Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


Jae Woo Joung, Suwon KR

Jae Woo Joung, Suwon KR

Patent application numberDescriptionPublished
20090286337Method of manufacturing light emitting diode package - There is provided a method of manufacturing a light emitting diode chip, the method including: providing a light emitting diode chip; forming a phosphor layer on a top of the light emitting diode chip; and forming phosphors of a lattice structure on the phosphor layer by an inkjet process using an ink containing phosphor powder. There is also provided A method of manufacturing a light emitting diode package, the method including: forming a phosphor layer with a predetermined thickness; forming phosphors of a lattice structure on the phosphor layer by an ink jet process using an ink containing phosphor powder; and disposing the phosphor layer having the phosphors of the lattice structure formed thereon on a top of the light emitting diode chip.11-19-2009
20100020132Inkjet head actuator and manufacturing method of the same - There are provided an inkjet head actuator and a manufacturing method of the same. The inkjet head actuator includes: a vibration plate having a recess formed in a top surface thereof; a first electrode formed to cover a bottom surface and a side wall of the recess; a piezoelectric body formed on the first electrode to fill the recess; and a second electrode formed on the piezoelectric body. The inkjet head actuator having the thin film piezoelectric body and the vibration plate ensures large vibration displacement.01-28-2010
20100196681METHOD OF FORMING METAL WIRING AND METAL WIRING FORMED USING THE SAME - Disclosed are a method of forming metal wiring and metal wiring formed using the same. The method includes printing wiring using an ink composition including metallic nanoparticles and dispersants maintaining dispersion of the metallic nanoparticles, performing a first firing process of firing the wiring under vacuum or in an inert atmosphere to suppress grain growth, and performing a second firing process of firing the wiring with the vacuum or inert atmosphere released, to accelerate grain growth. The method of forming metal wiring induces abnormal grain growth by rapidly removing dispersants, capable of inducing the growth of metallic nanoparticles, at a temperature at which the growth force of the metallic nanoparticles is high, in the process of firing the metallic nanoparticles. Accordingly, the metal wiring has a coarse-grained structure containing metallic particles with a large average particle size, and the electrical and mechanical characteristics thereof can be enhanced.08-05-2010
20100209619Printed wiring board and method for manufacturing the same - A method for manufacturing a printed wiring board having one or more layers of a conductive pattern and an insulating pattern, including forming an insulating pattern on an insulating substrate; semi-hardening at least one of the insulating substrate and the insulating pattern; forming a conductive pattern on the insulating substrate and/or the insulating pattern, thereby providing a stack structure; performing a thermal treatment on the stack structure to fully harden the semi-hardened insulating substrate and/or insulating pattern; and firing the conductive pattern. In the method, the conductive pattern and the insulating pattern are simultaneously formed on the same layer using an inkjet process.08-19-2010
20100283820Inkjet head assembly - There is provided an inkjet head assembly. The inkjet head assembly includes an ink tank including a first storage part receiving ink, and a second storage part communicating with the first storage part through at least one through hole and maintaining a full ink level upon receiving ink from the first storage part, and an inkjet head connected to the second storage part by an ink supply path and ejecting ink upon receiving ink from the second storage part. The inkjet head assembly includes the ink tank supplying ink to the inkjet head and storing ink separately in the first storage part and the second storage part thereof, and the second storage part maintains a full ink level therein. Accordingly, deterioration in print quality can be minimized due to the second storage part attenuating pressure variations caused by ink movement when the inkjet assembly moves.11-11-2010
20110025794Inkjet head and inkjet head assembly - There is provided an inkjet head including an inkjet head plate slantedly coupled to a cartridge supplying ink; a nozzle ejecting ink moving through a path formed inside the inkjet head plate, and formed at a flattened edge of the inkjet head plate contacting a printing medium; and an actuator provided on a surface of the inkjet head plate opposite to that coupled to the cartridge and controlling the ejection of the ink.02-03-2011
20110032309Inkjet head, method of manufacturing the same, and electrical connection device therefor - An inkjet head according to an aspect of the invention may include: an inkjet head body having an ink chamber provided therein and an electrode portion provided on a surface thereof adjacent to the ink chamber; a piezoelectric actuator being mounted on the surface of the inkjet head body so that the piezoelectric actuator is electrically connected to the electrode portion; and a substrate being pressed using a bonding tool so that the substrate is electrically connected to the electrode portion and the piezoelectric actuator, arranged in different planes, through a conductive adhesive.02-10-2011
20110032314Inkjet head and method of manufacturing the same - An inkjet head according to an aspect of the invention may include: a manifold storing ink being injected from the outside; ink chambers receiving the ink from the manifold to eject the ink to the outside through nozzles; and a restrictor connecting the manifold and the ink chambers to each other and providing a plurality of interconnection paths.02-10-2011
20110043564Inkjet head and method of manufacturing the same - An inkjet head according to an aspect of the invention may include: a flow path plate having a plurality of ink chambers; a nozzle plate having a plurality of nozzles connected to the ink chambers in order to eject ink in the ink chambers to the outside; and a temperature control unit having a heat exchange passage in at least one of the flow path plate and the nozzle plate in order to control temperature of the ink.02-24-2011
20110057991Inkjet head and manufacturing method thereof - There is provided an inkjet head and a manufacturing method thereof. The inkjet head includes an upper substrate formed of a silicon material and having an ink chamber storing ink provided therein; an intermediate substrate bonded to the upper substrate, formed of a low temperature co-fired ceramic material, and having a connection path and a restrictor provided therein while the connection path and the restrictor are connected to the ink chamber; and a lower substrate bonded to the intermediate substrate, formed of a silicon material, and having a nozzle connected to the connection path provided therein. According to the inkjet head and the manufacturing method thereof, the densification and facilitation of bonding between substrates are achieved by using anodic bonding between a silicon substrate and a ceramic substrate, thereby improving manufacturing yield.03-10-2011
20110057995Inkjet head and inkjet head assembly having the same - There is provided an inkjet head and an inkjet head assembly having the same. The inkjet head includes an inkjet head plate having a plurality of nozzles ejecting ink provided therein; pressure chambers storing ink drawn in from both outer ends of the inkjet head plate in a width direction thereof and facing each other in a direction inwards of the width direction; piezoelectric elements supplying the pressure champers with driving force allowing ink to be ejected through the nozzles connected to the pressure chambers and disposed on the pressure chambers having membranes interposed therebetween; a pressure adjusting channel connecting the pressure chambers to adjust a pressure of ink ejected through the nozzles.03-10-2011
20110063360Inkjet print head and method of measuring temperature thereof - An inkjet print head includes a plurality of pressure chambers receiving and storing ink which is to be discharged to a nozzle, a piezoelectric body interposing a membrane with the pressure chamber, the piezoelectric body providing a driving force for discharging ink to each of the pressure chambers, and a measuring unit measuring capacitance of the piezoelectric body so that a temperature of ink being discharged to the nozzle is measured.03-17-2011
20110063368Multi inkjet head package, inkjet recording apparatus using the same, and method of aligning the same in inkjet recording apparatus - There is provided a multi inkjet head package. The multi inkjet head package may include: a plurality of inkjet head assemblies each having a head plate in which an inkjet head discharging ink is housed; a rack in which the head plate is housed so as to expose the inkjet head; and a preliminary fixation portion that is installed on the rack and allows the head plate to be preliminarily fixed to the rack.03-17-2011
20110065851Nonaqueous ink composition for ink jet and method of manufacturing ink comprising the same - A nonaqueous ink composition for an ink jet and a method of manufacturing ink comprising the same are provided. The nonaqueous ink composition for the ink jet includes: a glycol ether acetate solvent represented by a specific chemical formula; and a polypropylene glycol binder represented by a specific chemical formula. The nonaqueous ink composition for an ink jet has dynamic viscoelasticity obtained by a chemical interaction between the solvent and the binder, exhibits excellent print quality and is capable of high-speed printing.03-17-2011
20110102508Laminate substrate having bypass valve structure, inkjet print head and micro pump using the same - There is provided a laminate substrate having a bypass valve structure. The bypass valve structure formed in the laminate substrate includes a sloped path connecting a first straight path with a second straight path, and a bypass path connected with at least one of the first and second straight paths and configured as a curved path.05-05-2011
20110109702Inkjet head - There is provided an inkjet head. An inkjet head according to an aspect of the invention may include: a body having a nozzle in an outer surface thereof; a reservoir provided within the body and containing ink being externally injected; an ink chamber receiving the ink from the reservoir through a restrictor and ejecting the ink to an outside through the nozzle; and a reservoir actuator mounted on the body at a position corresponding to the reservoir and transmitting vibrations to the reservoir.05-12-2011
20110134182INKJET HEAD PACKAGE - There is provided an inkjet head package including: an ink head having an actuator mounted thereon and ejecting ink to the outside by a driving force of the actuator; an intermediate substrate disposed between the ink head and an ink storage supplying ink to the ink head, and having a socket provided on a surface thereof; and a lead frame provided on an upper surface of the ink head such that the intermediate substrate and the actuator are electrically connected to each other.06-09-2011
20110141199Inkjet head assembly - An inkjet head assembly includes: a tank head having an ink channel formed therein; an inkjet head disposed in the tank head to jet ink introduced through the ink channel; and a mass disposed on the inkjet head and applying a weight to control vibrations when ink is jetted from the inkjet head.06-16-2011
20110162181Device for polling piezoelectric element and polling method using the same - A device for polling a piezoelectric element includes: a polling chamber in which a plurality of piezoelectric elements are disposed; a power supply unit providing voltage to poll the piezoelectric elements; a capacitance measurement unit connected with the piezoelectric elements to measure the capacitance of the piezoelectric elements; and a switching system connected with the power supply unit and the piezoelectric elements within the polling chamber, and selectively providing the voltage of the power supply unit to the piezoelectric elements.07-07-2011
20110164087Apparatus for cleaning inkjet print head - An apparatus for cleaning an inkjet print head includes: a cleaning plate disposed to correspond to an inkjet print head with an ink flow space interposed therebetween; and a pneumatic device installed in the ink flow space and removing ink in a direction different from a direction in which ink is discharged by changing a fluid pressure of the ink remaining at a nozzle of the inkjet print head.07-07-2011

Patent applications by Jae Woo Joung, Suwon KR