Patent application number | Description | Published |
20090027767 | PRODUCTION OF CAVITIES THAT CAN BE FILLED WITH A FLUID MATERIAL IN AN OPTICAL MICROTECHNOLOGICAL COMPONENT - A novel method makes it possible to form cavities intended to contain a liquid with determined optical properties within a film for optical use. The walls ( | 01-29-2009 |
20100047567 | MULTI-COMPONENT DEVICE INTEGRATED INTO A MATRIX - The invention relates to an electronic device, having a front face | 02-25-2010 |
20100171227 | METHOD OF PRODUCING A VIA IN A RECONSTITUTED SUBSTRATE - A method of producing an electronic connection device, including: a) formation, in a plane of a support substrate, of at least one first contact element and, in a direction approximately perpendicular to the plane, of at least one second contact element having a first end in electrical contact with the first contact element or elements and a second end, the second contact element or elements including one or more metal tracks standing up along the direction perpendicular to the surface of the substrate; b) then positioning at least one electrical or electronic component in contact with the first contact element or elements; and c) encapsulation of the component(s) and of the first and second contact elements, at least the second end or ends of the second contact element or elements being flush with the surface of the encapsulating material. | 07-08-2010 |
20100181679 | 3D INTEGRATION OF VERTICAL COMPONENTS IN RECONSTITUTED SUBSTRATES - A reconstituted electronic device including: a first face and a second face; a plurality of individual chips placed perpendicular to the faces, each individual chip carrying, on one of its surfaces, at least one component, tracks, and a connection mechanism that are flush with one or other of the faces of the reconstituted electronic device; and an encapsulant that encapsulates the individual chips. | 07-22-2010 |
20100195299 | Integrated multicomponent device in a semiconducting die - An electronic device with integrated discrete components, including a wafer including cavities that can receive the components, an active face of the components being in a same plane as a face of the receiving wafer, and a material for laterally coating the components in the cavities. | 08-05-2010 |
20110006400 | HANDLE WAFER HAVING VIEWING WINDOWS - The invention relates to a method for making a handle wafer ( | 01-13-2011 |
20130293428 | MICROELECTRONIC WIRELESS TRANSMISSION DEVICE - A microelectronic wireless transmission device including:
| 11-07-2013 |
20130296658 | COMPONENT WITH ENCAPSULATED ACTIVE ELEMENT AND IMPLANTABLE MEDICAL ADVICE INCORPORATING SUCH A COMPONENT - A component including at least one active element hermetically encapsulated in a cavity formed between a support and a cover, in which the support and the cover are made from an electrically conductive material, and are insulated electrically from one another, and include a first electrical connection between the active element and the support, and a second electrical connection, separate from the first connection, between the active element and the cover, and in which:
| 11-07-2013 |
20130313704 | METHOD FOR FABRICATING TWO SUBSTRATES CONNECTED BY AT LEAST ONE MECHANICAL AND ELECTRICALLY CONDUCTIVE CONNECTION AND STRUCTURE OBTAINED - A first substrate provided with a receiving area made from a first metallic material is supplied. A second substrate provided with an insertion area comprising a base surface and at least two bumps made from a second metallic material is arranged facing the first substrate. The bumps are salient from the base surface. A pressure is applied between the first substrate and the second substrate so as to make the bumps penetrate into the receiving area. The first metallic material reacts with the second metallic material so as to form a continuous layer of an intermetallic compound having a base formed by the first and second metallic materials along the interface between the bumps and the receiving area. | 11-28-2013 |