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Jarry, FR
Aurelien Jarry, Montpellier FR
| Patent application number | Description | Published |
|---|---|---|
| 20080291490 | METHOD AND SYSTEM FOR PRINT JOB PROCESSING - Print jobs received at a printer are assigned a reference which is incorporated as a representation of the reference in the printed print job. When the user recovers the printjob, the part of said print job incorporating said representation of said reference. is scanned back into the printer, which is then able to read the representation. By monitoring the time intervening between the printing of the print job and the scanning of the part of the print job incorporating the representation, the system is able to monitor the delay, and in a case where this exceeds a threshold to notify the user accordingly. | 11-27-2008 |
Aurellen Jarry, Montpellier FR
| Patent application number | Description | Published |
|---|---|---|
| 20080291491 | METHOD AND SYSTEM FOR PRINT JOB PROCESSING - Print jobs received at a printer are assigned a reference which is incorporated as a visible representation of the reference in the printed print job. When the user recovers the print job, the reusable print job addendum. is fed back into the printer, for reuse in later print jobs. | 11-27-2008 |
Bernard Jarry, Chaleix FR
| Patent application number | Description | Published |
|---|---|---|
| 20120028576 | FILTERING NETWORK IN HR-SI SILICON TECHNOLOGY - The invention relates to a filtering network in HR-Si silicon technology defined by at least one cut-off frequency and comprising an input terminal for receiving the signal to be filtered and an output terminal for delivering a filtered signal. The network comprises a first ground line connected by its ends to first and second ground points connected directly to the ground plane, a second ground line connected via its ends to third and fourth ground points directly connected to the ground plane, a plurality of L/C resonant elements connected in parallel and linked via one end to one of the two ground lines and via the other end between them, by means of coupling inductors which thus create transmission zeros. Each ground line forming inductive elements via inductances the network comprises capacitive elements in series with at least some of said inductive elements, the value of the capacitive elements being selected so that the resonant frequency of the inductive and capacitive elements in series corresponds to a frequency lying outside of the bandwidth. | 02-02-2012 |
Christian Jarry, Artigues Pres De Bordeaux FR
| Patent application number | Description | Published |
|---|---|---|
| 20110301187 | BIS [O-(14-BENZOYLACONINE-8-YL)] ESTERS - The present invention concerns novel compounds having the structure (I). Another object of the invention is the use of compounds (I) for the fabrication of a medicament which is used for the treatment of tumour diseases. | 12-08-2011 |
Lu Jarry, Meudon FR
| Patent application number | Description | Published |
|---|---|---|
| 20100257899 | Oven and Oxy-Combustible Method for Melting Vitrifiable Materials - The invention relates to a method for melting vitrifiable materials in a low-capacity oven, wherein at least part of the melting energy is supplied by two oxy-burners projecting into the melting chamber through the upstream wall and arranged on opposite sides of a vertical plane in which a longitudinal axis of the melting chamber is situated, in such a way as to create two flames, the respective injection axes thereof crossing at a distance from the upstream wall, between ⅓ and ¾ of the length L of the melting chamber. | 10-14-2010 |
Luc Jarry, Meudon FR
| Patent application number | Description | Published |
|---|---|---|
| 20090053658 | Method of Controlling Burners for Heating Liquid Glass Flow Channels - Methods and apparatus for controlling the operation of a burner used for heating liquid glass feeders of a glass furnace. A burner is supplied with a fuel and oxygen. An additional gas is injected so that the sum of the oxygen flow, the fuel flow and the additional gas flow is greater than a minimum cooling flow for the burner. | 02-26-2009 |
| 20090148797 | Method for Carrying Out combined Burning in a Recovering Furnace - The invention relates to a burning method carried out in furnace provided with energy recovering means and burners, wherein a part of burners are embodied in the form of aero-combustible burners and the other part thereof are embodied in the form of oxy-combustible burners which are placed under the air ducts of the aero-combustible burners and carry out a staged combustion method. | 06-11-2009 |
| 20120006157 | METHOD FOR MELTING A SOLID CHARGE - A simple, compact burner achieves a more optimal melting of a solid charge followed by performance of combustion under distributed combustion conditions. The burner achieves this by fluidically bending the flame towards the solid charge during a melting phase with an actuating jet of oxidant, redirecting the flame in a direction away from the charge, and staging injection of oxidant among primary and secondary portions during a distributed combustion phase. | 01-12-2012 |
Philippe Jarry, Grenoble FR
| Patent application number | Description | Published |
|---|---|---|
| 20100006186 | ALUMINUM ALLOY PRODUCTS WITH HIGH TOUGHNESS AND PRODUCTION PROCESS THEREOF - Process for manufacturing aluminium alloy products, with high toughness and fatigue resistance comprising: (a) preparing an aluminium alloy bath, (b) adding a refining agent containing particles of AlTiC type phases into the bath, (c) casting an as-cast form such as an extrusion ingot, a forging ingot or a rolling ingot, (d) hot transforming the as-cast form, possibly after scalping, to form a blank or a product with final thickness, (e) optionally cold transforming the blank to a final thickness, (f) applying a solution heat treatment and quenching the product output from (d) or (e), followed by relaxation by controlled stretching with permanent elongation between 0.5 and 5%, and optionally annealing, wherein the quantity of refining agent is chosen such that the average casting grain size of the as-cast form is more than 500 μm. The present invention may be used, for example, to manufacture fuselage sheet or light-gauge plates made with 6056 alloy. | 01-14-2010 |
Pierre Jarry, Talence FR
| Patent application number | Description | Published |
|---|---|---|
| 20100109770 | RECONFIGURABLE POWER AMPLIFIER AND USE OF SUCH AMPLIFIER FOR MAKING A MULTI-STANDARD AMPLIFICATION STAGE FOR MOBILE PHONE COMMUNICATIONS - A reconfigurable power amplifier includes at least one amplification circuit (E | 05-06-2010 |
Vincent Jarry, La Membrolle Sur Choisille FR
| Patent application number | Description | Published |
|---|---|---|
| 20110006423 | SURFACE-MOUNTED SILICON CHIP - A silicon chip surface mounted via balls attached to its front surface, wherein the front and rear surfaces of the chip are covered with a thermosetting epoxy resin having the following characteristics: the resin contains a proportion ranging from 45 to 60% by weight of a load formed of carbon fiber particles with a maximum size of 20 μm and with its largest portion having a diameter ranging between 2 and 8 μm, on the front surface side, the loaded resin covers from 45 to 60% of the ball height, on the rear surface side, the loaded resin has a thickness ranging between 80 and 150 μm. | 01-13-2011 |
| 20110124157 | METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS ON A WAFER - A method for encapsulating electronic components, including the steps of: forming, in a first surface of a semiconductor wafer, electronic components; forming, on the first surface, an interconnection stack including conductive tracks and vias separated by an insulating material; forming first and second bonding pads on the interconnection stack; thinning down the wafer, except at least on its contour; filling the thinned-down region with a first resin layer; arranging at least one first chip on the first bonding pads and forming solder bumps on the second bonding pads; depositing a second resin layer covering the first chips and partially covering the solder bumps; bonding an adhesive strip on the first resin layer; and scribing the structure into individual chips. | 05-26-2011 |
| 20110300647 | METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS FROM A SEMICONDUCTOR WAFER - A method for manufacturing semiconductor chips from a semiconductor wafer, including the steps of: fastening, on a first support frame, a second support frame having outer dimensions smaller than the outer dimensions of the first frame and greater than the inner dimensions of the first frame; arranging the wafer on a surface of a film stretched on the second frame; carrying out wafer processing operations by using equipment capable of receiving the first frame; separating the second frame from the first frame and removing the first frame; and carrying out wafer processing operations by using equipment capable of receiving the second frame. | 12-08-2011 |
| 20120009763 | SEMICONDUCTOR CHIP MANUFACTURING METHOD - A method for manufacturing semiconductor chips from a semiconductor wafer, including the steps of: a) arranging the wafer on a surface of an elastic film stretched on a first support frame having dimensions much greater than the wafer dimensions, so that, in top view, a ring-shaped film portion separates this outer contour from the inner contour of the frame; b) performing manufacturing operations by using equipment capable of receiving the first frame; c) arranging, on the ring-shaped film portion, a second frame of outer dimensions smaller than the inner dimensions of the first frame; d) cutting the film between the outer contour of the second frame and the inner contour of the first frame and removing the first frame; and e) performing manufacturing operations by using equipment capable of receiving the second frame. | 01-12-2012 |