Jeon, Cheonan-Si
Bong-Chool Jeon, Cheonan-Si KR
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20150116307 | DC-DC CONVERTER, DISPLAY APPARATUS HAVING THE SAME AND METHOD OF DRIVING DISPLAY PANEL USING THE SAME - A method of differently producing driving clock signals for a shift register of a gate lines driving circuit of a Liquid Crystal Display (LCD), the method includes the steps of determining whether an ambient temperature is greater than or not in comparison to a predetermined threshold temperature; in response to the determining indicating that the ambient temperature is greater, using a first ON voltage and a first charge canceling method; and in response to the determining indicating that the ambient temperature is not greater, using a second ON voltage and a second charge canceling method, where the second ON voltage is different from the first ON voltage and where the second charge canceling method is different from the first charge canceling method. The second charge canceling method may have a shorter duration than that of the first charge canceling method. The second ON voltage may be greater than the first ON voltage. | 04-30-2015 |
Byoung Kook Jeon, Cheonan-Si KR
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20130192425 | METHOD FOR RECOVERING VALUABLE METALS FROM LITHIUM SECONDARY BATTERY WASTES - Valuable metals such as cobalt, nickel, manganese, and lithium can be economically recovered from various lithium secondary battery-related wastes by the inventive method which comprises liquid-phase leaching a scrap powder containing Co, Ni, Mn, and Li, and purifying and solvent-extracting the resulting leaching solution to recover each of said Co, Ni, Mn, and Li, wherein the liquid-phase leaching is performed by a two-step counter-current leaching using an inorganic acid solution or a mixed solution of an inorganic acid and hydrogen peroxide. | 08-01-2013 |
Byung-Cheol Jeon, Cheonan-Si KR
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20130161800 | PCB FOR MUF AND MOLDING STRUCTURE OF THE PCB - A printed circuit board (PCB) for molded underfill (MUF) and a PCB molding structure that may expand a range of applying the PCB and may resolve a problem of generation of a void during manufacturing of a semiconductor package. The PCB includes: a molding area on which a plurality of semiconductor chips are mounted and that is sealed; and a peripheral area that is formed around the molding area, contacts a mold for molding during a molding process, and includes a first side adjacent to a portion into which a molding material is injected and a second side that faces the first side that is adjacent to a portion from which air may be discharged, wherein an active area where the semiconductor chips are disposed in the molding area is disposed nearer the first side than to the second side. | 06-27-2013 |
Euy-Sik Jeon, Cheonan-Si KR
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20130273296 | VACUUM GLASS PANEL AND MANUFACTURING METHOD OF SAME - Disclosed are a vacuum glass panel and a manufacturing method of the same. The vacuum glass panel according to the present invention includes a first glass plate, a second glass plate facing the first glass plate with a vacuum space therebetween, an edge of the second glass plate being in contact with the first glass plate, and a plurality of spacers disposed between the first glass plate and the second glass plates to separate the first glass plate and the second glass plate from each other. The plurality of spacers are formed of a glass including alumina (Al | 10-17-2013 |
Hyo Young Jeon, Cheonan-Si KR
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20120213499 | HEATER BLOCK FOR A RAPID THERMAL PROCESSING APPARATUS IN WHICH A COOLING WATER FLOW IS DIVIDED INTO AN UPPER LAYER AND A LOWER LAYER - The present invention relates to a heater block for a rapid thermal processing apparatus, wherein a plurality of lamp pockets ( | 08-23-2012 |
Hyuck-Soo Jeon, Cheonan-Si KR
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20150123692 | APPARATUS AND METHOD OF TESTING AN ELECTRONIC DEVICE - An apparatus for testing an electronic device may include a field programmable gate array (FPGA), a test board, a test channel and a loop channel. The electronic device may be electrically connected to the test board. The test channel may be electrically connected between the electronic device and the FPGA via the test board. The loop channel may extend from the FPGA, may be connected to the FPGA via the test board, and may be used to test the test board. | 05-07-2015 |
Jae Seung Jeon, Cheonan-Si KR
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20140373573 | APPARATUS AND METHOD FOR MANUFACTURING 3D GLASS - An apparatus for manufacturing 3D glass, the apparatus including: a molding part for molding a glass substrate; an assembling and disassembling part for carrying-out the molded glass substrate and replacing the molded glass substrate with an other glass substrate; and a loading part for loading the molded glass substrate is disclosed. A method for manufacturing 3D glass including: carrying-in a mold including a glass substrate into a chamber of a molding part; preheating the carried-in mold; molding the glass substrate by pressing the heated mold; cooling the molded glass substrate; and carrying-out the molded glass substrate and carrying-in an other glass substrate into the mold is also disclosed. | 12-25-2014 |
Jae-Yong Jeon, Cheonan-Si KR
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20110316195 | INJECTION MOLD FOR INTAKE HOSE AND INTAKE HOSE PRODUCTION METHOD USING THE SAME - An injection mold for an intake hose and an intake hose production method utilizes a main core removably dualized to automatically extract a molding-completed intake hose from the main core after injection molding is completed and an air supplying member supplying compressed air between the main core and the molding-completed intake hose is configured in the main core to automatically extract the intake hose from the main core without an additional extraction equipment, thereby reducing an entire manufacturing process and saving a manufacturing cost. | 12-29-2011 |
Jin Young Jeon, Cheonan-Si KR
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20150062099 | DISPLAY DRIVER, METHOD FOR DRIVING DISPLAY DRIVER, AND IMAGE DISPLAY SYSTEM - A display driver includes a memory, a receiver, an image output unit, a controller, and an image mode selection unit. The memory stores a video signal. The receiver receives the video signal and a first control signal from a host processor, where the first control signal corresponds to the video signal. The image output unit processes the video signal stored in the memory and outputs the processed video signal to a display unit. The controller controls the image output unit based on an image mode to display an image corresponding to the video signal. The image mode selection unit detects the first control signal and a second control signal from the controller, and changes the image mode based on the first control signal and second control signal. | 03-05-2015 |
Jongkeun Jeon, Cheonan-Si KR
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20100117181 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - Provided are a semiconductor package and a method of manufacturing the same. The semiconductor package includes a semiconductor chip, a transparent substrate, an adhesive pattern, and at least one dew-proofer. The semiconductor includes a pixel area. The transparent substrate is disposed on the semiconductor chip. The adhesive pattern is disposed between the semiconductor chip and the transparent substrate and provides a space on the pixel area. At least one dew-proofer is disposed between the semiconductor chip and the transparent substrate and spaced from the adhesive pattern. | 05-13-2010 |
20150089801 | MOUNTING APPARATUS - A mounting apparatus is provided which includes a frame having a table, a support member disposed on the table to support a substrate, and a feeder mounted on a feeder mount unit disposed in the frame at one side of the table. The feeder provides an element to be attached to the substrate. An element value measuring unit is disposed adjacent one side of the frame and directly measures an element value of the element. A head unit picks up the element from the feeder, inputs the element into the element value measuring unit, and/or attaches the element to the substrate. A control device controls operations of the feeder and the head unit. | 04-02-2015 |
Jong-Keun Jeon, Cheonan-Si KR
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20080251949 | Molding apparatus, molded semiconductor package using multi-layered film, fabricating and molding method for fabricating the same - Example embodiments include molding apparatuses, semiconductor packages, a fabricating methods for fabricating the same. The molding apparatus may include a first mold die for adhering a partially completed package, a second mold die including a cavity formed such that the partially completed package is positioned inside the cavity and a molding resin for encapsulating the partially completed package inserted into the cavity, and a multi-layered film supply unit for supplying a multi-layered film to the cavity of the second mold die. The semiconductor package may include a substrate, a semiconductor chip electrically connected to the substrate, a molding resin for encapsulating the semiconductor chip and an electrical portion of the substrate, and a marking film, adhered to an outer surface of the molding resin such that a mark is marked in the marking film. | 10-16-2008 |
20090068819 | Tape structures, and methods and apparatuses for separating a wafer using the same - Example embodiments provide tape structures including a base layer, a neutralizing layer and an adhesive layer. The base layer may support an object. The neutralizing layer may be arranged on the base layer. The neutralizing layer may be grounded to neutralize charges between the base layer and the object. The adhesive layer may be arranged on the neutralizing layer. The object may be attached to the adhesive layer. Example embodiments also provide methods of manufacturing the tape structures, methods of separating a wafer, and apparatuses for separating a wafer. | 03-12-2009 |
20110080516 | IMAGE SENSOR MODULE AND IMAGING DEVICE INCLUDING THE IMAGE SENSOR MODULE - An image sensor module and an imaging device. An image sensor package includes a plurality of image sensor chips for generating image signals and a lower transparent board over the image sensor chips. An upper transparent board is positioned over the lower transparent board and includes a lens for focusing an external light to the image sensor chips. An adhesion member is interposed between the upper transparent board and the lower transparent board, and thus the upper and lower transparent boards are adhered to each other by the adhesion member such that the lens and the image sensor chips are aligned with each other. A dehumidifying agent is arranged in the adhesion member to absorb moistures from an interior of the image sensor module. Accordingly, the moistures are prevented from being condensed onto the surface of the image sensor module. | 04-07-2011 |
20140083600 | IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME, AND IMAGING DEVICE INCLUDING THE IMAGE SENSOR AND METHOD OF MANUFACTURING THE IMAGING DEVICE - An image sensor module and an imaging device. An image sensor package includes a plurality of image sensor chips for generating image signals and a lower transparent board over the image sensor chips. An upper transparent board is positioned over the lower transparent board and includes a lens for focusing an external light to the image sensor chips. An adhesion member is interposed between the upper transparent board and the lower transparent board, and thus the upper and lower transparent boards are adhered to each other by the adhesion member such that the lens and the image sensor chips are aligned with each other. A dehumidifying agent is arranged in the adhesion member to absorb moistures from an interior of the image sensor module. Accordingly, the moistures are prevented from being condensed onto the surface of the image sensor module. | 03-27-2014 |
Keun-Ik Jeon, Cheonan-Si KR
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20130001077 | NON-ADHESIVE SPUTTERING STRUCTURE INCLUDING A SPUTTERING TARGET AND BACKING PLATE - A non-adhesive sputtering structure includes a sputtering target having a plate shape; and a backing plate having a plate shape. The backing plate faces the sputtering target, and facing surfaces of the sputtering target and the backing plate are in contact with each other. The backing plate includes a body having a longitudinal axis; and a cooling member through which a cooling material flows in a longitudinal direction of the body substantially parallel to the longitudinal axis. The cooling material conducts heat generated from the sputtering target from sputtering to outside the backing plate. The non-adhesive sputtering structure further includes a plurality of non-adhesive fastening members which maintain the facing surfaces of the backing plate and the sputtering target in contact with each other. The non-adhesive fastening members are extended through a thickness of the backing plate and correspond to regions of the backing plate excluding the cooling member. | 01-03-2013 |
Kyung-Ju Jeon, Cheonan-Si KR
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20100110056 | CONNECTOR, CONNECTOR ASSEMBLY, AND DISPLAY APPARATUS HAVING THE SAME - The present invention relates to a connector that includes a body and a plurality of terminals. The body extends in a first direction and includes at least one side surface coupled with an external device. The terminals include a conductive material. The terminals are arranged on the body, extend in a second direction perpendicular to the first direction, and are arranged in the first direction to receive a voltage and a control signal from the external device. At least one terminal of the terminals has a length in the second direction greater than a length of remaining terminals in the second direction, the at least one terminal to receive a ground voltage. | 05-06-2010 |
20110063261 | LIQUID CRYSTAL DISPLAY DEVICE INCLUDING IMPROVED CIRCUIT SUBSTRATE CONNECTION - A display device includes; a display panel including; a data line, a gate line insulated from the data line and a pixel respectively connected to the data line and the gate line, a first printed circuit board (“PCB”) which drives the display panel and is disposed adjacent to the display panel, the first PCB having a first driving circuit disposed thereon, a second PCB disposed adjacent to the first PCB and the display panel, the second PCB having a second driving circuit and a control circuit disposed thereon, wherein the second driving circuit drives the display panel and the control circuit controls the first driving circuit and the second driving circuit. | 03-17-2011 |
Myoung-Ha Jeon, Cheonan-Si KR
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20080309597 | DRIVING APPARATUS FOR A LIQUID CRYSTAL DISPLAY AND LIQUID CRYSTAL DISPLAY INCLUDING THE SAME - The present invention is related to a driving apparatus for a liquid crystal display, and a liquid crystal display including the same. A gate-on voltage generator includes first and second resistors connected between a predetermined reference voltage and a ground voltage, a voltage follower connected to a contact between the first resistor and the second resistor, a charge pump circuit connected to an output terminal of the voltage follower, and a gate-on voltage output terminal connected to the charge pump circuit. The voltage follower is disposed in front of the charge pump circuit such that an influence due to load changes is blocked to thereby prevent an excessive increase of the gate-on voltage during a blank time. Furthermore, two resistors having the same resistance are used to divide the reference voltage such that stress on the resistors may be minimized. | 12-18-2008 |
20090303403 | DRIVING-VOLTAGE GENERATION APPARATUS AND LIQUID CRYSTAL DISPLAY HAVING THE SAME - A driving-voltage generation apparatus and a liquid crystal display (LCD) having the same are provided. The driving-voltage generation apparatus includes an input node coupled to an input voltage, a voltage converter configured to convert the input voltage into an output voltage and output the output voltage, and a voltage cutoff unit electrically connected between the input node and the voltage converter. The voltage cutoff unit is configured to sense the input voltage and selectively cut off the supply of the input voltage. | 12-10-2009 |