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Jeffrey N. Miller

Jeffrey N. Miller, Los Altos Hills, CA US

Patent application numberDescriptionPublished
20100032703EDGE-EMITTING LED ASSEMBLY - A light-emitting diode (LED) in accordance with the invention includes an edge-emitting LED stack having an external emitting surface from which light is emitted, and a reflective element that is located adjacent to at least one external surface of the LED stack other than the external emitting surface. The reflective element receives light that is generated inside the LED stack and reflects the received light back into the LED stack. At least a portion of the reflected light is then emitted from the external emitting surface.02-11-2010
20100140585QUANTUM DOT WHITE AND COLORED LIGHT-EMITTING DEVICES - A light-emitting device comprising a population of quantum dots (QDs) embedded in a host matrix and a primary light source which causes the QDs to emit secondary light and a method of making such a device. The size distribution of the QDs is chosen to allow light of a particular color to be emitted therefrom. The light emitted from the device may be of either a pure (monochromatic) color, or a mixed (polychromatic) color, and may consist solely of light emitted from the QDs themselves, or of a mixture of light emitted from the QDs and light emitted from the primary source. The QDs desirably are composed of an undoped semiconductor such as CdSe, and may optionally be overcoated to increase photoluminescence.06-10-2010
20100141118QUANTUM DOT WHITE AND COLORED LIGHT-EMITTING DEVICES - A light-emitting device comprising a population of quantum dots (QDs) embedded in a host matrix and a primary light source which causes the QDs to emit secondary light and a method of making such a device. The size distribution of the QDs is chosen to allow light of a particular color to be emitted therefrom. The light emitted from the device may be of either a pure (monochromatic) color, or a mixed (polychromatic) color, and may consist solely of light emitted from the QDs themselves, or of a mixture of light emitted from the QDs and light emitted from the primary source. The QDs desirably are composed of an undoped semiconductor such as CdSe, and may optionally be overcoated to increase photoluminescence.06-10-2010
20100176715QUANTUM DOT WHITE AND COLORED LIGHT-EMITTING DEVICES - A light-emitting device comprising a population of quantum dots (QDs) embedded in a host matrix and a primary light source which causes the QDs to emit secondary light and a method of making such a device. The size distribution of the QDs is chosen to allow light of a particular color to be emitted therefrom. The light emitted from the device may be of either a pure (monochromatic) color, or a mixed (polychromatic) color, and may consist solely of light emitted from the QDs themselves, or of a mixture of light emitted from the QDs and light emitted from the primary source. The QDs desirably are composed of an undoped semiconductor such as CdSe, and may optionally be overcoated to increase photoluminescence.07-15-2010

Patent applications by Jeffrey N. Miller, Los Altos Hills, CA US

Jeffrey N. Miller, Allen, TX US

Patent application numberDescriptionPublished
20090056116INTEGRATED MINIATURE DEVICE FACTORY - An integrated miniature factory for fabrication of a device is provided. In one example, the factory includes two enclosures that can be adapted for stand-alone operation. Compartmentalized process modules are configured to removably couple to each of the enclosures. Each compartmentalized process module is sized to receive a substrate on which the device is to be fabricated and is configured to aid in fabrication of the device. The two enclosures are also adaptable to be coupled to one another. A transportation mechanism configured to transfer the substrate between the compartmentalized process modules in one of the enclosures may also be configured to transfer the substrate between the two enclosures.03-05-2009
20090326703INTEGRATED MINIATURE MICROELECTRONIC DEVICE FACTORY - An integrated miniature factory for fabrication of a device is provided. In one example, the factory includes an enclosure, multiple compartmentalized process modules, and a transportation mechanism. The compartmentalized process modules are configured to removably couple to the enclosure. Each compartmentalized process module is sized to receive a substrate on which the device is to be fabricated and is configured to aid in fabrication of the device. The transportation mechanism is configured to transfer the substrate between at least two of the compartmentalized process modules during a fabrication process.12-31-2009