| Patent application number | Description | Published |
|---|
| 20080310231 | OPTIMIZATION OF CRITICAL DIMENSIONS AND PITCH OF PATTERNED FEATURES IN AND ABOVE A SUBSTRATE - A die is formed with different and optimized critical dimensions in different device levels and areas of those device levels using photolithography and etch techniques. One aspect of the invention provides for a memory array formed above a substrate, with driver circuitry formed in the substrate. A level of the memory array consists of, for example, parallel rails and a fan-out region. It is desirable to maximize density of the rails and minimize cost of lithography for the entire memory array. This can be achieved by forming the rails at a tighter pitch than the CMOS circuitry beneath it, allowing cheaper lithography tools to be used when forming the CMOS, and similarly by optimizing lithography and etch techniques for a device level to produce a tight pitch in the rails, and a more relaxed pitch in the less-critical fan-out region. | 12-18-2008 |
| 20090173985 | Dense arrays and charge storage devices - There is provided a monolithic three dimensional array of charge storage devices which includes a plurality of device levels, wherein at least one surface between two successive device levels is planarized by chemical mechanical polishing. | 07-09-2009 |
| 20090266329 | INTERNAL COMBUSTION ENGINE - An internal combustion engine is provided. Facing pistons eliminate a cylinder head, thereby reducing heat losses through a cylinder head. Facing pistons also halve the stroke that would be required for one piston to provide the same compression ratio, and the engine can thus be run at higher revolutions per minute and produce more power. An internal sleeve valve is provided for space and other considerations. A combustion chamber size-varying mechanism allows for adjustment of the minimum size of an internal volume to increase efficiency at partial-power operation. Variable intake valve operation is used to control engine power. | 10-29-2009 |
| 20090266339 | INTERNAL COMBUSTION ENGINE - An internal combustion engine is provided. Facing pistons eliminate a cylinder head, thereby reducing heat losses through a cylinder head. Facing pistons also halve the stroke that would be required for one piston to provide the same compression ratio, and the engine can thus be run at higher revolutions per minute and produce more power. An internal sleeve valve is provided for space and other considerations. A combustion chamber size-varying mechanism allows for adjustment of the minimum size of an internal volume to increase efficiency at partial-power operation. Variable intake valve operation is used to control engine power. | 10-29-2009 |
| 20100147269 | Internal Combustion Engine With Optimal Bore-To-Stroke Ratio - An internal combustion engine. The engine includes at least one cylinder having a bore diameter, a piston for traveling within each cylinder between a first position and a second position, wherein the distance between the first position and the second position defines a stroke length, and thermal barriers on the surfaces of the combustion chamber near top dead center. In one embodiment, the engine utilizes asymmetric effective compression and expansion strokes. To maximize efficiency of the engine, a ratio of the bore diameter to stroke length of the internal combustion engine comprises a range between 0.5 to 1.0. | 06-17-2010 |
| 20100171152 | INTEGRATED CIRCUIT INCORPORATING DECODERS DISPOSED BENEATH MEMORY ARRAYS - A very high density field programmable memory is disclosed. An array is formed vertically above a substrate using several layers, each layer of which includes vertically fabricated memory cells. The cell in an N level array may be formed with N+1 masking steps plus masking steps needed for contacts. Maximum use of self alignment techniques minimizes photolithographic limitations. In one embodiment the peripheral circuits are formed in a silicon substrate and an N level array is fabricated above the substrate. | 07-08-2010 |
| 20100212622 | SLEEVE VALVE ASSEMBLY - A sleeve valve assembly. The assembly includes a valve seat, a sleeve valve and an oil path-defining piece. The sleeve valve includes a distal end with a cavity. The distal end contacts the valve seat when the sleeve valve is located in a closed position. The oil path-defining piece includes an inlet port, an outlet port and a plurality of cooling passages. The flange of the sleeve valve is slidably in contact with the oil path-defining piece such that cooling fluid travelling into the inlet port and through the cooling passages enters into the cavity before exiting out the exit port. | 08-26-2010 |
| 20110019467 | VERTICALLY STACKED FIELD PROGRAMMABLE NONVOLATILE MEMORY AND METHOD OF FABRICATION - A memory cell is provided that includes a first conductor, a second conductor, a steering element that is capable of providing substantially unidirectional current flow, and a state change element coupled in series with the steering element. The state change element is capable of retaining a programmed state, and the steering element and state change element are vertically aligned with one another. Other aspects are also provided. | 01-27-2011 |
| 20110041799 | High Swirl Engine - An internal combustion engine can include a combustion volume within a cylinder of an internal combustion engine. The combustion volume can be defined at least by a cylinder wall and a first piston in the cylinder. A swirl port can deliver a fluid into the combustion volume via a swirl port outlet such that the delivered fluid is directed around a periphery of the cylinder with a fluid velocity disposed at a predetermined angle away from tangential to a curve of the cylinder wall to generate a swirling motion in the combustion volume. | 02-24-2011 |
| 20110156044 | DENSE ARRAYS AND CHARGE STORAGE DEVICES - There is provided a monolithic three dimensional array of charge storage devices which includes a plurality of device levels, wherein at least one surface between two successive device levels is planarized by chemical mechanical polishing. | 06-30-2011 |
