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Janisch
Andreas Janisch, Oeynhausen AT
| Patent application number | Description | Published |
|---|---|---|
| 20080258434 | Snowboard binding with rear step-in and securing of boot by toe element - This invention relates to a rear-step-in snowboard binding with a leg support, which is swivel-fastened between a rear step-in position, in which a boot that can be held in the snowboard binding can be inserted from rear to front into the snowboard binding, and a front riding position, and with a toe element, by which a front area of a boot that can be held in the snowboard binding can be overlapped at least partially, in such a way that it is held forward, whereby the leg support can be locked in the front riding position in such a way that a boot that can be held in the snowboard binding can be secured by the leg support and the toe element in its longitudinal direction relative to the snowboard binding, and whereby the preliminary pivoting of the leg support into the front riding position ensures the securing of the boot. | 10-23-2008 |
| 20100295269 | Snowboard Binding with a Controlled Instep Element - The invention relates to a snowboard binding ( | 11-25-2010 |
Darrel Janisch, Thief River Falls, MN US
| Patent application number | Description | Published |
|---|---|---|
| 20080293291 | POWER DISTRIBUTION MODULE FOR PERSONAL RECREATIONAL VEHICLE - A power distribution module for a personal recreational vehicle includes a housing and a cover. The housing defines an interior and includes a wall having an array of receptacle openings. The receptacle openings are adapted to receive and secure electrical components inside the housing. A distribution harness includes a plurality of electrical conductors and is coupled to the housing wherein the electrical conductors are in electrical communication with the electrical components inside the housing. The power distribution module can optionally include a decal to assist quick and accurate placement of the electrical components during the manufacturing process. A method for producing a personal recreational vehicle having a standardized housing over a range of models. The housing includes a component arrangement guide for locating and installing electrical components. | 11-27-2008 |
Dominic Janisch, Ybbsitz AT
| Patent application number | Description | Published |
|---|---|---|
| 20110150692 | Submicron Cemented Carbide with Mixed Carbides - A cemented carbide body is 1-30% by mass of binder consisting of Co, Co/Ni, Co/Fe, Co/Ni/Fe or Ni/Fe and a hard material having a hexagonal WC phase and having a face-centered cubic phase of the form (M | 06-23-2011 |
Jennifer Sherer Janisch, Las Vegas, NV US
| Patent application number | Description | Published |
|---|---|---|
| 20120040744 | MULTI-DIMENSIONAL PLAYER LOYALTY REWARDS SYSTEM AND METHOD - Certain embodiments provide a multi-dimensional player loyalty rewards system and method. Certain embodiments of the method include dynamically defining rewards based on at least one of player activity and historical data, and assigning values to the rewards based on at least one criterion, wherein the values change as the at least one criterion changes. The method may further include accumulating player earnings in a base unit of measure. Player earnings may be accumulated in a base unit of measure using multiple rates of earning, for example. One or more rewards may be redeemed using the values assigned to the rewards and the accumulated player earnings, for example. The at least one criterion may include at least one earning rate, for example. The at least one criterion may include at least one criterion tailored to a player, a player characteristic, a location, a game, and/or a game characteristic, for example. | 02-16-2012 |
Josef Janisch, Ilz AT
| Patent application number | Description | Published |
|---|---|---|
| 20090315547 | Magnetic Field Sensor Arrangement and Method for Non-Contact Measurement of a Magnetic Field - A magnetic field sensor arrangement ( | 12-24-2009 |
| 20110227567 | Sensor Arrangement and Method for Operating a Sensor Arrangement - A sensor arrangement comprises a first, a second and a third magnetic field sensor that are arranged along a curved principal direction. A first combination means is connected to the first and second magnetic field sensors and a first channel signal can be derived from the signals of the first and second magnetic field sensors by the first combination means. A second combination means is connected to the first, second and third magnetic field sensors (SM | 09-22-2011 |
Wolfgang Janisch, Graenichen CH
| Patent application number | Description | Published |
|---|---|---|
| 20100244093 | SEMICONDUCTOR MODULE - A controlled-punch-through semiconductor device with a four-layer structure is disclosed which includes layers of different conductivity types, a collector on a collector side, and an emitter on an emitter side which lies opposite the collector side. The semiconductor device can be produced by a method performed in the following order: producing layers on the emitter side of wafer of a first conductivity type; thinning the wafer on a second side; applying particles of the first conductivity type to the wafer on the collector side for forming a first buffer layer having a first peak doping concentration in a first depth, which is higher than doping of the wafer; applying particles of a second conductivity type to the wafer on the second side for forming a collector layer on the collector side; and forming a collector metallization on the second side. At any stage particles of the first conductivity type can be applied to the wafer on the second side for forming a second buffer layer with a second peak doping concentration lower than the first peak doping concentration of the first buffer layer, but higher than the doping of the wafer. A third buffer layer can be arranged between the first depth and the second depth with a doping concentration which is lower than the second peak doping concentration of the second buffer layer. Thermal treatment can be used for forming the first buffer layer, the second buffer layer and/or the collector layer. | 09-30-2010 |
| 20100270587 | REVERSE-CONDUCTING SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SUCH A REVERSE-CONDUCTING SEMICONDUCTOR DEVICE - A reverse-conducting semiconductor device (RC-IGBT) including a freewheeling diode and an insulated gate bipolar transistor (IGBT), and a method for making the RC-IGBT are provided. A wafer has first and second sides emitter and collector sides of the IGBT, respectively. At least one layer of a first or second conductivity type is created on the second side before at least one layer of a different conductivity type is created on the second side. The at least one layer of the first or second conductivity type and the at least one layer of the different conductivity type are arranged alternately in the finalized RC-IGBT. A second electrical contact, which is in direct electrical contact with the layers of the first or second and different conductivity types, is created on the second side. A shadow mask is applied on the second side, and the layer of the first or second conductivity type is created through the shadow mask. Another layer of the first or second conductivity type can be created on the second side, and a shadow mask is applied on the other layer of the first or second conductivity type, and at least one electrically conductive island, which is part of a second electrical contact in the finalized RC-IGBT, is created through the shadow mask. The electrically conductive island is used as a mask for the creation of the layer of the different conductivity type, and those parts of the other layer of the first conductivity type which are covered by an electrically conductive island form the layer of the first or second conductivity type. | 10-28-2010 |