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Jeon, Cheonan-Si
Jae-Yong Jeon, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20110316195 | INJECTION MOLD FOR INTAKE HOSE AND INTAKE HOSE PRODUCTION METHOD USING THE SAME - An injection mold for an intake hose and an intake hose production method utilizes a main core removably dualized to automatically extract a molding-completed intake hose from the main core after injection molding is completed and an air supplying member supplying compressed air between the main core and the molding-completed intake hose is configured in the main core to automatically extract the intake hose from the main core without an additional extraction equipment, thereby reducing an entire manufacturing process and saving a manufacturing cost. | 12-29-2011 |
Jongkeun Jeon, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100117181 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - Provided are a semiconductor package and a method of manufacturing the same. The semiconductor package includes a semiconductor chip, a transparent substrate, an adhesive pattern, and at least one dew-proofer. The semiconductor includes a pixel area. The transparent substrate is disposed on the semiconductor chip. The adhesive pattern is disposed between the semiconductor chip and the transparent substrate and provides a space on the pixel area. At least one dew-proofer is disposed between the semiconductor chip and the transparent substrate and spaced from the adhesive pattern. | 05-13-2010 |
Jong-Keun Jeon, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20080251949 | Molding apparatus, molded semiconductor package using multi-layered film, fabricating and molding method for fabricating the same - Example embodiments include molding apparatuses, semiconductor packages, a fabricating methods for fabricating the same. The molding apparatus may include a first mold die for adhering a partially completed package, a second mold die including a cavity formed such that the partially completed package is positioned inside the cavity and a molding resin for encapsulating the partially completed package inserted into the cavity, and a multi-layered film supply unit for supplying a multi-layered film to the cavity of the second mold die. The semiconductor package may include a substrate, a semiconductor chip electrically connected to the substrate, a molding resin for encapsulating the semiconductor chip and an electrical portion of the substrate, and a marking film, adhered to an outer surface of the molding resin such that a mark is marked in the marking film. | 10-16-2008 |
| 20090068819 | Tape structures, and methods and apparatuses for separating a wafer using the same - Example embodiments provide tape structures including a base layer, a neutralizing layer and an adhesive layer. The base layer may support an object. The neutralizing layer may be arranged on the base layer. The neutralizing layer may be grounded to neutralize charges between the base layer and the object. The adhesive layer may be arranged on the neutralizing layer. The object may be attached to the adhesive layer. Example embodiments also provide methods of manufacturing the tape structures, methods of separating a wafer, and apparatuses for separating a wafer. | 03-12-2009 |
| 20110080516 | IMAGE SENSOR MODULE AND IMAGING DEVICE INCLUDING THE IMAGE SENSOR MODULE - An image sensor module and an imaging device. An image sensor package includes a plurality of image sensor chips for generating image signals and a lower transparent board over the image sensor chips. An upper transparent board is positioned over the lower transparent board and includes a lens for focusing an external light to the image sensor chips. An adhesion member is interposed between the upper transparent board and the lower transparent board, and thus the upper and lower transparent boards are adhered to each other by the adhesion member such that the lens and the image sensor chips are aligned with each other. A dehumidifying agent is arranged in the adhesion member to absorb moistures from an interior of the image sensor module. Accordingly, the moistures are prevented from being condensed onto the surface of the image sensor module. | 04-07-2011 |
Kyung-Ju Jeon, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100110056 | CONNECTOR, CONNECTOR ASSEMBLY, AND DISPLAY APPARATUS HAVING THE SAME - The present invention relates to a connector that includes a body and a plurality of terminals. The body extends in a first direction and includes at least one side surface coupled with an external device. The terminals include a conductive material. The terminals are arranged on the body, extend in a second direction perpendicular to the first direction, and are arranged in the first direction to receive a voltage and a control signal from the external device. At least one terminal of the terminals has a length in the second direction greater than a length of remaining terminals in the second direction, the at least one terminal to receive a ground voltage. | 05-06-2010 |
| 20110063261 | LIQUID CRYSTAL DISPLAY DEVICE INCLUDING IMPROVED CIRCUIT SUBSTRATE CONNECTION - A display device includes; a display panel including; a data line, a gate line insulated from the data line and a pixel respectively connected to the data line and the gate line, a first printed circuit board (“PCB”) which drives the display panel and is disposed adjacent to the display panel, the first PCB having a first driving circuit disposed thereon, a second PCB disposed adjacent to the first PCB and the display panel, the second PCB having a second driving circuit and a control circuit disposed thereon, wherein the second driving circuit drives the display panel and the control circuit controls the first driving circuit and the second driving circuit. | 03-17-2011 |
Myoung-Ha Jeon, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20080309597 | DRIVING APPARATUS FOR A LIQUID CRYSTAL DISPLAY AND LIQUID CRYSTAL DISPLAY INCLUDING THE SAME - The present invention is related to a driving apparatus for a liquid crystal display, and a liquid crystal display including the same. A gate-on voltage generator includes first and second resistors connected between a predetermined reference voltage and a ground voltage, a voltage follower connected to a contact between the first resistor and the second resistor, a charge pump circuit connected to an output terminal of the voltage follower, and a gate-on voltage output terminal connected to the charge pump circuit. The voltage follower is disposed in front of the charge pump circuit such that an influence due to load changes is blocked to thereby prevent an excessive increase of the gate-on voltage during a blank time. Furthermore, two resistors having the same resistance are used to divide the reference voltage such that stress on the resistors may be minimized. | 12-18-2008 |
| 20090303403 | DRIVING-VOLTAGE GENERATION APPARATUS AND LIQUID CRYSTAL DISPLAY HAVING THE SAME - A driving-voltage generation apparatus and a liquid crystal display (LCD) having the same are provided. The driving-voltage generation apparatus includes an input node coupled to an input voltage, a voltage converter configured to convert the input voltage into an output voltage and output the output voltage, and a voltage cutoff unit electrically connected between the input node and the voltage converter. The voltage cutoff unit is configured to sense the input voltage and selectively cut off the supply of the input voltage. | 12-10-2009 |