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James Douglas
James Douglas Beasom, Melbourne Village, FL US
| Patent application number | Description | Published |
|---|---|---|
| 20080237775 | DEPLETABLE CATHODE LOW CHARGE STORAGE DIODE - An integrated circuit device comprising a diode and a method of making an integrated circuit device comprising a diode are provided. The diode can comprise an island of a first conductivity type, a first region of a second conductivity type formed in the island, and a cathode diffusion contact region doped to the second conductivity type disposed in the first region. The diode can also comprise a cathode contact electrically contacting the cathode diffusion contact region, an anode disposed in the island, an anode contact electrically contacting the anode, and a first extension region doped to the first conductivity type disposed at a surface junction between the first region and the island. | 10-02-2008 |
| 20090146218 | PMOS DEPLETABLE DRAIN EXTENSION MADE FROM NMOS DUAL DEPLETABLE DRAIN EXTENSIONS - In accordance with an embodiment of the invention, there is an integrated circuit device having a complementary integrated circuit structure comprising a first MOS device. The first MOS device comprises a source doped to a first conductivity type, a drain extension doped to the first conductivity type separated from the source by a gate, and an extension region doped to a second conductivity type underlying at least a portion of the drain extension adjacent to the gate. The integrated circuit structure also comprises a second complementary MOS device comprising a dual drain extension structure. | 06-11-2009 |
| 20100193895 | DEPLETABLE CATHODE LOW CHARGE STORAGE DIODE - An integrated circuit device comprising a diode and a method of making an integrated circuit device comprising a diode are provided. The diode can comprise an island of a first conductivity type, a first region of a second conductivity type formed in the island, and a cathode diffusion contact region doped to the second conductivity type disposed in the first region. The diode can also comprise a cathode contact electrically contacting the cathode diffusion contact region, an anode disposed in the island, an anode contact electrically contacting the anode, and a first extension region doped to the first conductivity type disposed at a surface junction between the first region and the island. | 08-05-2010 |
James Douglas Deasy, Ii, Mill Valley, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090130948 | Toy and method for delivering water - A recreational toy is provided. The toy may be expanded from a collapsed state into an expanded state which includes inflated sections having arcuate, or generally sinusoidal-shaped, surfaces. A perforated hollow chamber is coupled to the inflated sections. A method for discharging, sprinkling or delivering water from an inflated toy assembly is further provided. As water is being introduced into a perforated hollow chamber, water commences to sprinkle or be discharged through perforations in the hollow chamber. | 05-21-2009 |
James Douglas Fletcher, Ii, Bartlett, TN US
| Patent application number | Description | Published |
|---|---|---|
| 20100156768 | DISPLAY MEDIA, METHOD OF FORMING DISPLAY MEDIA, AND PRINTER FOR PRINTING ON DISPLAY MEDIA - A display media is disclosed which includes (1) a first flexible sheet, (2) a second flexible sheet, (3) a display activation substance located between the first and second flexible sheets, (4) a relatively transparent conductive layer located directly adjacent to the first flexible sheet, (5) a display controller located on a first surface of the second flexible sheet, (6) a plurality of electrodes located on the first surface, each of the plurality of electrodes being connected to the display controller, and (7) an additional electrode located on the first surface, the additional electrode being connected to both the display controller and the conductive layer. In this embodiment, the first surface faces away from the display activation substance. In addition, a one of the first and second flexible sheets, located nearest to a side of the display media through which a viewer is intended to view the pattern, is clear. | 06-24-2010 |
James Douglas Gleadall, Coldwater CA
| Patent application number | Description | Published |
|---|---|---|
| 20110204163 | Insulation system - The present invention is an insulation system that is installed on a boom pipe and a boom pipe nozzle or a dispersion hose of a concrete pump to prevent concrete from freezing or setting while being poured. The system includes a boom pipe covering with two vinyl canvas exterior sheets with a layer of reflective foil insulation held together with a first hook and loop fastener, a dispersion nozzle covering with two vinyl canvas exterior sheets with a layer of reflective foil insulation held together with a second hook and loop fastener and a dispersion hose covering with two vinyl canvas exterior sheets with a layer of reflective foil insulation with a flexible orifice perimeter to insulate said dispersion hose. | 08-25-2011 |
James Douglas Schwender, Edina, MN US
| Patent application number | Description | Published |
|---|---|---|
| 20110178601 | Adjustable Insertion Device For A Vertebral Implant - Intervertebral implants configured to engage with an insertion device for insertion between first and second vertebral members. The implants may include a body with a sidewall that forms an interior space. An opening may extend through the sidewall and into the interior space. Receptacles may be positioned at the opening and include an inlet to receive the insertion device. | 07-21-2011 |
James Douglas Shifley, Spencerport, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20120099911 | CONCURRENTLY REMOVING SHEET CHARGE AND CURL - Decurling a charged sheet and removing charge from the charged sheet prior to stacking, includes forming a nip between a roller and a compliant surface and applying pressure between the roller and compliant surface so that the nip has a decurling shape and when the nip engages the sheet it will perform a decurling function; and moving the charged sheet through the nip while the compliant surface has an AC voltage applied thereto so that a first side of the charged sheet is in contact with the compliant surface and has its charge substantially dissipated, whereby charge substantially remains on a second side of the charged sheet in contact with the roller and curling of the charged sheet is reduced. The method further includes using at least one non-contact charge removal device to remove charge from the second side of the charged sheet; and stacking the discharged sheet. | 04-26-2012 |
James Douglas Wehrly, Austin, TX US
| Patent application number | Description | Published |
|---|---|---|
| 20080211077 | Low profile chip scale stacking system and method - The present invention stacks chip scale-packaged integrated circuits (CSPs) into low profile modules that conserve PWB or other board surface area. Low profile structures provide connection between CSPs of the stacked module and between and to the flex circuitry. Low profile contacts are created by any of a variety of methods and materials including, for example, screen paste techniques and use of high temperature solders, although other application techniques and traditional solders may be employed for creating low profile contacts in the present invention. A consolidated low profile contact structure and technique is provided for use in alternative embodiments of the present invention. The CSPs employed in stacked modules devised in accordance with the present invention are connected with flex circuitry. That flex circuitry may exhibit one or two or more conductive layers. In some preferred embodiments, a form standard provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design. In other embodiments, a heat spreader is disposed between the CSP and the flex circuitry thus providing an improved heat transference function without the standardization of the form standard, while still other embodiments lack either a form standard or a heat spreader and may employ, for example, the flex circuitry as a heat transference material. | 09-04-2008 |
| 20080246134 | Package-Borne Selective Enablement Stacking - The present invention provides a system and method for selectively stacking and interconnecting leaded packaged integrated circuit devices. In preferred embodiments, the plastic body of one or more leaded packaged ICs bear conductive traces that create circuitry to provide stacking related electrical interconnections between the constituent ICs of a stacked module without the use of separate interposers or carrier structures. Typically, the circuitry is borne by the body of the upper one of the ICs of a two-IC leaded package stack to implement stacking-related connections between the constituent ICs. | 10-09-2008 |