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Jaeschke, DE
Axel Jaeschke, Minden DE
| Patent application number | Description | Published |
|---|---|---|
| 20080199340 | Screw Displacement Pump - The invention relates to a screw pump of single-entry, double-shaft construction with an external bearing of the two screw shafts ( | 08-21-2008 |
| 20110064592 | Underwater Delivery Unit - The invention relates to an underwater delivery unit with a pump and a drive device that is sealed against the surrounding water and a process medium. According to the invention, the pump ( | 03-17-2011 |
Birger Jaeschke, Backnang DE
| Patent application number | Description | Published |
|---|---|---|
| 20100133249 | Method and device for controlling a power source and power source having such a device - The invention relates to a method for controlling the power source of a welding, cutting or plasma coating system, wherein the power source comprises a measuring part and a controllable clocked power part and wherein a measure value, which represents a measure of a characteristic variable, that is to be controlled, of the power part, is determined by means of the measuring part, and wherein the measure value is used for controlling the power part. In order to develop the method in such a way that a measure of the characteristic variable to be controlled can be determined within a short time, it is proposed according to the invention that a measured variable correlating with the characteristic variable to be controlled of the power part is at least approximately integrated starting from a prescribed initial value over a prescribed integration time, the duration of which corresponds to one or more clock periods of the clocked power part, and the measure value is determined from the integration value obtained in this way, and that this process is continuously repeated. A device for carrying out the method and a power source having such a device are also proposed. | 06-03-2010 |
Britta Jaeschke, Stuttgart DE
| Patent application number | Description | Published |
|---|---|---|
| 20090274605 | CONTINUOUS SILAZANE CLEAVAGE METHOD - The invention relates to a continuous silazane cleavage method, especially for use in the production of molecular precursors for non-oxidic inorganic ceramics. | 11-05-2009 |
Christoph Jaeschke, Tuebingen DE
| Patent application number | Description | Published |
|---|---|---|
| 20080216030 | System for Performing Verification of Logic Circuits - The present invention relates to a system for verifying the proper operation of a digital logic circuit and program product therefor. In order to add a useful alternative in the field of functional, exhaustive simulation and of symbolic simulation, it is proposed to perform the steps of: | 09-04-2008 |
| 20080276140 | SEMICONDUCTOR CHIP WITH A PLURALITY OF SCANNABLE STORAGE ELEMENTS AND A METHOD FOR SCANNING STORAGE ELEMENTS ON A SEMICONDUCTOR CHIP - A semiconductor chip subdivided into power domains, at least one of the power domains is separately activated or deactivated and at least a part of the scannable storage elements are interconnected to one or more scan chains. At least one scan chain is serially subdivided into scan chain portions and the scan chain portion is arranged within one of the power domains. For at least one scan chain portion a bypass line is provided for passing by scan data and at least one select unit is provided for selecting between the bypass line and the corresponding scan chain portion in dependence of the activated or deactivated state of the corresponding power domains. | 11-06-2008 |
| 20090132983 | Driving Values to DC Adjusted/Untimed Nets to Identify Timing Problems - An apparatus and computer program product for driving values to “don't care” (DC) adjusted/untimed nets of an integrated circuit design to thereby identify timing problems are provided. The apparatus and computer program product may be utilized, for example, with logical built-in self test (LBIST) testing of an integrated circuit in which the DC adjusted (dcadj) nets for normal functional mode of the integrated circuit may not be DC adjusted for LBIST mode. By using the apparatus and computer program product, timing related problems associated with DC adjusted/untimed nets can be made apparent either by using simulation or semi-formal/formal analysis. For example, with regard to DC adjusted/untimed nets, the apparatus and computer program product may identify any violations of these nets with regard to maintaining their DC adjusted values. Such identification of violations of DC adjusted/untimed nets may be made without interfering with the static timing analysis of timed nets. | 05-21-2009 |
Edgar Jaeschke, Filderstadt DE
| Patent application number | Description | Published |
|---|---|---|
| 20080255017 | Adhesive Agent For Sanitary Cleaning And Deodorization - The invention concerns a sanitary agent for cleaning and/or disinfecting and/or diffusing perfume, said agent being adapted to be applied directly on the sanitary ware to which it adheres, only to be evacuated by being rinsed off after many of rinsing operations, and said agent comprising solvents, in particular water, surfactants and an adhesive belonging in particular to the group of nonionic surfactants or nonionic emulsifiers, a bleaching agent belonging to the group of oxygen- or halogen-releasing agents, and optionally other standard constituents such as thickening agents, dyes, preservatives, odorant substances, bleaching agents, bleaching agent stabilizers and/or activators. | 10-16-2008 |
| 20110142784 | Adhesive agent for application on a sanitary object - An agent for the sanitary sector, which agent can be applied directly on the sanitary object, adheres there and can be flushed away only after a relatively large number of flushing operations. The agent includes fillers from the group of surfactants and also an adhesion promoter. The adhesion promoter is selected from the group of polyalkylene derivatives which include polyalkylene chains with randomly distributed functional groups, or from the group of copolymers from the group of monoalkylesters of poly/methyl vinylethers/carboxylic anhydrides, olefin homopolymers and copolymers of two or more olefins being partially oxidized or further functionalized via graft molecules, and from the group of polyalkyleneimines, also in alkoxylated form, polyether amines (alkoxylated amines) and polyglycerol polyether alkylcarboxylic acids or polymers or derivatives containing these polymer groups. The viscosity of the agent is at least 30 Pas, measured using a Haake viscometer, plate/plate system, plate diameter 10 mm, at a shear gradient of 2.62 s | 06-16-2011 |
| 20110142785 | Adhesive agent for application on a sanitary object - An agent for the sanitary sector, which agent can be applied directly on a sanitary object, adheres there and can be flushed away only after a relatively large number of flushing operations. The agent includes fillers from the group of surfactants and also an adhesion promoter. The adhesion promoter is selected from hydrogenated polystyrene derivatives and olefin homopolymers and copolymers of two or more olefins, where the olefin homopolymers and copolymers may also be partially hydrogenated, and the viscosity of the agent is at least 30 Pas, measured using a Haake viscometer, plate/plate system, plate diameter 10 mm, at a shear gradient of 2.62 s | 06-16-2011 |
Holger Jaeschke, Suepitz DE
| Patent application number | Description | Published |
|---|---|---|
| 20090203716 | Pyrimidine low molecular weight ligands for modulating hormone receptors - Disclosed herein are small molecule modulators hormone receptors, including agonists and antagonists of luteinizing hormone/choriogonadotropin, follicle stimulating hormone and thyroid stimulating hormone receptors. Exemplary disclosed compounds include those of the formula | 08-13-2009 |
Klaus Jaeschke, Magdeburg DE
| Patent application number | Description | Published |
|---|---|---|
| 20110293364 | TURNBUCKLE FOR JOINING STRUCTURAL ELEMENTS - The Invention relates to a turnbuckle for joining structural elements, in particular prefabricated concrete parts, which is formed substantially in the shape of a shell and has a housing chamber accessible at least from outside via an access opening and, in addition, passage sections which are preferably located opposite one another and open into the housing chamber and which are preferably configured as passage openings for fixing means to be pushed through. In addition, the present Invention relates to a kit for joining structural elements, to a method for joining structural elements, to an arrangement for joining structural elements and to a method for preparing structural elements. | 12-01-2011 |
Peter Jaeschke, Handeloh DE
| Patent application number | Description | Published |
|---|---|---|
| 20120132354 | METHOD FOR JOINING COMPONENTS - The invention relates to a method for joining components ( | 05-31-2012 |
Romy Jaeschke, Chemnitz DE
| Patent application number | Description | Published |
|---|---|---|
| 20110236690 | Polymer laminar composite having improved layer adhesion - The present invention provides a polymer laminar composite including a first layer and a second layer at least partially in contact with the first layer. The first layer includes a polyurethane polymer which is the reaction product of a polyisocyanate A) and/or a polyisocyanate prepolymer B) with an at least difunctional, isocyanate-group-reactive compound C) and a monomeric, monofunctional aromatic alcohol. The second layer includes polymeric thiophene of the formula (I), substituted at the 3 and/or 4 position: | 09-29-2011 |
Stefan Jaeschke, Stuttgart DE
| Patent application number | Description | Published |
|---|---|---|
| 20100168596 | METHOD OF MONITORING A FETAL HEART RATE - The invention relates to a method of monitoring a fetal heart rate, the method comprising: providing a first measurement head ( | 07-01-2010 |
Thomas Jaeschke, Burgkirchen DE
| Patent application number | Description | Published |
|---|---|---|
| 20100056027 | Method For Polishing A Semiconductor Wafer - Semiconductor wafers are CMP polished by polishing the rear side of the semiconductor wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is higher at the center than at the edge of the rear side; and polishing the front side of the wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is lower in the center of the front side than in an edge region of the front side. | 03-04-2010 |