| Patent application number | Description | Published |
|---|
| 20090039418 | MULTIPLE DEVICE TYPES INCLUDING AN INVERTED-T CHANNEL TRANSISTOR AND METHOD THEREFOR - A method for making a semiconductor device is provided. The method includes forming a first transistor with a vertical active region and a horizontal active region extending on both sides of the vertical active region. The method further includes forming a second transistor with a vertical active region. The method further includes forming a third transistor with a vertical active region and a horizontal active region extending on only one side of the vertical active region. | 02-12-2009 |
| 20090166700 | SINGLE TRANSISTOR MEMORY CELL WITH REDUCED RECOMBINATION RATES - A semiconductor fabrication method includes forming a semiconductor structure including source/drain regions disposed on either side of a channel body wherein the source/drain regions include a first semiconductor material and wherein the channel body includes a migration barrier of a second semiconductor material. A gate dielectric overlies the semiconductor structure and a gate module overlies the gate dielectric. An offset in the majority carrier potential energy level between the first and second semiconductor materials creates a potential well for majority carriers in the channel body. The migration barrier may be a layer of the second semiconductor material over a first layer of the first semiconductor material and under a capping layer of the first semiconductor material. In a one dimensional migration barrier, the migration barrier extends laterally through the source/drain regions while, in a two dimensional barrier, the barrier terminates laterally at boundaries defined by the gate module. | 07-02-2009 |
| 20100061162 | CIRCUIT AND METHOD FOR OPTIMIZING MEMORY SENSE AMPLIFIER TIMING - A memory has an array of memory cells, a word line driver, a sense amplifier, and a sense enable circuit. Each memory cell has a coupling transistor for coupling a storage portion to a bit line. The coupling transistors have an average threshold voltage and a maximum threshold voltage. The word line driver is coupled to the array and is for enabling a selected row of memory cells in the array. The sense amplifier detects a state of a memory cell in the selected row in response to a sense enable signal. The sense enable circuit provides the sense enable signal at a time based on the maximum threshold voltage. This timing enables the sense amplifier sufficiently late for low temperature operation while providing for faster operation at high temperature than would normally be achieved using just the average threshold voltage in providing timing of the sense enable signal. | 03-11-2010 |
| 20100074032 | MEMORY HAVING SELF-TIMED BIT LINE BOOST CIRCUIT AND METHOD THEREFOR - A memory has an array of memory cells, column logic, a write driver, a voltage detector, and a bootstrap circuit. The array of memory cells is coupled to pairs of bit lines and word lines. The column logic is coupled to the array and is for coupling a selected pair of bit lines to a pair of data lines. The write driver is coupled to the pair of data lines. The voltage detector provides an initiate boost signal when a voltage of a first data line of the pair of data lines drops below a first level during the writing of the pair of data lines by the write driver. The bootstrap circuit reduces the voltage of the first data line in response to the boost enable signal. This is particularly beneficial when the number of memory cells on a bit line can vary significantly as in a compiler. | 03-25-2010 |
| 20100181629 | METHOD OF FORMING AN INTEGRATED CIRCUIT - A method includes forming a source, a drain, and a disposable gate ( | 07-22-2010 |
| 20100190308 | ELECTRONIC DEVICE INCLUDING A FIN-TYPE TRANSISTOR STRUCTURE AND A PROCESS FOR FORMING THE ELECTRONIC DEVICE - An electronic device can include an insulating layer and a fin-type transistor structure. The fin-type structure can have a semiconductor fin and a gate electrode spaced apart from each other. A dielectric layer and a spacer structure can lie between the semiconductor fin and the gate electrode. The semiconductor fin can include channel region including a portion associated with a relatively higher V | 07-29-2010 |
| 20100190354 | INTERLAYER DIELECTRIC UNDER STRESS FOR AN INTEGRATED CIRCUIT - An integrated circuit that has logic and a static random access memory (SRAM) array has improved performance by treating the interlayer dielectric (ILD) differently for the SRAM array than for the logic. The N channel logic and SRAM transistors have ILDs with non-compressive stress, the P channel logic transistor ILD has compressive stress, and the P channel SRAM transistor at least has less compressive stress than the P channel logic transistor, i.e., the P channel SRAM transistors may be compressive but less so than the P channel logic transistors, may be relaxed, or may be tensile. It is beneficial for the integrated circuit for the P channel SRAM transistors to have a lower mobility than the P channel logic transistors. The P channel SRAM transistors having lower mobility results in better write performance; either better write time or write margin at lower power supply voltage. | 07-29-2010 |
| 20100191990 | VOLTAGE-BASED MEMORY SIZE SCALING IN A DATA PROCESSING SYSTEM - A memory has bits that fail as power supply voltage is reduced to reduce power and/or increase endurance. The bits become properly functional when the power supply voltage is increased back to its original value. With the reduced voltage, portions of the memory that include non-functional bits are not used. Much of the memory may remain functional and use is retained. When the voltage is increased, the portions of the memory that were not used because of being non-functional due to the reduced power supply voltage may then be used again. This is particularly useful in a cache where the decrease in available memory due to power supply voltage reduction can be implemented as a reduction in the number of ways. Thus, for example an eight way cache can simply be reduced to a four way cache when the power is being reduced or endurance increased. | 07-29-2010 |
| 20100230762 | INTEGRATED CIRCUIT USING FINFETS AND HAVING A STATIC RANDOM ACCESS MEMORY (SRAM) - An integrated circuit includes a logic circuit and a memory cell. The logic circuit includes a P-channel transistor, and the memory cell includes a P-channel transistor. The P-channel transistor of the logic circuit includes a channel region. The channel region has a portion located along a sidewall of a semiconductor structure having a surface orientation of (110). The portion of the channel region located along the sidewall has a first vertical dimension that is greater than a vertical dimension of any portion of the channel region of the P-channel transistor of the memory cell located along a sidewall of a semiconductor structure having a surface orientation of (110). | 09-16-2010 |
| 20100246297 | INTEGRATED CIRCUIT HAVING AN EMBEDDED MEMORY AND METHOD FOR TESTING THE MEMORY - A memory system has a first memory having an array of memory cells that includes a redundant column. The redundant column substitutes for a first column in the array. The first column includes a test memory cell. The array receives a power supply voltage. The test memory cell becomes non-functional at a higher power supply voltage than the memory cells of the array. A memory controller is coupled to the first memory and is for determining if the test memory cell is functional at a first value for the power supply voltage. This is useful in making decisions concerning the value of the power supply voltage applied to the array. | 09-30-2010 |
