| Patent application number | Description | Published |
| 20100243623 | METHOD OF CUTTING SUBSTRATE - A substrate cutting method includes the steps of aligning a panel including two or more substrates, along a cutting line, forming groove lines in the respective substrates of the panel along the cutting line, by oscillating respective ultraviolet UV laser beams along the cutting line, and cutting the panel along the groove lines, by applying force to the panel. | 09-30-2010 |
| 20110049764 | Substrate cutting apparatus and method for cutting substrate using the same - A substrate cutting apparatus includes a stage configured to support a substrate, a first laser generator configured to emit a first laser beam toward the substrate, the first laser beam being a short-pulse laser beam, and a beam swing unit disposed on a beam path of the first laser beam, the beam swing unit being configured to swing the first laser beam in a predetermined light irradiating section on the substrate, the light irradiating section on the substrate including at least one of a curved line section and a straight line section. | 03-03-2011 |
| 20110107963 | Dispensing apparatus and dispensing method - A dispensing apparatus includes a dispensing unit having a main body, a channel through the main body, and a plurality of nozzles connected to the main body, the plurality of nozzles being configured to dispense fluid flowing in the channel, a gap sensor unit configured to determine size of gaps between adjacent nozzles in the dispensing unit, and a thermal expansion adjusting unit configured to thermally expand or contract the main body of the dispensing unit to adjust the gap size between adjacent nozzles to a predetermined size, based on the gap size determined by the gap sensor unit. | 05-12-2011 |
| 20110128550 | Surface inspection apparatus and method, and slit coater using the same - Provided are a surface inspection apparatus and method capable of detecting foreign materials on the surface of a substrate, and a slit coater having the surface inspection apparatus. In the surface inspection apparatus, a slit lighting unit irradiates slit-shaped light. An optical system splits the slit-shaped light into two beams traveling along two different paths, is incident upon a subject, and extracts an interference image caused by combination of the two beams reflected from the subject. An imaging device captures the interference image to output an image signal. An analysis unit acquires a luminance value of the image signal, analyzes the luminance value in real time, and determines whether or not foreign materials are present. | 06-02-2011 |
| 20110139365 | MASK FOR EVAPORATION, AND METHOD AND APPARATUS FOR MANUFACTURING THE SAME - Provided is a mask for an evaporation apparatus, which includes a first division mask and a second division mask. The first and second division masks are directly bonded to each other by welding, thereby forming welding portion between the first and the second division masks. A method and apparatus for manufacturing a mask for evaporation are also provided. The division masks according to the embodiment do not use subframes, and are directly bonded to one another by welding, so that a shadow effect does not occur. The apparatus for manufacturing a mask for evaporation includes a work stage, a clamp fixing a first division mask and a second division mask to the work stage, and a laser welding part welding the first division mask to the second division mask. The apparatus may further include a first roller leading the laser welding part and a second roller following the laser welding part. | 06-16-2011 |
| 20110146573 | MASK ASSEMBLY FOR THIN FILM DEPOSITION OF FLAT PANEL DISPLAY - A described technology relates generally to a thin-film deposition mask assembly of a flat panel display for correcting form distortion caused by tension of a division mask. The thin-film deposition mask assembly includes: a frame for forming a penetrated opening; a first change compensating member and a second change compensating member disposed across the opening, fixed to a free end member formed by partially cutting the frame from the opening, and arranged as a pair; and a plurality of division masks being disposed to cross the first change compensating member and the second change compensating member on top sides of the first change compensating member and the second change compensating member, being fixed to both sides of the opening to receive tension in a length direction, being fixed to the first change compensating member and the second change compensating member to receive tension in a width direction, and forming a pattern opening. | 06-23-2011 |
| 20110155705 | Laser cutting method and method of manufacturing organic light-emitting device - A laser cutting method includes providing a multi-layered substrate, such that the multi-layered substrate includes a circuit pattern between stacked first and second substrates, and removing a part of the second substrate by irradiating a laser beam on the second substrate, the laser beam being irradiated at an oblique angle with respect to an upper surface of the second substrate. | 06-30-2011 |
| 20110159201 | METHOD OF FORMING PATTERN AND METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING DEVICE - A method of forming a pattern includes: providing a heating substrate that selectively controls positions where heat is generated by controlling locations where electric current flows; forming a pattern forming material on a surface of the heating substrate; aligning a patterning substrate, on which a pattern may be formed, to face a surface of the heating substrate; and selectively applying electric current to the heating substrate to transfer some of the pattern forming material onto the patterning substrate. According to the method of forming the pattern and a method of fabricating an OLED, the pattern is transferred by heating the pattern forming material formed on the heating substrate, and thus, the pattern may be formed with high accuracy without using a mask, and the pattern forming material remaining on the heating substrate may be re-used. | 06-30-2011 |
| 20110163662 | Organic light-emitting display device and method of manufacturing the same - An organic light-emitting display device includes a first substrate including an organic light-emitting diode and a plurality of electrodes connected to the organic light-emitting diode, the plurality of electrodes extending on the first substrate along a first direction toward an edge of the first substrate, a second substrate connected to the first substrate, the second substrate being shorter than the first substrate and exposing a portion of the plurality of electrodes on the first substrate, a sealing material disposed between the first substrate and the second substrate to surround the organic light-emitting diode, and an electrode protecting layer partially covering the exposed portion of the plurality of electrodes on the first substrate, a first side of the electrode protecting layer being between the first substrate and the second substrate, and a second side of the electrode protecting layer protruding beyond the second substrate. | 07-07-2011 |