Patent application number | Description | Published |
20130182368 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF - There is provided a multilayer ceramic electronic component including: a ceramic main body; a plurality of internal electrodes; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 μm or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a thickness direction is Tc and a thickness of the external electrodes at a point spaced apart from a central portion of a capacitance formation region in a thickness direction by a distance equal to 25% of a thickness (S) of the capacitance formation region is T | 07-18-2013 |
20130182369 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF - A multilayer ceramic electronic component includes: a ceramic main body; a plurality of internal electrodes laminated within the ceramic main body; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 μm or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a width direction is Tc and a thickness of the external electrodes at a lateral edge of a printed surface region of the internal electrodes is T | 07-18-2013 |
20140002949 | MULTILAYER CERAMIC ELECTRONIC COMPONENT | 01-02-2014 |
20140002950 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME | 01-02-2014 |
20140116766 | MULTILAYERED CHIP ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME - There is provided a multilayered chip electronic component including: a ceramic body including internal electrodes and dielectric layers; external electrodes covering both end surfaces of the ceramic body in a length direction; first plating layers forming the external electrodes and formed on outer surfaces of the ceramic body; non-conductive layers formed on outer side surfaces of the first plating layers; and second plating layers formed on regions of the first plating layers except for the non-conductive layers. | 05-01-2014 |
20140204502 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor including a ceramic body including dielectric layers, first and second internal electrodes formed within the ceramic body and disposed to face each other, having the dielectric layer interposed therebetween, first and second electrode layers disposed on outer surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively, a conductive resin layer disposed on the first and second electrode layers and containing copper powder, a nickel plating layer disposed on an outer portion of the conductive resin layer, and a copper-nickel alloy layer disposed between the conductive resin layer and the nickel plating layer and having a thickness of 1 to 10 nm. | 07-24-2014 |
20140233147 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component, including a ceramic body including dielectric layers; a plurality of internal electrodes stacked within the ceramic body, and external electrodes formed on external surfaces of the ceramic body and electrically connected to the internal electrodes, wherein the external electrodes include a metal layer and a conductive resin layer formed on the metal layer, the conducive resin layer containing a copper powder and an epoxy resin, the copper powder including a first copper powder having a content of 10 wt % or more and a particle diameter of 2 μm or greater and a second copper powder having a content of 5 wt % or more and a particle diameter of 0.7 μm or smaller, the first copper powder being a mixture of spherical powder particles and flake type powder particles. | 08-21-2014 |
20140233148 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component, including: a ceramic body having internal electrodes formed therein; external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes; and buffer layers formed on contact surfaces between the internal electrodes and the external electrodes, among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the internal electrode is denoted by Te, a number of laminated internal electrodes is denoted by N, a thickness of the buffer layer is denoted by t, and a width of a margin of the ceramic body in a length direction of the ceramic body is denoted by L, Te≦0.6 μm, N>200, and 3 μm≦t08-21-2014 | |
20140233149 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component including a ceramic body having internal electrodes formed therein, external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes, and a buffer layer formed on surfaces of contact between the internal electrodes and the external electrodes among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the external electrode is denoted by T, a thickness of the buffer layer is denoted by t, a thickness of an active region is denoted by T | 08-21-2014 |
20150014900 | COMPOSITE CONDUCTIVE POWDER, CONDUCTIVE PASTE FOR EXTERNAL ELECTRODE INCLUDING THE SAME, AND MANUFACTURING METHOD OF MULTILAYER CERAMIC CAPACITOR - There is provided a composite conductive powder including a conductive particle, and a coating layer formed on a surface of the conductive particle and including glass, wherein when a thickness of the coating layer in a portion A in which the coating layer is the thickest, on the surface of the conductive particle is defined as a, and a thickness of the coating layer in a portion B forming an angle of 90° with respect to the portion A on the surface of the conductive particle, based on a center of the conductive particle is defined as b, 0.1≦b/a≦0.7 is satisfied. | 01-15-2015 |
20150022940 | CONDUCTIVE PASTE COMPOSITION FOR EXTERNAL ELECTRODE AND MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING THE SAME - There is provided a conductive paste composition for an external electrode, the conductive paste composition including a polymer resin, spherical first conductive metal particles included in the polymer resin and being hollow in at least a portion thereof, and second conductive metal particles of a flake shape included in the polymer resin and being hollow in at least a portion thereof. | 01-22-2015 |
Patent application number | Description | Published |
20130038722 | APPARATUS AND METHOD FOR IMAGE PROCESSING - An image processing apparatus and method includes a light source that beams light toward a subject, a first camera that is spaced apart from the light source by more than a predetermined distance and senses light reflected from the subject, and a calculation unit that generates depth information based on reflected light sensed by the first camera, and corrects distortion of the depth information based on at least one of an angle of view of the first camera, a distance between the light source and the first camera, and a distance between the light source and the subject. When the camera generating the depth information and the light source are spaced apart from each other by a predetermined distance, distorted information caused by a distance difference between the light source and the camera thereby is corrected. | 02-14-2013 |
20130052875 | CONNECTOR AND CONNECTOR MODULE, AND ELECTRONIC APPARATUS HAVING THE SAME - There are provided a connector and a connector module which may commonly use mutually different interface schemes, and an electronic apparatus having the same. The connector includes a body having a fixed volume; and at least one coupling hole formed inwardly in a side of the body, and electrically coupled with a pin from the outside, wherein the coupling hole includes a first coupling unit having a predetermined first depth and electrically coupled with the pin from the outside, and a second coupling unit having a second depth deeper than the first depth and electrically coupled with another pin from the outside. | 02-28-2013 |
20140055569 | APPARATUS AND METHOD FOR SENSING DROWSY DRIVING - There are provided an apparatus and a method for sensing drowsy driving, the apparatus for sensing drowsy driving including: a light source irradiating light on a driver; first cameras sensing light reflected from the driver to image eyes of the driver; a second camera disposed to be spaced apart from the first cameras by a predetermined distance and sensing the light reflected from the driver to image a face of the driver; and a calculating unit generating depth information from the light sensed by the second camera to recognize the face of the driver as a three-dimensional stereoscopic image and determining whether the driver is driving while drowsy from whether the eyes of the driver imaged by the first camera are opened or closed and a position of the face of the driver imaged by the second camera. | 02-27-2014 |
Patent application number | Description | Published |
20120147523 | METHOD OF MANUFACTURING PEROVSKITE POWDER, PEROVSKITE POWDER MANUFACTURED BY THE SAME AND MULTILAYER CERAMIC ELECTRONIC COMPONENT - There are provided a method of manufacturing perovskite powder, and perovskite powder and a multilayer ceramic electronic component manufactured thereof. The manufacturing method includes: washing metal oxide hydrate to remove impurities therefrom; adding pure water and an acid or a base to the metal oxide hydrate to prepare a metal oxide sol; mixing the metal oxide sol with a metal salt to form perovskite particle nuclei; and conducting grain growth of the perovskite particle nuclei by hydrothermal treatment to produce perovskite powder. The method of manufacturing perovskite powder and the perovskite powder manufactured by the same have advantages such as excellent crystallinity, reduced generation of fine powder, and favorable dispersion properties. | 06-14-2012 |
20120225292 | METHOD OF MANUFACTURING CERAMIC POWDER HAVING PEROVSKITE STRUCTURE AND CERAMIC POWDER HAVING PEROVSKITE STRUCTURE MANUFACTURED USING THE SAME - There are provided a method of manufacturing a ceramic powder having a perovskite structure and a ceramic powder having a perovskite structure manufactured by the same. The method includes: mixing a compound of an element corresponding to site A in an ABO | 09-06-2012 |
20130062578 | DIELECTRIC COMPOSITION, METHOD OF FABRICATING THE SAME, AND MULTILAYER CERAMIC ELECTRONIC COMPONENT USING THE SAME - There are provided a dielectric composition, a method of fabricating the same, and a multilayer ceramic electronic component using the same. The dielectric composition includes a perovskite powder particle having a surface on which a doping layer is formed, the doping layer being doped with at least one material selected from a group consisting of alkaline earth elements and boron group elements, and rare earth elements. | 03-14-2013 |
20130148257 | METHOD OF MANUFACTURING PEROVSKITE POWDER, PEROVSKITE POWDER MANUFACTURED BY THE SAME AND MULTILAYER CERAMIC ELECTRONIC COMPONENT - There are provided a method of manufacturing perovskite powder, and perovskite powder and a multilayer ceramic electronic component manufactured thereof. The manufacturing method includes: washing metal oxide hydrate to remove impurities therefrom; adding pure water and an acid or a base to the metal oxide hydrate to prepare a metal oxide sol; mixing the metal oxide sol with a metal salt to form perovskite particle nuclei; and conducting grain growth of the perovskite particle nuclei by hydrothermal treatment to produce perovskite powder. The method of manufacturing perovskite powder and the perovskite powder manufactured by the same have advantages such as excellent crystallinity, reduced generation of fine powder, and favorable dispersion properties. | 06-13-2013 |
20140005029 | METHOD OF MANUFACTURING PEROVSKITE POWDER, PEROVSKITE POWDER MANUFACTURED BY THE SAME AND MULTILAYER CERAMIC ELECTRONIC COMPONENT | 01-02-2014 |
20140065308 | DIELECTRIC COMPOSITION, METHOD OF FABRICATING THE SAME, AND MULTILAYER CERAMIC ELECTRONIC COMPONENT USING THE SAME - There are provided a dielectric composition, a method of fabricating the same, and a multilayer ceeramic electronic component using the same. The dielectric composition includes a perovskite powder particle having a surface on which a doping layer is formed, the doping layer being doped with at least one material selected from a group consisting of alkaline earth elements and boron group elements, and rare earth elements. | 03-06-2014 |
20140322537 | METHOD OF MANUFACTURING CERAMIC POWDER HAVING PEROVSKITE STRUCTURE AND CERAMIC POWDER HAVING PEROVSKITE STRUCTURE MANUFACTURED USING THE SAME - There are provided a method of manufacturing a ceramic powder having a perovskite structure and a ceramic powder having a perovskite structure manufactured by the same. The method includes: mixing a compound of an element corresponding to site A in an ABO | 10-30-2014 |
20150083978 | COMPOSITE PEROVSKITE POWDER, PREPARATION METHOD THEREOF, AND PASTE COMPOSITION FOR INTERNAL ELECTRODE HAVING THE SAME - There are provided a composite perovskite powder, a preparation method thereof, and a paste composition for an internal electrode having the same, the composite perovskite powder capable of preventing ions from being eluted from an aqueous system at the time of synthesis while being ultra-atomized, such that when the composite perovskite powder is used as an inhibitor powder for an internal electrode, sintering properties of the internal electrode may be deteriorated, and sintering properties of a dielectric material may be increased; accordingly, connectivity of the internal electrode may be improved, and permittivity and reliability of a multilayer ceramic capacitor (MLCC) may be increased. | 03-26-2015 |
Patent application number | Description | Published |
20120293948 | BASE FOR HARD DISK DRIVE AND HARD DISK DRIVE HAVING THE SAME - Disclosed herein is a base for a hard disk drive, including: a base plate; and a side joining part formed on one side of the base plate, the side joining part including a joining hole for screw fastening, wherein the side joining part includes: a joining side spaced apart from one side of the base plate and provided with the joining hole; and side wall surfaces formed by bending both side ends of the joining side. In accordance with a preferred embodiment of the present invention, rigidity of the base can be increased by bending both side ends of the joining side of the side joining part of the base plate. | 11-22-2012 |
20140022669 | BASE FOR HARD DISK DRIVE, METHOD OF MANUFACTURING THE SAME AND HARD DISK DRIVE HAVING THE SAME - Disclosed herein is a base for a hard disk drive including: a base plate formed with a motor seating part; and at least one through hole formed along an outer circumference of a seating part of the base plate and formed to axially receive a coil winding part of a stator assembly of the motor, wherein the through hole is configured of a first through groove corresponding to the coil winding part and a second through groove extending from the first through groove and formed so that a radial forming width of the second through groove from a center of the seating part is narrower than that of the first through groove. According to the preferred embodiment of the present invention, it is possible to improve and maintain the rigidity of the base while avoiding the coil winding part by structurally changing the through hole of the base. | 01-23-2014 |
20140185163 | BASE PLATE, AND METHOD OF MANUFACTURING THE SAME AND DISK DRIVE INCLUDING THE SAME - There is provided a base plate including a body part formed of a metal plate, a pocket part including a recess formed in one surface of the body part by decreasing a thickness of the body part, a center plate part forming the pocket part and corresponding to the recess, a pocket periphery part forming the body part in a periphery of the pocket part, and a pocket edge part formed between the pocket periphery part and the center plate part and having a thickness different from that of the center plate part, wherein a height from a bottom surface of the body part to a top surface of the center plate part is identical to a height of the pocket periphery part, and a thickness of the pocket periphery part is greater than a thickness of the center plate part. | 07-03-2014 |
20140233133 | SPINDLE MOTOR AND RECORDING DISK DRIVING DEVICE HAVING THE SAME - There is provided a spindle motor including a base member formed by firing processing a steel plate and provided with a cylindrical installation part, a shaft support part including a sleeve insertedly disposed in the installation part, a shaft rotatably supported by the shaft support part, a rotor hub fixed to an upper end of the shaft and provided with a driving magnet, and a stator core installation member disposed on the base member so as to be disposed outwardly of the installation part in a radial direction and having a stator core, wherein the stator core installation member includes a body part, an installation wall part extending from an upper surface of the body part and a support part, and the rotor hub is provided with an extending wall extending from a bottom surface thereof to form a labyrinth seal with the installation wall part. | 08-21-2014 |
Patent application number | Description | Published |
20130284505 | ADHESIVE MEMBER FOR MANUFACTURING PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are an adhesive member for manufacturing a printed circuit board, a printed circuit board, and a method of manufacturing the same. The printed circuit board includes a base substrate, an insulating layer formed on the base substrate, a primer layer formed on the insulating layer, and a circuit layer formed on the primer layer. | 10-31-2013 |
20140066544 | INSULATING COMPOSITION FOR MULTILAYER PRINTED CIRCUIT BOARD - The present invention relates to an interlayer insulating composition for a multilayer printed wiring board including: an epoxy resin including a naphthalene-modified epoxy resin, a cresol novolac epoxy resin, and a rubber-modified epoxy resin; a thermoplastic resin; a curing agent; and an inorganic filler and a multilayer printed wiring board including the same as an insulating layer. The present invention can provide an insulating composition excellent in adhesion between an insulating layer and a Cu layer to secure normal operation and reliability of a final substrate. Further, since the present invention properly includes an epoxy resin and a thermoplastic resin regardless of an increase in the content of an inorganic filler, it is possible to secure the reliability of the substrate by preventing an insulating film from being brittle and improving toughness of the insulating film while maintaining a low thermal expansion rate. | 03-06-2014 |
20140118832 | TOUCHSCREEN PANEL - There is provided a touchscreen panel, including: a transparent substrate including a first area having a first surface roughness and a second area having a second surface roughness; and an ink layer formed on the second area, wherein the degree of second surface roughness is higher than the degree of first surface roughness. | 05-01-2014 |
20140145973 | TOUCH SCREEN MODULE AND METHOD OF MANUFACTURING THE SAME - There is provided a touch screen module including a glass substrate, a first photosensitive resin layer formed on the glass substrate and a bezel including a second photosensitive resin layer formed on the first photosensitive resin layer, and transparent electrodes simultaneously formed on both the glass substrate and the bezel. A residue phenomenon in which pigment particles included in the bezel remain on a surface of the glass substrate after exposure and development may be prevented. | 05-29-2014 |
20140176823 | TOUCH PANEL - Disclosed herein is a touch panel, including: a transparent substrate divided into an active area and a non-active area, which is an outer region of the active area; electrodes formed on one surface of the transparent substrate; and a bezel formed in the non-active area of one surface of the transparent substrate, wherein the bezel is formed of a bezel composition containing silane and a pigment. | 06-26-2014 |
20140186592 | PHOTO-SENSITIVE RESIN COMPOSITION FOR BEZEL OF TOUCH SCREEN MODULE AND BEZEL FOR TOUCH SCREEN MODULE USING THE SAME - This invention relates to a photo-sensitive resin composition for a bezel of a touch screen module, including a colorant composed of surface-modified TiO | 07-03-2014 |
20150015802 | TOUCH SENSOR - Disclosed herein is a touch sensor including: a window substrate; bezels formed along an edge of the window substrate; a first insulating layer stacked while being filled between the bezels to be formed on the window substrate; a second insulating layer applied or adhered onto the bezel and the first insulating layer; and an electrode pattern formed on the second insulating layer. | 01-15-2015 |
Patent application number | Description | Published |
20100244713 | ILLUMINATION APPARATUS USING LIGHT EMITTING DIODE - An illumination apparatus using a light emitting diode is directly driven by an alternating current (AC) power source, displays colors and simultaneously controls a color's brightness level. The illumination apparatus includes a power terminal unit to which an AC power source is applied; a variable current unit connected to one end of the power terminal unit, dividing current provided from the power terminal unit into a plurality of current levels, and including first, second and third variable current units controlling the plurality of divided current levels, respectively; and a light emitting unit including red, green, and blue light emitting units, respectively disposed between the first variable current unit and the other end of the power terminal unit, between the second variable current unit and the other end of the power terminal unit, and between the third variable current unit and the other end of the power terminal unit. | 09-30-2010 |
20110233520 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - There is provided a semiconductor device including a base substrate; a semiconductor layer formed on the base substrate and having a mesa protrusion including a receiving groove; a source electrode and a drain electrode disposed to be spaced apart from each other on the semiconductor layer, the source electrode having a source leg and the drain electrode having a drain leg; and a gate electrode insulated from the source electrode and the drain electrode and having a recess part received into the receiving groove. The mesa protrusion has a superlattice structure including at least one trench at an interface between the mesa protrusion and the source electrode and between the mesa protrusion and the drain electrode, respectively, and the source leg and the drain leg are received in the trench. | 09-29-2011 |
20110233612 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - There is provided a semiconductor device having a High Electron Mobility Transistor (HEMT) structure allowing for enhanced performance and a method of manufacturing the same. The semiconductor device includes a base substrate; a semiconductor layer provided on the base substrate; a source electrode, a gate electrode and a drain electrode provided on the semiconductor layer to be spaced apart from one another; and an ohmic-contact layer partially provided at an interface between the drain electrode and the semiconductor layer. | 09-29-2011 |
20110233613 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - There are provided a semiconductor device and a method for manufacturing the same. The semiconductor device according to the present invention includes a base substrate; a semiconductor layer that includes a receiving groove and a protrusion part formed on the base substrate, a first carrier injection layer and at least two insulating layers formed to traverse the first carrier injection layer formed in the semiconductor layer, and a second carrier injection layer spaced apart from the first carrier injection layer formed on the protrusion part; a source electrode and a drain electrode that are disposed to be spaced apart from each other on the semiconductor layer; and a gate electrode that is insulated from the source electrode and the drain electrode and has a recess part recessed into the receiving groove, wherein the lowest end portion of the receiving groove contacts the uppermost layer of the first carrier injection layer and the insulating pattern disposed at the innermost side of the semiconductor layer among the insulating patterns traverses the entire layer forming the first carrier injection layer and is disposed at the outer side of both side end portions in the thickness direction of the receiving groove. | 09-29-2011 |
20110233623 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - There is provided a semiconductor device and a method of manufacturing the same. The semiconductor device includes a base substrate; a semiconductor layer having a receiving groove, a protrusion part, a first carrier injection layer, at least two insulating patterns, and a second carrier injection layer provided on the base substrate, the insulating patterns being disposed to traverse the first carrier injection layer and the second carrier injection layer being spaced apart from the first carrier injection layer and disposed on a lower portion of the protrusion part; a source electrode and a drain electrode disposed to be spaced apart from each other on the semiconductor layer; and a gate electrode insulated from the source electrode and the drain electrode and having a recess part recessed into the receiving groove, wherein a lowest portion of the receiving groove contacts an uppermost layer of the first carrier injection layer or is disposed above the uppermost layer thereof, and an insulating pattern, disposed at an innermost portion of the semiconductor layer among the insulating patterns, traverses the first carrier injection layer and is disposed at the outside of both sides of the receiving groove in a thickness direction thereof. | 09-29-2011 |
20130143373 | METHOD OF MANUFACTURING NITRIDE SEMICONDUCTOR DEVICE - A method of manufacturing a nitride semiconductor device including: forming a nitride semiconductor layer over a substrate wherein the nitride semiconductor layer has a 2DEG channel inside; forming a drain electrode in ohmic contact with the nitride semiconductor layer and a source electrode spaced apart from the drain electrode, in Schottky contact with the nitride semiconductor layer, wherein the source electrode has an ohmic pattern in ohmic contact with the nitride semiconductor layer inside; forming a dielectric layer on the nitride semiconductor layer between the drain electrode and the source electrode and on at least a portion of the source electrode; and forming a gate electrode on the dielectric layer to be spaced apart from the drain electrode, wherein a portion of the gate electrode is formed on the dielectric layer over a drain-side edge portion of the source electrode. | 06-06-2013 |
20130146983 | NITRIDE BASED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - Disclosed herein is a nitride based semiconductor device, including: a substrate; a nitride based semiconductor layer having a lower nitride based semiconductor layer and an upper nitride based semiconductor layer on the substrate; an isolation area including an interface between the lower nitride based semiconductor layer and the upper nitride based semiconductor layer; and drain electrodes, source electrode, and gate electrodes formed on the upper nitride based semiconductor layer. | 06-13-2013 |
Patent application number | Description | Published |
20130078496 | HIGH VOLTAGE BATTERY PACK APPARATUS FOR VEHICLE - Disclosed is a high voltage battery pack apparatus for a vehicle which includes a cooling device having first and second battery packs which are installed in a center console of the vehicle. The first and second battery packs may be uniformly cooled through a distribution duct to improve cooling performance which minimizes the number of cooling fans that are used. Since the number of cooling fans is minimized and a discharging duct is not used, weight reduction and cost savings can be achieved. | 03-28-2013 |
20130099752 | BATTERY SYSTEM FOR PROTECTING BATTERY MANAGEMENT SYSTEM FROM ELECTROMAGNETIC WAVES - Disclosed is a system for protecting a BMS from electromagnetic waves, and more particularly, to a system for protecting a BMS from electromagnetic waves to prevent voltage sensing errors due to the electromagnetic waves generated by current from a battery cell. The system includes: a battery having a plurality of battery cells; a power relay assembly intermittently charging and discharging the battery; a battery management system (BMS) connected to the battery cell via a voltage sensing wire to predict a battery's SOC; and a housing surrounding the battery and the power relay assembly with one side of the outside of the housing having a separate section for therein for receiving the BMS so as to partition the BMS and the battery in different spaces. | 04-25-2013 |
20130122796 | INSIDE VENTILATION TECHNIQUE FOR VEHICLE - Disclosed is an inside ventilation system of a vehicle for a driver or an occupant to achieve a more comfortable inside environment in the summer or winter. The inside ventilation system includes a control unit configured to receive an operating signal from a smart key, sense an inside temperature of the vehicle when the operating signal is transferred and judging whether the inside temperature is deviated from a required temperature range; a comparison process of comparing the inside temperature and a battery temperature when the inside temperature is deviated from the required temperature range; and a control process of controlling heating, ventilation, and air conditioning (HVAC) and an operation of a battery operated fan by comparing the inside temperature and the battery temperature. | 05-16-2013 |
20130140101 | BATTERY PACK MOUNTING STRUCTURE OF VEHICLE - Disclosed is battery pack mounting structure for a high capacity battery in a vehicle. More specifically, a battery pack that includes a plurality of modules is mounted lengthwise in a center console installation space between a driver seat and a passenger seat. A cooling air providing means is configured to supply cooling air to a front protion of the battery pack, and a cooling air distributing means is configured to distribute the cooling air provided by the cooling air providing means to each of a plurality of battery modules individually. Finally, a discharge duct means is configured to receive cooling air that has already passed over each of the individual battery modules and discharge the cooling air through a rear portion of the battery pack to outside of a vehicle body. | 06-06-2013 |
20140023892 | BATTERY COOLING DUCT - Disclosed herein is a battery cooling duct. The duct includes a suction portion disposed between a rear seat and a floor panel of a vehicle, an inlet of the suction portion fluidly communicating with an interior of the vehicle to suction interior air. An extension portion is formed by extending an outlet side of the suction portion to a rear of the vehicle, e.g. a trunk, between the rear seat and the floor panel, and defines a passageway configured to allow the interior air to pass therethrough. A discharge portion extends from an outlet of the extension portion to the rear of the vehicle, and discharges the interior air passed through the extension portion, through an outlet of the discharge portion to the battery of the vehicle. | 01-23-2014 |
20140030565 | BATTERY PACK FOR VEHICLE - Disclosed is a battery pack for a vehicle, including: a case configured to receive a battery. The case includes a recessed lower surface forming an air passage to allow air to flow from one side of a lower surface of the case to another side to cool the battery there above. A passage guide is formed by a cover coupled to a side surface of the case to form an air duct. The air duct extends at least from an upper end side to a lower end side of the case and a lower end of the air duct is connected to an inlet portion of the air passage formed on a lower surface of the case. | 01-30-2014 |