Patent application number | Description | Published |
20100216320 | Separable electrical connectors using isotropic conductive elastomer interconnect medium - An electrical connector using an isotropic conductive elastomer as the interconnect medium. | 08-26-2010 |
20100276188 | Method and apparatus for improving power gain and loss for interconect configurations - The present disclosure relates to embedding a power modification component such as a capacitance or a resistance inside of pads that are located to extend over and beyond the vias of the PCB so that a portion of the pad containing the embedded capacitance or resistance is located beyond where the vias or blinds are located. Each of the pads will include an opening that is located over a given one of the vias or blinds to permit that via to conduct through the opening. In this way the capacitance and the resistance will have a closer contact point the electrical component. | 11-04-2010 |
20100277881 | Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration - Embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit board so that a portion of the interposer board containing the embedded capacitance is located beyond where the vias or blinds are located. This permits that via to conduct through the opening. In this way, the capacitance and the resistance will have a closer contact point to the electrical component. A resistance can also be embedded in an opening in the adaptor board and be vertically aligned within the opening to make contact with a pad on top of the adaptor board and a pad at the bottom of the adaptor board so that electricity conducts through the embedded component. | 11-04-2010 |
20110124207 | Separable electrical connectors using isotropic conductive elastomer interconnect medium - An electrical connector using an isotropic conductive elastomer as the interconnect medium. | 05-26-2011 |
20110155792 | Method and apparatus for scoring or skiving a solder dam - The present disclosure provides for scoring a line on metal to form a solder dam to define a solderable area on a metal surface. The solderable area can define solderable pads on a solid copper plane or at the end point of a trace on a circuit board. The present disclosure provides for soldering metallic surfaces together and for aligning solderable objects to one another. The surface tension of solder enables the parts to be aligned through the manipulations of the skived patterns and their placement. The skiving can be done either by laser skiving or by mechanical scoring on the metallic surfaces. | 06-30-2011 |
20110203842 | Method and structure for coaxial via routing in printed circuit boards for improved signal integrity - A method and a structure for a coaxial via that extend along the entire length of a signal via in a printed circuit board. Signal integrity is improved by providing ground shield for the entire length of the coaxial via. The ground shielding can be implemented by either providing ground cage vias around a signal via and routing a trace to the signal via on a built up layer or by providing a semi circle ground trench through a build up layer to permit a trace access to the signal via. | 08-25-2011 |
20110223780 | Electrical connector for connecting an adaptor board or electrical component to a main printed circuit board - An electrical connector electrically connects either an adaptor board or an electrical component to a main circuit board through the use of a thin printed circuit having an array of pads one each side where on one side the pads are connected to a main circuit board by solder balls, solder columns conductive epoxy or any other way practiced in the art and on the other side of the thin circuit the pads are connected to an adaptor board by a conductive compliant elastomeric material. The sides of the thin printed circuit are electrically connected to one another in ways practiced in the art. | 09-15-2011 |
20120081867 | Embedded isolation filter - The present disclosure relates to reducing unwanted RF noise in a printed circuit board (PCB) containing an RF device. An isolation filter is embedded in a PCB containing an RDF device. By placing the isolation filter as close as possible to the RF device in order to dramatically reduce unwanted RF noise due to unavoidable coupling between Vias and planes in the PCB structure. | 04-05-2012 |
20120285011 | Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration - Embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit board so that a portion of the interposer board containing the embedded capacitance is located beyond where the vias or blinds are located. This permits that via to conduct through the opening. In this way, the capacitance and the resistance will have a closer contact point to the electrical component. A resistance can also be embedded in an opening in the adaptor board and be vertically aligned within the opening to make contact with a pad on top of the adaptor board and a pad at the bottom of the adaptor board so that electricity conducts through the embedded component. | 11-15-2012 |