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Jaehyun
Jaehyun Cho, Seoul KR
| Patent application number | Description | Published |
|---|---|---|
| 20110032443 | SENSING CIRCUIT AND DISPLAY APPARATUS INCLUDING THE SAME - A sensing circuit includes a sensor array, a first controller and a second controller. The sensor array is charged by a sensing signal corresponding to an external light in response to a driving signal during a first time period and discharged in response to a switching signal during a second time period. The first controller provides the driving signal to the sensor array. The second controller provides the switching signal to the sensor array. | 02-10-2011 |
Jaehyun Lee, Sungnam-City KR
| Patent application number | Description | Published |
|---|---|---|
| 20120119360 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONNECTION STRUCTURE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching a connection post to the substrate, the connection post having a post top and a post side; mounting an integrated circuit die on the substrate, the integrated circuit die having a top die surface; and forming a package body on the substrate, the connection post, and the integrated circuit die. | 05-17-2012 |
Jaehyun Lee, Hwaseong-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100144474 | BELT UNIT FOR CONTINUOUSLY VARIABLE TRANSMISSION - A belt unit for a continuously variable transmission that transmits power from a primary pulley to a secondary pulley, may include at least a band overlapped each other, and a segment including a body base and a locking end portion which are connected by a neck therebetween, wherein an upper surface of the at least a band is coupled to the locking end portion and a lower surface of the at least a band is coupled to a segment shoulder of the body base, and wherein lower grooves are formed at lower portions of the neck between the neck and the segment shoulder of the body base at both sides of the neck such that an upper surface of the respective body base is higher than the corresponding lower groove to form a contact radius difference between the lower groove and the upper surface of the body base. | 06-10-2010 |
Jaehyun Lim, Kyoungki-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20110095403 | Semiconductor Device and Method of Forming a Shielding Layer over a Semiconductor Die Disposed in a Cavity of an Interconnect Structure and Grounded through the Die TSV - A semiconductor device has an interconnect structure with a cavity formed partially through the interconnect structure. A first semiconductor die is mounted in the cavity. A first TSV is formed through the first semiconductor die. An adhesive layer is deposited over the interconnect structure and first semiconductor die. A shielding layer is mounted over the first semiconductor die. The shielding layer is secured to the first semiconductor die with the adhesive layer and grounded through the first TSV and interconnect structure to block electromagnetic interference. A second semiconductor die is mounted to the shielding layer and electrically connected to the interconnect structure. A second TSV is formed through the second semiconductor die. An encapsulant is deposited over the shielding layer, second semiconductor die, and interconnect structure. A slot is formed through the shielding layer for the encapsulant to flow into the cavity and cover the first semiconductor die. | 04-28-2011 |
Jaehyun Lim, Seoul KR
| Patent application number | Description | Published |
|---|---|---|
| 20090294941 | PACKAGE-ON-PACKAGE SYSTEM WITH HEAT SPREADER - A package-on-package system includes: providing a base substrate; mounting an integrated circuit on the base substrate; positioning a stacking interposer over the integrated circuit; and forming a heat spreader base around the integrated circuit by coupling the base substrate and the stacking interposer to the heat spreader base. | 12-03-2009 |
| 20100025835 | INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM - An integrated circuit package stacking system includes: forming a flexible substrate by: providing an insulating material, forming a stacking pad on the insulating material, forming a coupling pad on the insulating material, and forming a trace between the stacking pad and the coupling pad; providing a package substrate; coupling an integrated circuit to the package substrate; and applying a conductive adhesive on the package substrate for positioning the flexible substrate over the integrated circuit and coupling the flexible substrate on the conductive adhesive. | 02-04-2010 |
| 20110255591 | METHOD AND APPARATUS FOR PROCESSING VIDEO DATA - A method for signalling an intra chroma prediction mode and a method for implementing the signalled intra chroma prediction mode, the intra chroma prediction mode taking an intropolation of previously predicted luma samples from neighboring blocks of video data to attain an intra chroma prediction of a current chroma prediction unit. | 10-20-2011 |
| 20110280304 | INTRA PREDICTION MODES - New intra angular prediction modes and methods for decoding are offered for providing greater accuracy when processing predictions of digital video data blocks. One new method considers predicting a current prediction sample by taking the linear interpolation of two previously reconstructed reference samples that lay along a common angular line. Another new method offers a method for making previously unavailable samples from a neighboring block available as reference samples when predicting a current prediction sample. Another new method considers a new combined intra prediction mode that utilizes a local mean to predict a current prediction sample. And a new decoding method offers to rearrange the order in which video data blocks are predicted based on the intra prediction mode used for predicting the video data blocks. | 11-17-2011 |
| 20110292994 | ENHANCED INTRA PREDICTION MODE SIGNALING - A method and apparatus for signaling and receiving a video signal for processing is disclosed. Methods for determining a most probable mode for predicting a current prediction block are provided as well as new methods for grouping intra prediction modes into prediction groups. Methods for predicting a prediction block of video data as well as signaling intra prediction modes are also provided. | 12-01-2011 |
| 20110293001 | NEW PLANAR PREDICTION MODE - New intra planar modes are introduced for predicting digital video data. As part of the new intra planar modes, various methods are offered for predicting a first sample within a prediction unit, where the first sample is needed for referencing to when processing the new intra planar modes. And once the first sample is successfully predicted, the new intra planar modes are able to predict a sample of video data within the prediction unit by processing a bi-linear interpolation of four previously reconstructed reference samples. | 12-01-2011 |
Jaehyun Park, Gyeonggi-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20110319123 | USER EQUIPMENT APPARATUS FOR TRANSMITTING A PLURALITY OF SIGNALS SIMULTANEOUSLY USING AT LEAST TWO WIRELESS COMMUNICATION SCHEMES AND METHOD THEREOF - A user equipment (UE) of a wireless communication system is disclosed. A second receiving module, of a second wireless communication chip, is configured for receiving a transmission power value of a first signal configured to be transmitted from a first wireless communication chip of the UE. A second transmission power value determining module, of the second wireless communication chip, is configured for determining a transmission power value of a second signal configured to be transmitted from the second wireless communication chip, the determination based on the received transmission power value of the first signal and a predefined specific absorption rate (SAR) condition, wherein the first wireless communication chip is configured for transmitting the first signal using a first wireless communication scheme, wherein the second wireless communication chip is configured for transmitting the second signal using a second wireless communication scheme simultaneously with the transmission of the first signal by the first wireless communication chip. | 12-29-2011 |
Jaehyun Park, Osan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100043654 | PRINTING PLATE AND METHOD OF PRINTING AN ALIGNMENT FILM USING THE SAME - The present disclosure relates to the device and the method for printing an alignment film. The printing plate comprises: a resin plate; a plurality of pixel array embossing pattern formed on the resin plate, for printing the alignment film to a pixel array formed on the glass substrate of the liquid crystal display device; a plurality of dummy embossing pattern formed on the resin plate at which the pixel array embossing patterns are not formed as seeing in the rotating direction of the printing roller; and a grooved pattern formed on the resin plate between the pixel array embossing patterns and between the dummy embossing patterns. | 02-25-2010 |
Jaehyun Park, Seoul KR
| Patent application number | Description | Published |
|---|---|---|
| 20120133195 | Assembling Structure For Wheel and Hub of Electric Bicycle - An assembling structure for wheel and hub of an electric bicycle is disclosed, the structure capable of firmly assembling a hub and a wheel by separately manufacturing the hub embedded with a motor and a transmission gear box from the wheel, the structure including a hub accommodating a motor therein, a wheel coupled to one side of the wheel by way of a sliding method, a groove unit circumferentially arranged at a periphery of the hub, and a lug unit formed at an area coupled to the hub of the wheel and meshed with the groove unit to allow the wheel to rotate with the hub, whereby coupling of the wheel and the hub is simplified to reinforce the coupling force therebetween. | 05-31-2012 |
Jaehyun Yoo, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20110313565 | Substrate Processing Apparatus And Method For Loading And Unloading Substrates - Provided is a substrate processing apparatus for loading substrates such as solar cell substrates on a tray in substrate processing equipment for processing a large number of substrates. The substrate processing apparatus includes: a tray carrying unit configured to receive and carry a tray; a substrate loading conveyor unit on which substrates to be loaded on a tray are arranged in a line; a substrate unloading conveyor unit on which substrates unloaded from a tray are arranged in a line; a first substrate carrying robot configured to pick up substrates from the substrate loading conveyor unit and carry the substrates to a tray placed on the tray carrying unit; and a second substrate carrying robot configured to pick up substrates from a tray placed on the tray carrying unit and carry the substrates to the substrate unloading conveyor unit. | 12-22-2011 |