Patent application number | Description | Published |
20090128986 | HYBRID DISCOIDAL/TUBULAR CAPACITOR - A hybrid capacitor includes a body of dielectric material having spaced-apart first and second surfaces. A first electrode is associated with the first surface. A second electrode is associated with the second surface. One or more third electrodes are transversely disposed within the dielectric body between the first and second electrodes. Either the first or second electrode is not conductively coupled to any electrode transversely extending into the body. The resulting arrangement provides a hybrid capacitor having characteristics of both a tubular capacitor and a discoidal capacitor. | 05-21-2009 |
20090288280 | PROCESS FOR MANUFACTURING EMI FILTERS UTILIZING COUNTER-BORED CAPACITORS TO FACILITATE SOLDER RE-FLOW - An EMI filtered terminal assembly includes at least one conductive terminal pin, a feedthrough capacitor, and a counter-bore associated with a passageway through the capacitor and the lead wire. Preferably, the feedthrough capacitor having counter-drilled holes on its top side is first bonded to a hermetic insulator. The counter-bore in the capacitor provides greater volume for the electro-mechanical attachment between the capacitor and the lead wire, permitting robotic dispensing of, for example, thermal-setting conductive adhesive. | 11-26-2009 |
20100134951 | ELECTROMAGNETIC INTERFERENCE FILTER AND METHOD FOR ATTACHING A LEAD AND/OR A FERRULE TO CAPACITOR ELECTRODES - A discoidal feedthrough capacitor has its active electrode plates disposed within a dielectric body so that an edge of the active electrode plates is exposed at a surface of a through-hole for a conductive lead. The conductive lead is conductively coupled to the exposed edge of the electrode plates without an intervening conductive termination surface. Similarly, a ground electrode plate set of the feedthrough capacitor may have an edge exposed at the outer periphery of the capacitor for conductively coupling the exposed edge of the ground electrode plate to a conductive ferrule without an intervening conductive termination surface. | 06-03-2010 |
20120127627 | MODULAR EMI FILTERED TERMINAL ASSEMBLY FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE - A modular EMI filtered terminal assembly for an active implantable medical device (AIMD) includes a hermetic terminal subassembly having at least one conductor extending through an insulator in non-conductive relation with the AIMD housing, and a feedthrough capacitor subassembly disposed generally adjacent to the hermetic terminal assembly. The feedthrough capacitor subassembly includes a conductive modular cup conductively coupled to the AIMD housing, and a feedthrough capacitor disposed within the modular cup. A first electrode plate or set of electrode plates is conductively coupled to the conductor, and a second electrode plate or set of electrode plates is conductively coupled to the modular cup. | 05-24-2012 |
20120256704 | RF FILTER FOR AN ACTIVE MEDICAL DEVICE (AMD) FOR HANDLING HIGH RF POWER INDUCED IN AN ASSOCIATED IMPLANTED LEAD FROM AN EXTERNAL RF FIELD - An RF filter for an active medical device (AMD), for handling RF power induced in an associated lead from an external RF field at a selected MRI frequency or range frequencies includes a capacitor having a capacitance of between 100 and 10,000 picofarads, and a temperature stable dielectric having a dielectric constant of 200 or less and a temperature coefficient of capacitance (TCC) within the range of plus 400 to minus 7112 parts per million per degree centigrade. The capacitor's dielectric loss tangent in ohms is less than five percent of the capacitor's equivalent series resistance (ESR) at the selected MRI RF frequency or range of frequencies. | 10-11-2012 |
20130184796 | Elevated Hermetic Feedthrough Insulator Adapted for Side Attachment of Electrical Conductors on the Body Fluid Side of an Active Implantable Medical Device - An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate. | 07-18-2013 |
20130184797 | CO-FIRED HERMETICALLY SEALED FEEDTHROUGH WITH ALUMINA SUBSTRATEAND PLATINUM FILLED VIA FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE - A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill. | 07-18-2013 |
20130286537 | EMI FILTERS UTILIZING COUNTER-BORED CAPACITORS TO FACILITATE SOLDER RE-FLOW - An EMI filtered terminal assembly including at least one conductive terminal pin, a feedthrough capacitor, and a counter-bore associated with a passageway through the capacitor is described. Preferably, the feedthrough capacitor having counter-drilled or counter-bored holes on its top side is first bonded to a hermetic insulator. The counter-drilled or counter-bore holes in the capacitor provide greater volume for the electro-mechanical attachment between the capacitor and the terminal pin or lead wire, permitting robotic dispensing of, for example, thermal-setting conductive adhesive. | 10-31-2013 |
20140036409 | EMI Filtered Co-Connected Hermetic Feedthrough, Feedthrough Capacitor and Leadwire Assembly for an Active Implantable Medical Device - A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire. | 02-06-2014 |
20140161973 | CO-FIRED HERMETICALLY SEALED FEEDTHROUGH WITH ALUMINA SUBSTRATE AND PLATINUM FILLED VIA FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE - A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill. | 06-12-2014 |
20140168850 | RF FILTER FOR AN ACTIVE MEDICAL DEVICE (AMD) FOR HANDLING HIGH RF POWER INDUCED IN AN ASSOCIATED IMPLANTED LEAD FROM AN EXTERNAL RF FIELD - An RF filter for an active medical device (AMD), for handling RF power induced in an associated lead from an external RF field at a selected MRI frequency or range frequencies includes a capacitor having a capacitance of between 100 and 10,000 picofarads, and a temperature stable dielectric having a dielectric constant of 200 or less and a temperature coefficient of capacitance (TCC) within the range of plus 400 to minus 7112 parts per million per degree centigrade. The capacitor's dielectric loss tangent in ohms is less than five percent of the capacitor's equivalent series resistance (ESR) at the selected MRI RF frequency or range of frequencies. | 06-19-2014 |
20140168917 | LOW INDUCTANCE AND LOW RESISTANCE HERMETICALLY SEALED FILTERED FEEDTHROUGH FOR AN AIMD - A hermetically sealed filtered feedthrough includes a chip capacitor disposed on a circuit board on a device side. A first low impedance electrical connection is between a capacitor first end metallization and a conductor which is disposed through an insulator. A second low impedance electrical connection is between the capacitor second end metallization and a ferrule or housing. The second low impedance electrical connection may include an oxide-resistant electrical connection forming the hermetic seal between the insulator and the ferrule or housing and an electrical connection between and to the second end metallization and directly to the oxide-resistant electrical connection. Alternatively, the second low impedance electrical connection may include an oxide-resistant metal addition attached directly to the ferrule or housing and an electrical connection between and to the second end metallization and directly to the oxide-resistant metal addition. | 06-19-2014 |
20140194964 | LOW IMPEDANCE OXIDE RESISTANT GROUNDED CAPACITOR FOR AN AIMD - A hermetically sealed filtered feedthrough assembly for an AIMD includes an insulator hermetically sealed to a conductive ferrule or housing. A conductor is hermetically sealed and disposed through the insulator in non-conductive relation to the conductive ferrule or housing between a body fluid side and a device side. A feedthrough capacitor is disposed on the device side. A first low impedance electrical connection is between a first end metallization of the capacitor and the conductor. A second low impedance electrical connection is between a second end metallization of the capacitor and the ferrule or housing. The second low impedance electrical connection includes an oxide-resistant metal addition attached directly to the ferrule or housing and an electrical connection coupling the second end metallization electrically and physically directly to the oxide-resistant metal addition. | 07-10-2014 |