| Patent application number | Description | Published |
|---|
| 20120029311 | SYSTEM AND METHOD FOR STORING AND FORWARDING DATA FROM A VITAL-SIGNS MONITOR - A vital-signs patch for a patient monitoring system that includes a housing containing a sensor that makes physiological measurements of a patient, a transmitter, a receiver, a memory, and a processor. The processor periodically takes a measurement from the sensor, converts the measurement to a data record, and stores the data record in the memory. Upon receipt of a signal from another device, the processor retrieves at least a portion of the data record, converts the retrieved portion of the data record to a vital-sign signal, and causes the transmitter to transmit the vital-sign signal to the other device. | 02-02-2012 |
| 20120029312 | SYSTEM AND METHOD FOR LOCATION TRACKING OF PATIENTS IN A VITAL-SIGNS MONITOR SYSTEM - Systems and methods of tracking a patient within a facility via a vital-signs patch attached to the patient are disclosed. A first signal is received from a bridge, the first signal comprising information indicative of a vital-signs patch attached to a patient. The patient is identified based at least in part on the information. Location of the patient is determined based on a known location of the bridge within the facility. | 02-02-2012 |
| 20120029315 | SYSTEM AND METHOD FOR CONSERVING BATTERY POWER IN A PATIENT MONITORING SYSTEM - A vital-signs patch in a patient monitoring system is disclosed. The patch includes a housing configured to be attached to the skin of a patient, the housing containing a radio that can selectably transmit and receive on more than one frequency and a processor. The processor configures the radio to transmit and receive on a determined frequency based at least in part on the level of noise detected on the frequencies. | 02-02-2012 |
| 20120029316 | SYSTEM AND METHOD FOR SAVING BATTERY POWER IN A PATIENT MONITORING SYSTEM - A vital-signs patch for a patient monitoring system is disclosed. The patch consists of a housing that is configured to be worn on the skin of a patient. The housing contains a radio, one or more sensor interfaces, a processor, and a battery. The processor can selectably turn portions of the processor off and on and selectably turn power off and on to at least a portion of the sensor interfaces and radio. The processor includes a timer that, each time the timer times out, will turn all the parts of the processor on and start a new timing period. When the processor receives a signal, the processor will turn off power to at least a portion of the processor and at least a portion of the sensor interfaces. | 02-02-2012 |
| 20120030547 | SYSTEM AND METHOD FOR SAVING BATTERY POWER IN A VITAL-SIGNS MONITOR - A vital-signs device in a patient monitoring system is disclosed. The patch includes a housing configured to be attached to the skin of a patient. The housing contain monitoring circuitry configured to acquire and store measurements of vital signs of the patient, a wireless transmitter configured to transmit signals to another device, a wireless receiver configured to receive signals from the other device; and a processor operably connected to the monitoring circuitry, transmitter, and receiver. Upon receipt of an upload signal from the other device, the processor is configured to send a message to the other device via the transmitter. The message packet structure includes a data payload of variable size, a header containing transmit and route information and data payload length, and a data integrity check value. | 02-02-2012 |
| Patent application number | Description | Published |
|---|
| 20080261343 | VACUUM PACKAGED SINGLE CRYSTAL SILICON DEVICE - A method for forming a vibrating micromechanical structure having a single crystal silicon (SCS) micromechanical resonator formed using a two-wafer process, including either a Silicon-on-insulator (SOI) or insulating base and resonator wafers, wherein resonator anchors, capacitive air gap, isolation trenches, and alignment marks are micromachined in an active layer of the base wafer; the active layer of the resonator wafer is bonded directly to the active layer of the base wafer; the handle and dielectric layers of the resonator wafer are removed; windows are opened in the active layer of the resonator wafer; masking the active layer of the resonator wafer with photoresist; a SCS resonator is machined in the active layer of the resonator wafer using silicon dry etch micromachining technology; and the photoresist is subsequently dry stripped. A patterned SCS cover is bonded to the resonator wafer resulting in hermetically sealed chip scale wafer level vacuum packaged devices. | 10-23-2008 |
| 20080261344 | VACUUM PACKAGED SINGLE CRYSTAL SILICON DEVICE - A method for forming a vibrating micromechanical structure having a single crystal silicon (SCS) micromechanical resonator formed using a two-wafer process, including either a Silicon-on-insulator (SOI) or insulating base and resonator wafers, wherein resonator anchors, capacitive air gap, isolation trenches, and alignment marks are micromachined in an active layer of the base wafer; the active layer of the resonator wafer is bonded directly to the active layer of the base wafer; the handle and dielectric layers of the resonator wafer are removed; windows are opened in the active layer of the resonator wafer; masking the active layer of the resonator wafer with photoresist; a SCS resonator is machined in the active layer of the resonator wafer using silicon dry etch micromachining technology; and the photoresist is subsequently dry stripped. A patterned SCS cover is bonded to the resonator wafer resulting in hermetically sealed chip scale wafer level vacuum packaged devices. | 10-23-2008 |
| 20080261372 | METHOD OF MANUFACTURING VIBRATING MICROMECHANICAL STRUCTURES - A method for fabrication of single crystal silicon micromechanical resonators using a two-wafer process, including either a Silicon-on-insulator (SOI) or insulating base and resonator wafers, wherein resonator anchors, a capacitive air gap, isolation trenches, and alignment marks are micromachined in an active layer of the base wafer; the active layer of the resonator wafer is bonded directly to the active layer of the base wafer; the handle and dielectric layers of the resonator wafer are removed; viewing windows are opened in the active layer of the resonator wafer; masking the single crystal silicon semiconductor material active layer of the resonator wafer with photoresist material; a single crystal silicon resonator is machined in the active layer of the resonator wafer using silicon dry etch micromachining technology; and the photoresist material is subsequently dry stripped. | 10-23-2008 |
| 20090007413 | METHOD OF MANUFACTURING VIBRATING MICROMECHANICAL STRUCTURES - A method for fabrication of single crystal silicon micromechanical resonators using a two-wafer process, including either a Silicon-on-insulator (SOI) or insulating base and resonator wafers, wherein resonator anchors, a capacitive air gap, isolation trenches, and alignment marks are micromachined in an active layer of the base wafer; the active layer of the resonator wafer is bonded directly to the active layer of the base wafer; the handle and dielectric layers of the resonator wafer are removed; viewing windows are opened in the active layer of the resonator wafer; masking the single crystal silicon semiconductor material active layer of the resonator wafer with photoresist material; a single crystal silicon resonator is machined in the active layer of the resonator wafer using silicon dry etch micromachining technology; and the photoresist material is subsequently dry stripped. | 01-08-2009 |
| 20100203718 | MITIGATION OF HIGH STRESS AREAS IN VERTICALLY OFFSET STRUCTURES - Alternative methods of constructing a vertically offset structure are disclosed. An embodiment includes forming a flexible layer having first and second end portions, an intermediate portion coupling the first and second portions, and upper and lower surfaces. The distance between the upper and lower surfaces at the intermediate portion is less than the distance between the upper and lower surfaces at the first and second end portions. The first end portion is bonded to a base member. The second end portion of the flexible layer is deflected until the second end portion contacts the base member. The second end portion is bonded to the base member. | 08-12-2010 |
