Patent application number | Description | Published |
20090094816 | Method for producing a structure having a perforated sealing strip and structure obtained - The structure comprises facing substrates bonded to one another by crushing a closed peripheral sealing strip delineating a closed cavity in which a microsystem is disposed between the substrates. Before crushing, the sealing strip comprises perforated patterns delineating a plurality of voids inside the strip. | 04-16-2009 |
20090200066 | BARE MICROELECTRONIC CHIP PROVIDED WITH A RECESS FORMING A HOUSING FOR A WIRE ELEMENT CONSTITUTING A FLEXIBLE MECHANICAL SUPPORT, FABRICATION PROCESS AND MICROSTRUCTURE - A microelectronic chip comprises two parallel main faces and side faces. At least one of the faces comprises a recess provided with at least one electrical connection element and forming a housing for a wire element. The wire element simultaneously constitutes both an electrical connection between the chip and the outside via said connection element and a flexible mechanical support for said chip. | 08-13-2009 |
20100136746 | METHOD FOR PRODUCING A SET OF CHIPS MECHANICALLY INTERCONNECTED BY MEANS OF A FLEXIBLE CONNECTION - The method relates to production of a set of chips mechanically interconnected by means of a flexible connection. The chips, integrated on a substrate, each comprise a receiving area. The chips of the set are connected in series in the receiving areas by a connecting element. The chips are then released, the connecting element forming a flexible connection. | 06-03-2010 |
20100245182 | Assembly of Radiofrequency Chips - The invention relates to the fabrication of radiofrequency transmission/reception devices. The invention makes provision for: the making of radiofrequency transmission/reception chips devoid of antennas; the connecting in series of the chips by at least two conducting wire elements whose respective lengths between two neighboring chips are chosen as a function of the transmission/reception frequency, each element contacting electrically at least one terminal of a chip and ensuring an at least temporary function of mechanical holding of the chips chainwise; and the cutting at regular intervals of the serial connection to form, for each chip, two strands of an antenna of the device. | 09-30-2010 |
20110001237 | ASSEMBLY OF A WIRE ELEMENT WITH A MICROELECTRONIC CHIP WITH A GROOVE COMPRISING AT LEAST ONE BUMP SECURING THE WIRE ELEMENT - The assembly comprises at least one microelectronic chip having two parallel main surfaces and lateral surfaces, at least one of the lateral faces comprising a longitudinal groove housing a wire element having an axis parallel to the longitudinal axis of the groove. The groove is delineated by at least two side walls. The wire element is secured to the chip at the level of a clamping area between at least one bump arranged on one of the side walls, and the side wall of the groove opposite said bump. The clamping area has a smaller height than the diameter of the wire element and a free area is arranged laterally to the bump along the longitudinal axis of the groove. The free area has a height, corresponding to the distance separating the two side walls, that is greater than the diameter of the wire element. | 01-06-2011 |
20110114377 | STACKED ELECTRONIC DEVICE AND METHOD OF MAKING SUCH AN ELECTRONIC DEVICE - This invention relates to a stacked electronic device composed of stacked electronic components ( | 05-19-2011 |
20110117663 | USE OF A FABRIC COMPRISING A SPECIFIC MATERIAL FOR DETECTING THE PRESENCE OF A CHEMICAL SUBSTANCE - A method for using of a fabric comprising a material chosen from metals, metallic alloys, polymers, inorganic compounds and mixtures thereof, which material is capable of detecting the presence of a chemical substance, for the detection of said chemical substance. | 05-19-2011 |
20110143442 | METHOD FOR DETECTING THE PRESENCE OR ABSENCE OF A CHEMICAL SUBSTANCE IN A LIQUID MEDIUM - The invention pertains to a method for determining the presence or absence of at least one chemical substance in a liquid medium, comprising a contacting step of said liquid medium with a device comprising at least one substrate coated, in whole or in part on at least one of its sides, with at least one layer comprising material able to be degraded fully or partly by said chemical substance, said material being chosen from among metals, metal alloys, metal oxides. | 06-16-2011 |
20110149540 | METHOD FOR ASSEMBLING AT LEAST ONE CHIP WITH A WIRE ELEMENT, ELECTRONIC CHIP WITH A DEFORMABLE LINK ELEMENT, FABRICATION METHOD OF A PLURALITY OF CHIPS, AND ASSEMBLY OF AT LEAST ONE CHIP WITH A WIRE ELEMENT - A first step of the method for assembling a wire element with an electronic chip comprises arranging the wire element in a groove of the chip delineated by a first element and a second element, joined by a link element comprising a plastically deformable material, and a second step then comprises clamping the first and second elements to deform the link element until the wire element is secured in the groove. | 06-23-2011 |
20110198735 | ASSEMBLY OF A MICROELECTRONIC CHIP HAVING A GROOVE WITH A WIRE ELEMENT IN THE FORM OF A STRAND, AND METHOD FOR ASSEMBLY - Assembly of at least one microelectronic chip with a wire element, the chip comprising a groove for embedment of the wire element. The wire element is a strand with a longitudinal axis substantially parallel to the axis of the groove, comprising at least two electrically conducting wires covered with insulator. The chip comprises at least one electrically conducting bump in the groove, this bump being in electric contact with a stripped area of a single one of the electrically conducting wires of the strand. | 08-18-2011 |
20110287606 | METHOD FOR FABRICATING CHIP ELEMENTS PROVIDED WITH WIRE INSERTION GROOVES - The invention relates to a method for fabricating chip elements provided with a groove from devices formed on a wafer. The method comprises the steps consisting in, depositing a sacrificial film on the wafer so as to leave a central part of each device exposed and to cover an edge of the device at the level of which the groove is to be formed; applying a mold on the sacrificial film; injecting a hardenable material into the mold; hardening the hardenable material; dicing the wafer between the devices; and eliminating the sacrificial film. | 11-24-2011 |
20120064671 | METHOD FOR PRODUCING CHIP ELEMENTS EQUIPPED WITH WIRE INSERTION GROOVES - The invention relates to a method for producing chip elements provided with a groove, comprising the following steps: on an interconnect substrate, providing a conductive track arranged to connect a contact area of an active surface of a chip to an area corresponding to a first wall of the groove; growing a contact bump by electrodeposition on the conductive track at the level of the area corresponding to the first wall of the groove; assembling the chip on the substrate via its active surface so that a side wall of the chip forms the bottom of the groove; machining the chip via its rear surface in parallel to the substrate while measuring the distance between the rear surface of the chip and the contact bump; stopping machining when the measured distance reaches a required value; and assembling by bonding a plate to the rear surface of the chip so as to form a second wall of the groove. | 03-15-2012 |
20120073128 | APPARATUS FOR ASSEMBLING CHIP DEVICES ON WIRES - An apparatus for assembling chip devices on a wire, each chip device comprising two substantially parallel lateral walls, and a groove in one of the lateral walls for receiving said wire. The apparatus includes a pinching device having two opposing surfaces, the distance between the opposing surfaces being substantially constant and substantially equal to the distance between the two lateral walls of a chip device. A wire feeder is adapted to continuously feed the wire in contact with one of the opposing surfaces of the pinching device. A chip device feeder is adapted to drive chip devices, one at a time, between the opposing surfaces, with their grooves turned towards the wire. The pinching device may comprise two cylindrical rollers having rotation axes substantially perpendicular to the wire, the opposing surfaces being formed by respective surfaces of the rollers. | 03-29-2012 |
20120298173 | PHOTOVOLTAIC CELL, METHOD FOR ASSEMBLING PLURALITY OF CELLS AND ASSEMBLY OF A PLURALITY OF PHOTOVOLTAIC CELLS - The photovoltaic cell has a block that includes at least one semiconductor substrate in which is formed at least one photovoltaic junction that is connected to a first electrical contact element of a first pole and to a second electrical contact element of a second pole. The cell includes a first transparent cover that is placed on a first surface of the block and defines with the block of the cell a first recess groove of a first electrically conductive wire element. | 11-29-2012 |
20130033879 | METHOD FOR ASSEMBLING AT LEAST ONE CHIP USING A FABRIC, AND FABRIC INCLUDING A CHIP DEVICE - A method for assembling a device on two substantially parallel taut threads. The device includes an electronic chip and two substantially parallel grooves open on opposite sides of the device. The distance separating the grooves corresponds to the distance separating the threads. The device presents a penetrating shape along an axis perpendicular to the plane of the grooves, having a base at the level of the grooves and an apex of smaller size than the distance separating the threads. The method includes the steps consisting in placing the apex of the device between the two threads; in moving the device between the two threads resulting in the threads being separated from one another by the penetrating shape of the device; and in continuing movement of the device until the threads penetrate into the grooves reverting to their initial separation distance. | 02-07-2013 |
20130074331 | METHOD FOR ASSEMBLING A CHIP IN A FLEXIBLE SUBSTRATE - A substrate provided with an electrically conducting wire coated with an electrically insulating material is impregnated with a polymerizable material. A reception area for a chip is formed on a surface of the substrate by means of deformation. The housing area is stiffened using the polymerizable material. The chip is disposed in the reception area and an electrical connection area of the chip is connected electrically to the electrically conducting wire of the substrate. | 03-28-2013 |
20130077281 | CHIP ELEMENTS MOUNTED ON WIRES HAVING AN INCIPIENT BREAKING POINT - The invention relates to a chain including multiple microelectronic chip elements that are connected to a wire. The wire has notches that define preferred breaking points when the wire is subject to tensile stress. If the wire is conductive, the notches can be spread so that the length of the wire between a chip element and a notch is equal to the length of an antenna. | 03-28-2013 |
20140313743 | Method for Assembling a Microelectronic Chip Device in a Fabric, Chip Device, and Fabric Incorporating a Crimped Chip Device - The method for assembling a microelectronic chip device ( | 10-23-2014 |
20150024589 | METHOD FOR ASSEMBLING A MICROELECTRONIC CHIP ELEMENT ON A WIRE ELEMENT, AND INSTALLATION ENABLING ASSEMBLY TO BE PERFORMED - Method for assembling includes: providing a system to transfer wire element from wire element supply device to wire element storage device; stretching wire element between supply and storage devices by tensioning; providing an individualized reservoir and separated chip elements, each including a connection terminal including a top with free access facing in which chip element is not present; transporting the chip element from reservoir to an assembly area between supply and storage devices in which wire element is tightly stretched in assembly area; fixing electrically conducting wire element to chip element connection terminal in assembly area; and adding electrically insulating material on chip element after latter has been fixed to wire element forming a cover, the addition of material being performed on surface of chip element including connection terminal fixed to wire element to cover at least the connection terminal and portion of wire element at fixing point of latter. | 01-22-2015 |