEMICONDUCTOR DEVICE USING THE SAME AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME - A method for fabricating conductive patterns includes forming a conductive layer over a substrate, etching the conductive layer to a first thickness to form first patterns, forming spacers on sidewalls of the first patterns, and etching the conductive layer to a second thickness using the spacers as an etch barrier to form second patterns. Thus, conductive patterns can be formed with vertical sidewalls without being damaged, and lean and collapse of the conductive patterns are prevented. | 01-28-2010 |
Jeong-Kyu Kang, Kyoungki-Do KR
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20090039463 | FUSE BOX AND METHOD FOR FABRICATING THE SAME AND METHOD FOR REPAIRING THE SAME IN SEMICONDUCTOR DEVICE - A fuse box in a semiconductor device having a fuse line formed in a fuse line region to form a conductive pattern; wherein the conductive pattern has an empty space in the center thereof and a phase change material pattern in the empty space, and an insulation pattern formed over the fuse line to expose the phase change material pattern. | 02-12-2009 |
Jeong-Kyu Kim, Sungnam-Si KR
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20150177248 | USE OF SIRT7 AS NOVEL CANCER THERAPY TARGET AND METHOD FOR TREATING CANCER USING THE SAME - The present invention relates to the use of SIRT7 (sirtuin 7) as a marker for diagnosis of liver cancer. More specifically, the invention relates to a liver cancer diagnostic marker comprising SIRT7 gene, a liver cancer diagnostic composition, kit and microarray comprising the same, and a method of diagnosing liver cancer using the same. The invention also relates to a method for screening a substance capable of preventing or treating liver cancer by inhibiting the expression of SIRT7 gene or protein, and to a composition for preventing or treating liver cancer, which comprises the substance. The expression level of SIRT7 gene is higher in liver cancer tissue or cells than in non-liver cancer tissue or cells. Thus, when SIRT7 gene is used as a cancer diagnostic marker, cancer can be early diagnosed and predicted in a rapid and accurate manner, and it can be used as a target for development of an agent for preventing or treating cancer. Moreover, the invention is based on the finding that the expression of SIRT7 gene is indicative of the development and proliferation of cancer cells, and cell cycle transition, and thus the invention relates to the use of SIRT7 gene as a cancer diagnostic marker and to the anticancer use of inhibition of SIRT7 expression. In addition, the invention is based on the relationship between the SIRT7 expression and a specific miRNA, and thus relates to the use of the specific miRNA to regulate the cell cycle and inhibit tumor growth. | 06-25-2015 |
Jeong-Kyu Kim, Hwaseong-Si KR
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20110212613 | SEMICONDUCTOR DEVICES HAVING A FUSE AND METHODS OF CUTTING A FUSE - A semiconductor device and methods of cutting a fuse of a semiconductor device are provided, the semiconductor device includes a semiconductor substrate that includes a fuse region, a plurality of fuse patterns disposed in the fuse region of the semiconductor substrate, and an insulating layer that insulates the fuse patterns from the semiconductor substrate. The fuse patterns each include a fuse. The fuse patterns are linked to the semiconductor substrate. | 09-01-2011 |
Jeong-Kyu Kim, Seoul KR
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20100226843 | METHOD FOR PREPARING CERIUM CARBONATE AND METHOD FOR PREPARING CERIUM OXIDE POWDER - The present invention relates to a method for preparing cerium carbonate that can improve yield and productivity of cerium carbonate, cerium carbonate powder, and a method for preparing cerium oxide using the same. The method for preparing cerium carbonate comprises the steps of mixing a cerium precursor and urea; and, elevating the temperature of the mixture to 50˜250° C. under solvent free condition to react the cerium precursor and urea. | 09-09-2010 |
Jeong-Kyu Lee, Incheon KR
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20140073125 | METHOD OF MANUFACTURING FOR SEMICONDUCTOR DEVICE USING EXPANDABLE MATERIAL - A semiconductor device is manufactured using an expandable material. The method includes forming a first gate insulating layer on a substrate, forming first and second gate structures on the first gate insulating layer, the first and second gate structures being spaced apart from each other at a distance, forming an expandable material on sidewalls and upper surfaces of the first and second gate structures, forming a gap-fill layer on the expandable material between the first and second gate structures, and performing a heat-treatment process to increase the volume of the expandable material. | 03-13-2014 |