| Patent application number | Description | Published |
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| 20100244655 | TRANSPARENT ELECTRODE, CONDUCTIVE LAMINATE AND CONDUCTIVE LAYER - Disclosed is a conductive layer including photopolymerizable resin having dispersed carbon nanotubes, which is transparent with high electrical conductivity and facilitates the formation of an electrode pattern. A laminate and a transparent electrode, including the conductive layer, are also provided. | 09-30-2010 |
| 20100305298 | CONDUCTIVE MATERIAL AND MANUFACTURING METHOD THEREOF - Disclosed is a method of manufacturing a conductive coating film having superior chemical resistance or solvent resistance and durability by chemically bonding a resin having an amine group (—NH | 12-02-2010 |
| 20110143132 | PLASTIC SUBSTRATE AND DEVICE INCLUDING THE SAME - Disclosed is a plastic substrate, which includes a plastic film, a reflective and/or conductive metal layer, and a resin layer having a conductive material dispersed therein and which is useful as a lower substrate of a transmissive electronic paper display device or a display device. | 06-16-2011 |
| 20110171445 | TRANSPARENT ELECTRODE - Disclosed herein is a transparent electrode, including: a polyimide film having an average linear thermal expansion coefficient of 50.0 ppm/° C. or less, which is measured by thermo-mechanical analysis based on a film thickness of 50˜100 μm at a temperature of 50˜250° C., and a yellowness of 15 or less; and an electrode layer including a conductive material and a polyimide resin having an average linear thermal expansion coefficient of 50.0 ppm/° C. or less, which is measured by thermo-mechanical analysis based on a film thickness of 50˜100 μm at a temperature of 50˜250° C., and a yellowness of 15 or less. The transparent electrode is advantageous in that a problem of a short circuit does not occur even when apparatuses including this transparent electrode are over-heated because it has excellent heat resistance, and in that it is transparent and has high electroconductivity. | 07-14-2011 |
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| 20090090347 | Cooking apparatus and method for controlling the same - A cooking apparatus to change the direction of hot air to be fed into a cooking chamber. The cooking apparatus includes a cooking chamber, a hot-air feeder to feed hot air into the cooking chamber, and an air-direction regulator to change a direction of the hot air fed from the hot-air feeder. | 04-09-2009 |
| 20090249639 | Dryer and method of controlling cleaning operation thereof - Disclosed herein are a dryer and a method of controlling a cleaning operation thereof that are capable of supplying moisture into a drying chamber of the dryer to wet contaminants in the drying chamber and blowing air to the wetted contaminants to remove the contaminants. The method includes supplying moisture into a drying chamber to wet contaminants in the drying chamber and removing the contaminants wetted by the moisture. | 10-08-2009 |
| 20090254220 | Refrigerator and control method thereof - A refrigerator capable of supercooling a target object and a control method thereof are provided. The refrigerator includes a temperature sensor which senses a temperature of the target object in the cooling compartment, wherein the temperature sensor is prevented from being in contact with ambient cool air and is installed on a bottom surface on which the target object is placed so as to sense only the temperature of the target object. Further, the control method includes sensing a temperature of the target object at each interval of a specified time Δt, calculating a difference between two temperatures sensed at specified time intervals, and comparing the difference between two temperatures with a predetermined reference value ΔTc to determine the supercooled state of the target object. | 10-08-2009 |
| 20090314012 | Refrigerator with supercooled beverage dispenser and method for controlling the same - A refrigerator that allows a user to receive supercooled beverage through a dispenser in the refrigerator door. The refrigerator includes a main body having a compartment and a door opening and closing the compartment, a supercooling compartment in the main body to supercool a beverage, and a dispenser in the door to dispense supercooled liquid from the supercooling compartment without opening the door. A supercooled liquid tank is detachably installed in the supercooling compartment to supercool beverage. The supercooling compartment is installed in the rear side of the door such that a supercooling compartment door may be installed in the front side of the door to open and close the supercooling compartment in front of the door. | 12-24-2009 |
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| 20080292493 | Quaternary Pb-free solder composition incorporating Sn-Ag-Cu-In - Provided is a quaternary Pb-free solder composition incorporating Sn—Ag—Cu—In, which can prevent a cost increase and sufficiently ensure proccessability and mechanical property as a solder material. To this end, indium (In) with appropriate amount is added into the Pb-free solder composition, and the addition amount of Ag is optimized, thus preventing a decrease in wettability caused by a decrease in the amount of Ag and improving resistance to a thermal cycling and a mechanical impact. The quaternary Pb-free solder composition includes silver (Ag) of about 0.3 wt. % or more, and less than about 2.5 wt. %, copper (Cu) of about 0.2 wt. % or more, and less than about 2.0 wt. %, indium (In) of about 0.2 wt. % or more, and less than about 1.0 wt. % or less, and a balance of tin (Sn). | 11-27-2008 |
| 20090244311 | MOBILE TERMINAL AND METHOD OF CONTROLLING THE MOBILE TERMINAL - A mobile terminal and a method of controlling a mobile terminal are provided. The method includes displaying a camera preview image; detecting a face area from the camera preview image; if a button for capturing an image is manipulated, correcting an image captured by a camera using the detected face area and displaying the corrected captured image; and storing the corrected captured image. | 10-01-2009 |
| 20120034776 | DEVICE OF FILLING METAL IN THROUGH-VIA-HOLE OF SEMICONDUCTOR WAFER AND METHOD USING THE SAME - A device of filling metal in a through-via-hole formed in a semiconductor wafer and a method of filling metal in a through-via-hole using the same are disclosed. A device of filling metal in a through-via-hole formed in a semiconductor wafer includes a jig base comprising a jig configured to fix the wafer having the through-via-hole formed therein; a upper chamber 120 installed on the jig base; a lower chamber installed under the jig base; a heater installed in the upper chamber, the heater configured to apply heat to filling metal placed on the wafer to melt the filling metal; and a vacuum pump configured to generate pressure difference between the upper chamber and the lower chamber by the pressure of the lower chamber reduced by discharging air of the lower chamber 130 outside, only to fill the melted filling metal in the through-via-hole. | 02-09-2012 |
