| Patent application number | Description | Published |
|---|
| 20100043212 | PRINTED CIRCUIT BOARD BONDING DEVICE - The present invention relates to a bonding device for bonding a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The bonding device includes a support structure assembly and a first heater assembly arranged on the support structure assembly to be movable along a first path and configured to bond the flexible PCB to the printhead. A bending mechanism is arranged on the support structure and is configured to bend the bonded PCB. A second heater assembly is arranged on the support structure assembly to be movable along a second path and is configured to bond the bent PCB to the printhead carrier. A control system controls operation of the heater assemblies and the bending mechanism. | 02-25-2010 |
| 20100043217 | FASTENING APPARATUS WITH AUTHENTICATION SYSTEM - The present invention relates to a fastening apparatus for fastening a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The fastening apparatus includes a support assembly. An authentication system is arranged on the support assembly and is confinctionfigured to authenticate the printhead assembly. At least one bonding assembly is configured to bond the PCB to the printhead assembly. A controller is configured to control the bonding assembly to bond the PCB to the printhead assembly subsequent to the authentication of the printhead assembly. | 02-25-2010 |
| 20100043220 | METHOD FOR CONNECTING A FLEXIBLE PRINTED CIRCUIT BOARD (PCB) TO A PRINTHEAD ASSEMBLY - The present invention relates to a method for connecting a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The method includes the step of connecting the flexible PCB to the printhead using a first heater assembly movable along a first path. In turn, the connected PCB is then bent. The method further includes the step of connecting the bent PCB to the printhead carrier using a second heater assembly movable along a second path. | 02-25-2010 |
| 20100043960 | METHOD FOR LAMINATING A CARRIER FOR PRINTHEAD INTEGRATED CIRCUITRY - Provided is a method for laminating a carrier for printhead integrated circuits. The carrier includes a plurality of fiducials. The method includes the steps of receiving the carrier in a cradle platform, aligning each said fiducial with respective fiducials in a lamina having a series of such holes therein, and bonding the aligned lamina to the carrier, so that a printing fluid is able to pass through the laminated apertures after such bonding. | 02-25-2010 |
| 20100043977 | LAMINATING APPARATUS FOR A PRINTHEAD CARRIER SUB-ASSEMBLY - The invention relates to a laminating apparatus for laminating a printhead integrated circuit (IC) carrier sub-assembly and a lamination film. The apparatus includes a lamination support for receiving the carrier, a lamina supply for supplying a lamina defining said lamination film, and an alignment mechanism configured to align the lamination film with the IC carrier sub-assembly. Also included is a bonding apparatus configured to bond the lamination film to the IC carrier sub-assembly, and a control system to control operation of the lamina supply, alignment mechanism and bonding apparatus to facilitate automatic bonding of the lamination film to the surface of the carrier. | 02-25-2010 |
| 20100043979 | BONDING APPARATUS FOR PRINTHEADS - The invention relates to a bonding apparatus for bonding a carrier sheet used for carrying printhead integrated circuits to a carrier base. The apparatus includes a support assembly configured to receive and support the carrier base, and a lamination head arranged on the support assembly and configured to bond the carrier sheet to the carrier base. Further included are a conformal material supply mechanism arranged on the support assembly and configured to interpose a conformal material between the surface and the head prior to bonding, and a controller to control operation of the lamination head and the supply mechanism to facilitate bonding of the carrier sheet to the carrier base. | 02-25-2010 |
| 20100043980 | ALIGNMENT MECHANISM FOR ALIGNING AN INTEGRATED CIRCUIT - Provided is an alignment mechanism for aligning a lamination film with a carrier substructure prior to laminating the film to the substructure to form a carrier for integrated circuits. The substructure and the lamination film define complementary perforations and a plurality of respective fiducials. The alignment mechanism includes a sensor arrangement configured to detect the fiducials in the lamination film and substructure and a displacement mechanism configured to displace the lamination film with respect to the substructure to align the perforations of the film and substructure respectively according to alignment of their fiducials so that a printing fluid can pass through the perforations in the film and the substructure of the carrier. The mechanism also includes a controller configured to control operation of the sensor arrangement and the displacement mechanism. | 02-25-2010 |
| 20120006494 | PRINTED CIRCUIT BOARD BONDING DEVICE - A bonding device for bonding a flexible printed circuit board (PCB) to a printhead assembly includes an enclosed work area; a first heater assembly provided within the enclosed work area and movable along a first path; a bending mechanism provided within the enclosed work area and adapted to bend the bonded PCB; a second heater assembly provided within the enclosed work area and movable along a second path; a nest structure for receiving the printhead assembly, the nest structure movable along a third path; and a control system to control operation of the heater assemblies, bending mechanism, and nest structure. The first path and the second path are constrained to an area within the enclosed work area, and the third path crosses a boundary of the enclosed work area. | 01-12-2012 |
