| Patent application number | Description | Published |
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| 20090046431 | High Capacity Thin Module System - Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module. | 02-19-2009 |
| 20090052124 | Circuit Module with Thermal Casing Systems - Flexible circuitry is populated with integrated circuitry (ICs), and contacts are distributed along the flexible circuitry to provide connection to an application environment. The flexible circuitry is disposed about a rigid substrate, placing the ICs on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate is preferably devised from thermally-conductive materials and one or more thermal spreaders are in thermal contact with at least some of the ICs. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module. | 02-26-2009 |
| 20090124045 | Low Profile Stacking System and Method - The present invention provides a system and method that mounts integrated circuit devices onto substrates and a system and method for employing the method in stacked modules. The contact pads of a packaged integrated circuit device are substantially exposed. A solder paste that includes higher temperature solder paste alloy is applied to a substrate or to the integrated circuit device to be mounted. The integrated circuit device is positioned to contact the contacts of the substrate. Heat is applied to create high temperature joints between the contacts of the substrate and the integrated circuit device resulting in a device-substrate assembly with high temperature joints. The formed joints are less subject to re-melting in subsequent processing steps. The method may be employed in devising stacked module constructions such as those disclosed herein as preferred embodiments in accordance with the invention. Typically, the created joints are low in profile. | 05-14-2009 |
| 20090160042 | Managed Memory Component - A system and method for combining a leaded package IC and a semiconductor die using a flex circuitry. The leaded packaged IC is disposed along an obverse side of a flex circuit. In a preferred embodiment, the lower surface of the body of the leaded packaged IC contacts the surface of the flex circuitry. The semiconductor die is disposed beneath the leaded package IC and, in preferred embodiments, disposed in a window that passes through at least a part of the flex circuitry and is attached to a conductive layer of the flex circuitry. In other embodiments, the semiconductor die is attached to the body of the leaded packaged IC. The flex circuitry preferably employs at least two conductive layers and, in preferred embodiments, the leaded packaged IC is connected to the flex circuitry at one layer while the semiconductor die is connected to the flex circuitry at the other conductive layer. In preferred modules, the leaded packaged IC is preferably a flash memory device and the semiconductor die is preferably a controller. | 06-25-2009 |
| 20090170243 | Stacked Integrated Circuit Module - The present invention provides an improvement on the use of flexible circuit connectors for electrically coupling IC devices to one another in a stacked configuration by use of the flexible circuit to provide the connection of the stacked IC module to other circuits. Use of the flexible circuit as the connection of the IC module allows the flexible circuit to provide strain relief and allows stacked IC modules to be assembled with a lower profile than with previous methods. The IC module can be connected to external circuits through the flexible circuit connectors by a variety of means, including solder pads, edge connector pads, and socket connectors. This allows for IC devices to occupy less space then with previous methods, which is beneficial in modules such as memory modules with multiple, stacked memory devices. | 07-02-2009 |
| 20090273069 | LOW PROFILE CHIP SCALE STACKING SYSTEM AND METHOD - The present invention stacks chip scale-packaged integrated circuits (CSPs) into low profile modules that conserve PWB or other board surface area. Low profile structures provide connection between CSPs of the stacked module and between and to the flex circuitry. Low profile contacts are created by any of a variety of methods and materials including, for example, screen paste techniques and use of high temperature solders, although other application techniques and traditional solders may be employed for creating low profile contacts in the present invention. A consolidated low profile contact structure and technique is provided for use in alternative embodiments of the present invention. The CSPs employed in stacked modules devised in accordance with the present invention are connected with flex circuitry. That flex circuitry may exhibit one or two or more conductive layers. In some preferred embodiments, a form standard provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design. In other embodiments, a heat spreader is disposed between the CSP and the flex circuitry thus providing an improved heat transference function without the standardization of the form standard, while still other embodiments lack either a form standard or a heat spreader and may employ, for example, the flex circuitry as a heat transference material. | 11-05-2009 |
| 20090294946 | Package-Borne Selective Enablement Stacking - The present invention provides a system and method for selectively stacking and interconnecting leaded packaged integrated circuit devices. In preferred embodiments, the plastic body of one or more leaded packaged ICs bear conductive traces that create circuitry to provide stacking related electrical interconnections between the constituent ICs of a stacked module without the use of separate interposers or carrier structures. Typically, the circuitry is borne by the body of the upper one of the ICs of a two-IC leaded package stack to implement stacking-related connections between the constituent ICs. | 12-03-2009 |
| 20090298230 | Stacked Module Systems and Methods - The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a preferred embodiment in accordance with the invention, a form standard associated with one or more CSPs provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design. In a preferred embodiment, the contacts of the lower CSP will be compressed before flex circuitry is attached to a combination of the CSP and a form standard to create lower profile contacts between CSP and the flex circuitry. | 12-03-2009 |
