Patent application number | Description | Published |
20120320493 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - There are provided a multilayer ceramic electronic component and a manufacturing method thereof. The multilayer ceramic electronic component includes: a body part including internal electrodes and dielectric layers and having at least one connection surface to which a portion of the internal electrodes are exposed; external electrodes coupled to the connection surface to thereby be electrically connected to the internal electrodes; and protective layers provided on the connection surface so as to shield at least portions of the internal electrodes exposed at the connection surface, wherein a width of an exposed part of the internal electrode shielded by the protective layer has 0.8 to 0.9 of that of an overall width of the internal electrode. | 12-20-2012 |
20130229749 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component, including: a ceramic sintered body having a plurality of dielectric layers laminated therein; first and second capacitance portions being formed on surfaces of the dielectric layers; first and second lead-out portions being respectively extended from both sides of the first and second capacitance portions to be respectively exposed through both side surfaces of the ceramic sintered body and spaced apart from each other; sealing parts enclosing both end portions and corner portions of the ceramic sintered body; and first and second external electrodes enclosing the sealing parts and formed on both end portions of the ceramic sintered body to be electrically connected to the first and second lead-out portions, respectively. | 09-05-2013 |
20130241361 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF - There is provided a multilayer ceramic electronic component, including: a ceramic element including a plurality of dielectric layers laminated therein; a plurality of first and second internal electrodes formed on dielectric layers positioned in a middle portion of the ceramic element and alternately exposed from both ends of the ceramic element; a plurality of dummy electrodes formed on dielectric layers positioned in upper and lower portions of the ceramic element, respectively; and first and second external electrodes formed on both ends of the ceramic element and electrically connected to the exposed portions of the first and second internal electrodes, wherein the length of each of the dummy electrodes is longer than that of the first and second external electrodes covering the ceramic element. | 09-19-2013 |
20130242460 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There are provided a multilayer ceramic electronic component and a method of manufacturing the same, the multilayer ceramic electronic including: a ceramic body; and a plurality of internal electrodes laminated within the ceramic body, wherein, when T1 is the greatest distance between an upper outermost internal electrode and a lower outermost internal electrode among the plurality of internal electrodes and T2 is the distance between the highest point and the lowest point in each of the upper outermost internal electrode and the lower outermost internal electrode in a thickness direction of the ceramic body, T2/T1<0.05 is satisfied, and thus, defects in alignment of internal electrodes of the multilayer ceramic electronic component may be suppressed. | 09-19-2013 |
20130250480 | MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multi-layer ceramic electronic component including: a ceramic sintered body in which a plurality of dielectric layers are laminated; first and second internal electrodes formed in the ceramic sintered body; first and second external electrodes formed on both ends of the ceramic sintered body while covering a circumference thereof, and electrically connected to the first and second internal electrodes; and a sealing part including a glass component and formed in a gap between an outer surface of the ceramic sintered body and ends of the first and second external electrodes. | 09-26-2013 |
20130258551 | CONDUCTIVE PASTE COMPOSITION FOR INTERNAL ELECTRODE AND MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING THE SAME - There are provided a conductive paste composition for an internal electrode and a multilayer ceramic capacitor including the same. The conductive paste composition for an internal electrode includes metal powder; and chrome oxide (Cr | 10-03-2013 |
20140043721 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There are provided a multilayer ceramic electronic component and a method of manufacturing the same, the multilayer ceramic electronic component, including: a ceramic body including a plurality of dielectric layers laminated therein, each dielectric layer having an average thickness of 0.65 μM or less; internal electrodes disposed to face each other while having each dielectric layer interposed therebetween in the ceramic body; and external electrodes electrically connected to the internal electrodes, wherein, when td denotes the average thickness of each of the dielectric layers and te denotes an average thickness of each of the internal electrodes, te/td≦0.77 is satisfied. | 02-13-2014 |
20140085852 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes formed on at least one surfaces of the dielectric layers and alternately exposed through both end surfaces of the ceramic body in a length direction of the ceramic body; a first acoustic noise absorption layer formed on one surface of the ceramic body in a stacking direction of the dielectric layers and having a thickness of 3 μm to 500 μm; first and second external electrodes formed on both end surfaces of the ceramic body and electrically connected to exposed portions of the first and second internal electrodes; and a printed circuit board having the first and second external electrodes mounted thereon while facing the first acoustic noise absorption layer. | 03-27-2014 |
20140126104 | MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - There is provided a multilayered ceramic electronic component including: a ceramic body including dielectric layers having an average thickness of 0.6 μm or less; and first and second internal electrodes, wherein the ceramic body includes a capacitance formation part and a non-capacitance formation part provided on at least one surface of upper and lower surfaces of the capacitance formation part, and when the capacitance formation part is divided into three regions in a thickness direction of the ceramic body, in a central region among the three regions, dielectric grains have an average particle size of 150 nm or less, and the number of dielectric grains per layer is 4 or more, and in upper and lower regions, dielectric grains have an average particle size of 200 nm or less, respectively, and the number of dielectric grains per layer is 3 or more. | 05-08-2014 |
20140146436 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - Multilayer ceramic electronic component includes: a ceramic body including dielectric layers and having first and second main surfaces, first and second side surfaces, and first and second end surfaces; a first internal electrode including a capacitance forming portion having an overlap region for forming capacitance and a first lead-out portion extended from the capacitance forming portion to be exposed to the first side surface; a second internal electrode alternately stacked with the first internal electrode, having the dielectric layer interposed therebetween, insulated from the first internal electrode, and having a second lead-out portion extended from the capacitance forming portion to be exposed to the first side surface; first and second external electrodes connected to the first and second lead-out portions, respectively; an insulation layer. | 05-29-2014 |
20140160615 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - A multilayer ceramic electronic component including: a ceramic main body including a dielectric layer and having first and second main surfaces opposing one another, first and second lateral surfaces opposing one another, and first and second end surfaces opposing one another; a first internal electrode formed within the ceramic main body, including a capacitance formation part having an overlap region to form capacitance and a first lead out portion extending from the capacitance formation part so as to be exposed to the first lateral surface; a second internal electrode alternately laminated together with the first internal electrode, having a second lead out portion extending from the capacitance formation part so as to be exposed to the first lateral surface; first and second external electrodes; and insulating layers. | 06-12-2014 |
20140160617 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor, and a method of manufacturing the same, the multilayer ceramic capacitor including: a ceramic body; a first internal electrode; a second internal electrode; a first external electrode; a second external electrode; and an insulating layer. | 06-12-2014 |
20140160618 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes alternately formed on the plurality of dielectric layers and including first and second lead-out parts having an overlap area exposed to one surface of the ceramic body, respectively; first and second external electrodes formed on one surface of the ceramic body and electrically connected to the first and second lead-out parts, respectively; and a first insulating layer formed on one surface of the ceramic body to cover exposed portions of the first and second lead-out parts, wherein the first and second lead-out parts are formed to have concave-convex portions alternating with each other in the overlap area therebetween. | 06-12-2014 |
20140160619 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component, including a ceramic body including dielectric layers, and having first and second main surfaces, first and second side surfaces and first and second end surfaces; first and second internal electrodes having overlap regions forming a capacitance part, the first internal electrodes having a first lead out portion to be exposed to the first side surface, and being alternately laminated with the second internal electrodes while being insulated therefrom, the second internal electrodes having a second lead out portion; first and second external electrodes connected to the first and second lead out portions, respectively; and an insulating layer formed on the first side surface, wherein a length of the first lead out portion is longer than that of the second lead out portion and the capacitance part has different distances from the first side surface. | 06-12-2014 |
20140160620 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component, including: a ceramic body having first and second main surfaces, first and second side surfaces, and first and second end surfaces; a first block including first and second internal electrodes having overlap regions which form a capacitance part; one or more second blocks each including third and fourth internal electrodes having overlap regions which form a capacitance part; a first external electrode connected to the first and third lead out portions and a second external electrode connected to the second and fourth lead out portions; and an insulating layer formed on the first side surface of the ceramic body, wherein the second blocks are disposed on upper and lower parts of the first block. | 06-12-2014 |
20140160621 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A multilayer ceramic capacitor includes a ceramic body; first and second internal electrodes including first and second body parts overlapped with each other and first and second lead-out parts having an overlap region and exposed to one surface of the ceramic body; first and second external electrodes formed on one surface of the ceramic body; and an insulating layer formed on one surface of the ceramic body, wherein first and second connection surfaces extended from end portions of the first and second body parts to end portions of the first and second lead-out parts are inclined, and when half of length of the internal electrode is defined as A and length from a center of the ceramic body to a starting point of the connection surface is defined as B, B/A satisfies 0.03≦B/A≦0.90. | 06-12-2014 |
20140168851 | MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD WITH MULTILAYER CERAMIC CAPACITOR MOUNTED THERE ON - A multilayer ceramic capacitor includes a ceramic body having first and second main surfaces opposing one another, first and second lateral surfaces opposing one another, and first and second end surfaces opposing one another. First and second internal electrodes have an overlap region with lead out portions exposed to the first lateral surface of the ceramic body. An insulating layer is formed to cover the overlap region of the lead out portions exposed to the first lateral surface of the ceramic body; and first and second external electrodes are formed on the first lateral surface of the ceramic body on which the insulating layer is formed and electrically connected to the first and second internal electrodes. Thicknesses of the insulating layer from the first lateral surface and the first and second external electrodes from the first lateral surface are specified. | 06-19-2014 |
20140240895 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A multilayer ceramic capacitor includes a ceramic body having dielectric layers laminated therein; an active layer including first and second internal electrodes alternately exposed through end surfaces of the ceramic body having the dielectric layer interposed therebetween; upper and lower cover layers formed above and below the active layer; first and second external electrodes formed on end surfaces of the ceramic body, respectively; first and second dummy patterns extended from the first and second external electrodes into margin portions of the active layer in a length direction, respectively; and first and second dummy electrodes opposing each other in a length direction within the upper and lower cover layers, the first and second dummy electrodes being extended inwardly from the first and second external electrodes. | 08-28-2014 |
20140307362 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING BOARD THEREFOR - There are provided a multilayer ceramic electronic component and a mounting board therefor, the multilayer ceramic electronic component, including a ceramic body having a hexahedral shape, including dielectric layers, and satisfying T/W | 10-16-2014 |
20140311783 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME - A multilayer ceramic electronic component includes a ceramic main body including dielectric layers and satisfying T/W>1.0 when W and T are width and thickness, respectively; and first and second internal electrodes stacked in the ceramic main body and facing each other with the dielectric layer interposed therebetween, the ceramic main body including an active layer corresponding to a capacitance forming portion contributing to capacitance formation and a cover layer corresponding to a non-capacitance forming portion provided on at least one of uppermost and lowermost surfaces of the active layer, and when the active layer is divided into three regions in a direction in which the first and second internal electrodes are stacked, an average width of internal electrodes in a central region of the three regions is Wa, and an average width of internal electrodes in upper and lower regions of the three regions is Wb, 0.920≦Wb/Wa≦0.998 is satisfied. | 10-23-2014 |
20140311789 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME - There is provided a multilayer ceramic electronic component including, a ceramic body including a plurality of dielectric layers stacked in a thickness direction, satisfying T/W>1.0 when a width and a thickness thereof are defined as W and T, respectively, and having a groove portion inwardly recessed in a length direction in at least one main surface thereof, a plurality of first and second internal electrodes disposed in the ceramic body to face each other, having the dielectric layers interposed therebetween, and alternately exposed through both end surfaces of the ceramic body, and first and second external electrodes formed to extend from the both end surfaces of the ceramic body to the at least one main surface having the groove portion formed therein. | 10-23-2014 |
20140318841 | MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME - There is provided a multilayered ceramic electronic component including a ceramic body having a hexahedral shape, including a dielectric layer, satisfying T/W>1.0 when a length thereof is L, a width thereof is W, and a thickness thereof is T, and having first and second main surfaces, first and second end surfaces, and first and second side surfaces, a plurality of first and second internal electrodes, and first and second external electrodes electrically connected to the first and second internal electrodes, wherein the first and second external electrodes are electrically connected to the exposed portions of the first and second internal electrodes, include first and second head parts formed on the first and second end surfaces, and first and second band parts formed on the first and second main surfaces, and are not formed on the first and second side surfaces. | 10-30-2014 |
20140318842 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME - There is provided a multilayer ceramic electronic component includes: a ceramic body including dielectric layers stacked therein and satisfying T(thickness)/W(width)>1.0; first and second internal electrodes disposed to face each other in the ceramic body, having the dielectric layer disposed therebetween, and alternately exposed through end surfaces of the ceramic body; and first and second external electrodes extended from the end surfaces of the ceramic body to upper and lower main surfaces of the ceramic body wherein, when a height of the ceramic body is defined as a, and a distance from an upper end of the first or second external electrode formed on the upper main surface of the ceramic body to a lower end of the first or second external electrode formed on the lower main surface of the ceramic body is defined as b, 0.990≦a/b<1 is satisfied. | 10-30-2014 |
20140318843 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING BOARD THEREFOR - There is provided a multilayer ceramic electronic component including a ceramic body satisfying T/W>1.0 when a width and a thickness thereof are defined as W and T, respectively, a plurality of first and second internal electrodes having the respective dielectric layers interposed therebetween, and alternately exposed through both end surfaces of the ceramic body, and first and second external electrodes formed to be extended from the both end surfaces to both upper and lower main surfaces of the ceramic body, wherein, the ceramic body is formed such that a cross-section thereof in a width-thickness direction has a trapezoidal shape in which two sides among four sides are inclined in one direction, and when an angle formed by a bottom side and a side connected thereto is defined as θ, 86°≦θ<90° is satisfied. | 10-30-2014 |
20140318844 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING BOARD THEREFOR - There are provided a multilayer ceramic electronic component and a mounting board therefor, the multilayer ceramic electronic component including a ceramic body having a hexahedral shape, including dielectric layers, and satisfying T/W>1.0 when a length of the ceramic body is defined as L, a width of a lower surface of the ceramic body is defined as W, and a thickness of the ceramic body is defined as T, and first and second internal electrodes stacked in the ceramic body so as to face each other, having the respective dielectric layers interposed therebetween, wherein when a width of an upper surface of the ceramic body is defined as Wa, 0.800≦Wa/W≦0.985 is satisfied. | 10-30-2014 |
20140318845 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME - There are provided a multilayer ceramic electronic component and a board for mounting the same. The multilayer ceramic electronic component includes a hexahedral ceramic body including dielectric layers and satisfying T/W>1.0 when a width thereof is defined as W and a thickness thereof is defined as T; an active layer in which capacitance is formed, by including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body, having the dielectric layer interposed therebetween, an upper cover layer formed above the active layer; a lower cover layer formed below the active layer and having a greater thickness than the upper cover layer; and first and second external electrodes covering the end surfaces of the ceramic body, wherein when a thickness of the lower cover layer is defined as Tb, 0.03≦Tb/T≦0.25 is satisfied. | 10-30-2014 |
20140345925 | MULTILAYER CERAMIC CAPACITOR AND MOUNTING BOARD THEREFOR - There is provided a multilayer ceramic capacitor including: a ceramic body including dielectric layers and satisfying T/W>1.1 when a width thereof is defined as W and a thickness thereof is defined as T; first internal electrodes each having a first lead part exposed to at least one side surface of the ceramic body; second internal electrodes each having a second lead part exposed to the at least one side surface of the ceramic body; first and second external electrodes electrically connected to the first lead part and the second lead part, respectively, and extended from the side surface of the ceramic body to which the first lead part and the second lead part are exposed to at least one of the first and second main surfaces; and an insulating layer formed to cover the first and second external electrodes formed on the first and second side surfaces. | 11-27-2014 |
20140360764 | MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME - A multilayer ceramic capacitor includes a ceramic body including dielectric layers; first and second internal electrode groups disposed to be misaligned by a predetermined interval in the length direction, having the dielectric layers interposed therebetween; first and second external electrodes extended from at least one of the first and second side surfaces to at least one of the first and second main surfaces; and an insulating layer covering portions of the first and second external electrodes formed on the at least one of the first and second side surfaces, wherein the first internal electrode group includes first and second internal electrodes including first and second pattern parts and first and second lead parts, respectively, and the second internal electrode group includes third and fourth internal electrodes including third and fourth pattern parts and third and fourth lead parts, respectively. | 12-11-2014 |
20140362492 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component, including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body, having respective ones of the dielectric layers interposed therebetween, and being placed alternately to the left and to the right in a width direction of the ceramic body to be offset from one another, when the ceramic body is viewed in a width-thickness cross-sectional direction; and first and second external electrodes formed on the end surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively. | 12-11-2014 |
20140376150 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component including, a ceramic body including dielectric layers, internal electrodes disposed in the ceramic body to face each other with the dielectric layers interposed therebetween, and having an average thickness of 1.0 μm or less, and external electrodes formed on outer surfaces of the ceramic body and electrically connected to the internal electrodes, wherein at least one of the internal electrodes is formed of only a conductive metal. | 12-25-2014 |
20140376151 | METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MULTILAYER CERAMIC ELECTRONIC COMPONENT MANUFACTURED THEREBY - There is provided a method of manufacturing a multilayer ceramic electronic component, the method including: preparing a ceramic multilayer body by stacking and sintering ceramic green sheets having internal electrodes formed thereon; determining whether or not a distance d | 12-25-2014 |
20150022941 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component includes a ceramic body including a dielectric layer; and an internal electrode formed in the ceramic body, wherein on a cross-section of the ceramic body in a width-thickness direction, a thickness Te of the internal electrode satisfies 0.1 μm≦Te≦1.0 μm, and when the internal electrode is divided into three regions including a central region and both edge regions in a width direction of the ceramic body and a ratio of an actual total length of the internal electrode corresponding to the sum of lengths of electrode portions to an ideal total length of the internal electrode is defined as connectivity S of the internal electrode, connectivity of the internal electrode in the edge regions satisfies 75%≦S≦98%, and a ratio of connectivity of the internal electrode in the edge regions to connectivity of the internal electrode in the central region is 0.9 to 0.98. | 01-22-2015 |
20150041193 | MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON - There is provided a multilayer ceramic capacitor including: a ceramic body; an active layer disposed in the ceramic body and including first internal electrodes each having a first lead part exposed to at least one of the first and second side surfaces, and second internal electrodes each having a second lead part exposed to the at least one of the first and second side surfaces, thereby forming capacitance; an upper cover layer formed on an upper portion of the active layer in the thickness direction; a lower cover layer formed on a lower portion of the active layer in the thickness direction and having a thickness greater than that of the upper cover layer; a first external; and a second external electrode. | 02-12-2015 |
20150041194 | MULTILAYER CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF AND BOARD FOR MOUNTING THE SAME - There is provided a multilayer ceramic electronic component including a ceramic body including a plurality of dielectric layers stacked in a thickness direction and satisfying T/W>1.0 when it is defined that a width thereof is W and a thickness thereof is T, a plurality of first and second internal electrodes disposed in the ceramic body so as to face each other, having the dielectric layer interposed therebetween, and alternately exposed through both end surfaces of the ceramic body, and first and second external electrodes including head parts formed on both end surfaces of the ceramic body and two band parts connected to the head parts and formed on portions of upper and lower main surfaces of the ceramic body so as to be spaced apart from each other in a width direction, and electrically connected to the first and second internal electrodes, respectively. | 02-12-2015 |