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Jeong, Cheonan-Si
Hyeck-Jin Jeong, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090174078 | Semiconductor device and method of manufacturing the same - Provided is a semiconductor device and method of manufacturing the same. The semiconductor device may include a base material and a compound layer on the base material including a mixture of a non-adhesive organic material and a non-oxidizing metal material. | 07-09-2009 |
Jae-Jeong Jeong, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090071112 | Unit for Eliminating Particles and Apparatus for Transferring a Substrate Having the Same - In an apparatus for transferring a substrate, a partition wall is disposed in a vertical direction in a housing to divide an interior space of the housing into a first space and a second space. A pressure generating member divides the first space into an upper space and a lower space and moves in a vertical direction in the first space such that a positive pressure and a negative pressure are alternately generated in the upper space and the lower space. A substrate supporting member is movably disposed in the second space to support and to transfer the substrate. A plurality of gates is disposed on a side wall of the housing and the partition wall, and is opened and closed by the positive pressure and the negative pressure such that the particles are eliminated from the second space to an exterior space via the first space. | 03-19-2009 |
| 20090071504 | APPARATUS AND METHOD OF GENERATING ULTRASONIC VIBRATION AND APPARATUS AND METHOD OF CLEANING A WAFER USING THE SAME - In an apparatus and method of generating an ultrasonic vibration, an ultrasonic vibration generated in an ultrasonic vibration generator is transmitted through a material layer to control the intensity and the direction of the ultrasonic vibration. In an apparatus and method of cleaning a wafer, a cleaning solution supplier supplies a cleaning solution for cleaning the wafer onto the wafer. An ultrasonic vibration generator generates an ultrasonic vibration. The ultrasonic vibration is transmitted through a material layer of a transmission member to control the intensity and the direction of the ultrasonic vibration. The ultrasonic vibration is applied to the cleaning solution. | 03-19-2009 |
Jae-Seok Jeong, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090146925 | ADDRESS DATA PROCESSING DEVICE AND METHOD FOR PLASMA DISPLAY PANEL, AND RECORDING MEDIUM FOR STORING THE METHOD - A PDP address data processor, a method thereof, and a recording medium for storing a program used to perform the method. The address data processor generates subfield data corresponding to RGB input video data, divides them into two sets of subfield data, and stores them in a frame memory using rising and falling edges of a reference clock signal of a frame memory. The address data processor reads and arranges the stored subfield data using the rising and falling edges to generate address data for representing gray on the PDP. The address data processor uses an RGB mixing algorithm for selecting two different video data from among the RGB input video data to select video data, and generates the subfield data corresponding to the selected video data. | 06-11-2009 |
Kikwon Jeong, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100112787 | Method of manufacturing semiconductor device - A method of manufacturing a semiconductor device includes preparing a substrate having a front surface where a circuit pattern is formed and a back surface opposite to the front surface, reading information of the circuit pattern formed at the front surface of the substrate over the back surface through the substrate by an image pickup member, forming a cutting part at the back surface of the substrate, grinding the back surface to form a portion of the cutting part as a dicing line, attaching an expanding tape to the back surface where the dicing line is formed, and expanding the expanding tape to separate the substrate into a plurality of chips along the dicing line. | 05-06-2010 |
| 20110097430 | Apparatuses and Methods for Fabricating Semiconductor Packages - An apparatus for fabricating a semiconductor package may include a mold and a molding plate. The mold may define a mold cavity with the mold being configured to receive a circuit board in the mold cavity, and the circuit board may include a semiconductor chip mounted thereon. A molding plate may be moveable in the mold cavity with the molding plate being configured to adjust a volume of the mold cavity. Related methods are also discussed. | 04-28-2011 |
Ki-Kwon Jeong, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090127314 | IN-LINE PACKAGE APPARATUSES AND METHODS - An in-line package apparatus includes a first treating unit, an input storage unit, a heating unit and an output storage unit. The first treating unit performs a ball attach process or a chip mount process. A processing object that a process is completed in the first treating unit is received in a magazine so as to be vertically stacked and a plurality of magazines each having one or more processing objects is stored in an input stacker. The heating unit performs a reflow process on the processing objects in the magazine stored in the input stacker by an induction heating method. A processing object that a reflow process is completed is received in a magazine and then stored in an output stacker. | 05-21-2009 |
| 20090141275 | ALIGNMENT INSPECTION METHOD AND ALIGNMENT INSPECTION APPARATUS - A method of inspecting the alignment of a second structure with respect to a first structure, including emitting light from a first plane of a first structure to a second plane of a second structure in a first direction perpendicular to the first plane of the first structure, the first plane and the second plane facing each other. The incident light can be reflected from the second plane toward the first plane in a second direction parallel with the first direction. The position of the reflected light can be detected to inspect the alignment of the second structure with respect to the first structure. | 06-04-2009 |
| 20090310137 | METHOD FOR ALIGNING WAFER AND ALIGNMENT APPARATUS USING THE METHOD - A method of aligning a wafer includes recognizing images of the wafer accommodated on a work table and a notch of the wafer using a camera, designating at least one notch point of the notch in a recognized image, producing at least one reference line using the designated notch point in the recognized image, designating a center point of the reference line in the recognized image, producing an imaginary line having an angle with respect to the reference line from the center point of the reference line in the recognized image, producing a center line of the wafer using the imaginary line in the recognized image, and aligning the wafer using an alignment apparatus to allow the center line of the wafer and an alignment line of the work table to be matched. | 12-17-2009 |
| 20090321432 | Apparatus for Processing a Wafer - An apparatus for processing a wafer includes a chamber, a boat, microwave generators and reflective plates. The boat is disposed in the chamber. One or more wafers are stacked in the boat. One or more microwave generators are connected to the chamber. The microwave generators generate microwaves for heating the wafers. The reflective plates reflect the microwaves onto the wafers such that the microwaves are uniformly applied to the wafers. Each of the reflective plates faces at least one of both sides of the wafer. The reflective plates include at least one of a fat side, a concave side and a convex side. | 12-31-2009 |
Kwang-Jin Jeong, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20110170034 | BACKLIGHT UNIT AND LIQUID CRYSTAL DISPLAY HAVING THE SAME - Provided is a backlight unit within a liquid crystal display (LCD) device where the backlight unit includes one or more light-emitting diodes (LEDs) mounted on a printed circuit board (PCB). Positioning of the PCB and its LEDs is provided by a PCB fixing member which includes a base portion and a support portion extending upward from a surface of the base portion. The PCB fixing member is structured to transfer heat energy away from the PCB and to an attached portion of the LCD device such as to a lower housing which houses the PCB and the PCB fixing member. The PCB fixing member includes a press-fit insertion groove into which at least part of the PCB can be easily inserted, thus simplifying manufacturing while assuring appropriate heat dissipation. | 07-14-2011 |
Sang-Ki Jeong, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100053590 | SYSTEM AND METHOD FOR MANUFACTURING A FLAT PANEL DISPLAY - A method for manufacturing a flat panel display is presented. The method includes: transferring a first mask from a first mask loading/unloading part onto a main mask-stage by a first mask-transferer; transferring a second mask from a second mask loading/unloading part onto a second assistant mask-stage by a second mask-transferer; performing an exposure process for a predetermined time by the first mask on the main mask-stage; transferring the first mask from the main mask-stage onto the first assistant mask-stage, and transferring a second mask from the second assistant mask-stage onto the main mask-stage, after completing the exposure process for predetermined time; and performing an exposure process using the second mask on the main mask-stage for a predetermined time. | 03-04-2010 |
Seok-Won Jeong, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090134510 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME, AND ELECTRONIC DEVICE USING THE SEMICONDUCTOR PACKAGE - A semiconductor package and method of fabricating the same. The semiconductor package includes a first semiconductor package, a second semiconductor package stacked on the first semiconductor package, and a first electrical connector interposed between the first and second semiconductor packages to electrically connect the first and second semiconductor packages. | 05-28-2009 |
Wook Jeong, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20110061400 | HEAT EXCHANGER HAVING THERMOELECTRIC ELEMENT - A heat exchanger may include a housing including an intake port through which air is introduced into the housing from outside, a seat inlet supplying air to a vehicle seat, and an exhaust port through which a portion of the air introduced from outside is exhausted from the housing to outside, a blower unit mounted inside the housing and operated by a first motor to supply the air introduced into the housing through the intake port, out of the housing through the seat inlet, and a thermoelectric element disposed between the intake port and the seat inlet and heat-controlling the air introduced into the housing through the intake port. | 03-17-2011 |
| 20110061401 | HEATING AND COOLING SYSTEM FOR VEHICLE SEAT - A heating and cooling apparatus for a vehicle seat, may include a blower blowing air into a duct leading to the vehicle seat, and a thermoelectric element assembly connected to the duct and including a thermoelectric element that heats or cools air introduced toward the vehicle seat from the duct, the thermoelectric element having condensed water passages penetrating from one side to the other side thereof to allow condensed water to flow therethrough. | 03-17-2011 |
| 20110061402 | HEATING AND COOLING SYSTEM FOR VEHICLE SEAT - A heating and cooling system for a vehicle seat, may include a housing having an air supply port through which air communicates with the vehicle seat and an air exhaust hole through which air communicates with the outside of the housing, a thermoelectric element located in the housing between the air supply port and the air exhaust hole to selectively heat or cool air, which is directed toward the air supply port or the air exhaust hole, and a first blower fan provided in the air supply port to communicate air between the vehicle seat and the thermoelectric element. | 03-17-2011 |
| 20110061403 | HEATING AND COOLING SYSTEM FOR VEHICLE SEAT - A heating and cooling system for a vehicle seat, may include a heat exchanger cooling or heating air before the air is introduced into the seat, and a blower blowing air toward the heat exchanger, wherein the heat exchanger includes a positive temperature coefficient element assembly provided inside a housing of the heat exchanger to heat the air supplied from the blower, and wherein the positive temperature coefficient element assembly operates in a case of heating the seat but does not operate in a case of cooling the seat. | 03-17-2011 |
You-Hyun Jeong, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090244424 | LIQUID CRYSTAL DISPLAY, THIN FILM TRANSISTOR SUBSTRATE AND METHOD THEREOF - A liquid crystal display (“LCD”) capable of improving display quality includes a first insulating substrate, gate wiring lines formed on the first insulating substrate and extending in a first direction, pixel electrodes, each of which includes first and second sub-pixel electrodes that are, respectively, applied with different data voltages from first and second wiring lines insulated from and crossing the gate wiring lines, extending in a second direction and an insulting layer interposed between the first data wiring line and the second data wiring line overlapped by the first data wiring line. Therefore, an aperture ratio of the LCD increase because the first data wiring line overlapped the second data wiring line have less area between pixel electrodes. A display quality of the LCD improves. | 10-01-2009 |