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Jae-Seob Lee

Jae-Seob Lee, Yongin-City KR

Patent application numberDescriptionPublished
20090289258Thin film transistor, method of fabricating the same, and organic light emitting diode display device including the same - A thin film transistor, a method of fabricating the same, and an organic light emitting diode display device including the same, which allow a size of a grain of a channel region to be increased, can effectively protect the channel region of a semiconductor layer at the time of etching process, and can reduce processing cost. The thin film transistor includes a substrate, a gate electrode disposed on the substrate, a gate insulating layer disposed on the gate electrode, a semiconductor layer pattern disposed on the gate insulating layer and including a channel region, a source region and a drain region, an etch stop layer pattern disposed on the channel region of the semiconductor layer pattern and having a thickness of 20 to 60nm, and source and drain electrodes disposed on the source and drain regions of the semiconductor layer pattern, respectively.11-26-2009
20090315034Thin Film Transistor (TFT), method of fabricating the TFT, and Organic Light Emitting Diode (OLED) display including the TFT - A Thin Film Transistor (TFT) includes: a substrate, a buffer layer arranged on the substrate, a gate electrode arranged on the buffer layer, a gate insulating layer arranged on the gate electrode, a semiconductor layer arranged on the gate insulating layer to correspond to the gate electrode, a heat transfer sacrificial layer arranged on the semiconductor layer, and source and drain electrodes connected to the semiconductor layer. A method of fabricating the TFT and a method of fabricating an Organic Light Emitting Diode (OLED) display having the TFT is also provided.12-24-2009
20100124635Method of Manufacturing Electronic Apparatus including Plastic Substrate, Electronic Apparatus Manufactured Using the Method, and Apparatus for Use in the Method - A method of manufacturing an electronic apparatus including a plastic substrate, which can facilitate in separating the electronic apparatus including the plastic substrate from a stage, an electronic apparatus manufactured using the method, and an apparatus including the stage for use in the method. The method includes: preparing a stage on which a plurality of island-shaped separation lubricators are arranged; disposing the plastic substrate on the stage; forming a device on the plastic substrate; and separating the plastic substrate from the stage.05-20-2010
20110012104Organic light emitting display device and fabricating method thereof - An organic light emitting display includes data lines and scan lines intersecting each other, a scan driving unit for supplying a scan signal to the scan lines, a data driving unit for supplying a data signal to the data lines, and pixels defined at intersection points of the data and scan lines, each pixel having an organic light emitting diode, a first TFT with an inverted staggered top gate structure and connected to the organic light emitting diode, the first TFT including an oxide semiconductor as an active layer, and a second TFT with an inverted staggered bottom gate structure and configured to receive the scan signal from the scan lines, the second TFT including an oxide semiconductor as an active layer.01-20-2011
20110114993ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD OF MANUFACTURING THE SAME - An organic light emitting diode display includes a flexible substrate, an organic light emitting diode disposed over the flexible substrate, and an encapsulation film disposed over the flexible substrate to encapsulate the organic light emitting diode, with the organic light emitting diode interposed between the encapsulation film and the flexible substrate. A thermal conduction layer contacts the flexible substrate, wherein the thermal conduction layer faces the organic light emitting diode and the flexible substrate is interposed between the thermal conduction layer and the organic light emitting diode. A first film is disposed over the encapsulation film, and a second film is disposed over the thermal conduction layer.05-19-2011
20110127519ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - An organic light emitting display device and a method for manufacturing the same. The organic light emitting display device includes: an insulating layer formed on a substrate; a resistance layer of oxide semiconductor formed on the insulating layer; a wiring layer connected to both side portions of the resistance layer; an organic layer formed on the upper portion including the resistance layer and the wiring layer; and a capping layer formed on the organic layer to be overlapped with the resistance layer.06-02-2011
20110134018METHOD OF MANUFACTURING FLEXIBLE DISPLAY APPARATUS - A method of manufacturing a flexible display apparatus, and more particularly, to a flexible display apparatus including a display unit including a thin-film transistor which is easily encapsulated. The method of manufacturing a flexible display apparatus includes: sequentially forming a first plastic film and a first barrier layer on a first substrate; forming a thin-film transistor on the first barrier layer; forming on the thin-film transistor a display device that is electrically connected to the thin-film transistor; forming an encapsulation member including a second substrate, a second plastic film, and a second barrier layer, wherein the second substrate and the second film are sequentially stacked on the second barrier layer; combining the encapsulation member with the upper portion of the display device; ablating the first substrate from the first plastic film; and ablating the second substrate from the second plastic film.06-09-2011
20110148745ORGANIC LIGHT EMITTING DISPLAY APPARATUS - Provided is an organic light emitting display apparatus including a substrate, a thin film transistor disposed on the substrate and including an active layer, a gate electrode, a gate insulator, a source electrode and a drain electrode, a first electrode electrically connected to the source electrode or the drain electrode, a second electrode disposed to face the first electrode, and an intermediate layer including an organic emitting layer and disposed between the first electrode and the second electrode. The gate insulator is disposed to insulate the gate electrode and the active layer and includes a plurality of patterns spaced apart from each other.06-23-2011
20110156041POLYMER SUBSTRATE AND METHOD OF FORMING THE SAME AND DISPLAY DEVICE INCLUDING THE POLYMER SUBSTRATE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE - A polymer substrate having a weight loss of less than about 1% based on an initial weight at a temperature ranging from about 420° C. to about 600° C., a method for forming the polymer substrate, a display device including the polymer substrate, and a method for manufacturing the display device. The method for forming the polymer substrate includes preparing the polymer layer and performing an annealing process to the polymer layer at a temperature greater than about 350° C.06-30-2011

Patent applications by Jae-Seob Lee, Yongin-City KR

Jae-Seob Lee, Suwon-Si KR

Patent application numberDescriptionPublished
20090020592Method of joining and method of fabricating an organic light emitting diode display device using the same - A method of joining a flexible layer and a support includes forming a first metal layer on one surface of the flexible layer, forming a second metal layer on one surface of the support, cleaning the first metal layer and the second metal layer, and joining the first metal layer to the second metal layer, such that the first metal layer is between the flexible layer and the second metal layer.01-22-2009
20090256154Flexible substrate, method of fabricating the same, and thin film transistor using the same - A flexible substrate for a TFT includes a metal substrate having a predetermined coefficient of thermal expansion, and a buffer layer on the metal substrate, the buffer layer including a silicon oxide or a silicon nitride, wherein the predetermined coefficient of thermal expansion of the metal substrate satisfies an equation as follows,10-15-2009

Jae-Seob Lee, Suwon KR

Patent application numberDescriptionPublished
20080308231FLEXIBLE SUBSTRATE BONDING AND DEBONDING APPARATUS - A flexible substrate bonding and debonding apparatus is disclosed. In one embodiment, the apparatus includes i) a chamber, ii) a lower chuck disposed in a lower portion of the chamber and having a lower heating unit and a cooling conduit built therein, iii) an upper chuck disposed above the lower chuck and having an upper heating unit built therein, iv) a pressurizing unit disposed above the upper chuck and v) a separating unit corresponding to either side of bonding surfaces of a support substrate and a flexible substrate which are disposed between the lower chuck and the upper chuck. The flexible substrate bonding and debonding apparatus can pressurize the flexible substrate and the support substrate simultaneously using a heat-treatment process. Therefore, the flexible substrate can be more reliably bonded and debonded even at low temperature.12-18-2008
20080311361ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME - An organic light emitting diode (OLED) display device and a method of fabricating the same are disclosed. In one embodiment, the method includes: i) preparing a support and a flexible layer, ii) forming a first metal layers on one side of a support and a second metal layer on one side of a flexible layer, iii) performing a cleaning process to the first metal layer and the second metal layer, iv) forming a first radical layer on the first metal layer and a second radical layer on the second metal layer and v) joining the first and second radial layers to each other. At least one embodiment of the invention enhances process convenience and manufacturing yield, and reduces manufacturing costs and time for a flat panel display device having a flexible substrate.12-18-2008

Jae-Seob Lee, Young-City KR

Patent application numberDescriptionPublished
20110120755Flexible Display Apparatus and Method of Manufacturing Flexible Display Apparatus - A flexible display apparatus and a method of manufacturing the flexible display apparatus. Even if a passivation layer is thin, the passivation layer is highly planarized, thereby preventing a protective film and the passivation layer from becoming detached from each other.05-26-2011