Patent application number | Description | Published |
20080313745 | METHOD AND APPARATUS FOR PREVENTING ILLEGAL REUSE OF DIGITAL RIGHT MANAGEMENT CONTENT IN PORTABLE TERMINAL - A method and apparatus for preventing illegal reuse of Digital Right Management (DRM) content in a portable terminal is provided. The method includes performing user authentication when there is an attempt to restore a Right Object (RO) backup file, and identifying information on the RO backup file to be pre-restored in a terminal, and determining if the RO backup file can be restored according to the identified information. | 12-18-2008 |
20120274868 | Semiconductor Package - A semiconductor package may include a substrate, a semiconductor chip disposed on the substrate, a communication terminal and a static electricity inducing terminal connected to a ground. The package may include a first sealant that comprises a voltage sensitive material and that covers the semiconductor chip and a static electricity blocking layer that provides a conductive pathway from the first sealant to only the static electric inducing terminal. The static electricity blocking layer may prevent the communication terminal from being electrically connected to the first sealant. If a buildup of charge is applied to the device, the first sealant may become polarized and/or conductive. The extra voltage may travel through the first sealant to the static electricity inducing terminal via an opening in the static electricity blocking layer. The semiconductor chip and the communication terminal may not be affected by the extra charge. | 11-01-2012 |
20130148312 | TAPE WIRING SUBSTRATE AND CHIP-ON-FILM PACKAGE INCLUDING THE SAME - A tape wiring substrate includes a base film having at least one recess in a first surface of the base film and a chip-mounting region on which a semiconductor chip is included on a second surface of the base film. A wiring pattern is formed on the second surface of the base film and is extended to an edge of the chip-mounting region. A protection film covers the wiring pattern. | 06-13-2013 |
20130186680 | Tape Film Packages and Methods of Fabricating the Same - A tape film package is provided including an insulating pattern; a via contact in a via hole in the insulating pattern; first interconnection patterns extending from the via contact to a cutting surface of the insulating pattern; and second interconnection patterns connected to the via contact below the insulating pattern. The second interconnection patterns are parallel to the first interconnection patterns and spaced apart from the cutting surface of the insulating pattern. | 07-25-2013 |
20130240917 | SEMICONDUCTOR PACKAGE HAVING A CONDUCTIVE LAYER FOR ELECTROSTATIC DISCHARGE AND DISPLAY DEVICE INCLUDING THE SAME - A semiconductor package is provided. The semiconductor package may include a base film having a first surface and a second surface opposite the first surface, an interconnection pattern on the first surface of the base film, and a ground layer on the second surface of the base film. The semiconductor package may further include a semiconductor chip on the first surface of the base film within the first region and a via contact plug in the second region that penetrates the base film and is configured to electrically connect the interconnection pattern with the ground layer when electrostatic discharge occurs through the via contact plug. | 09-19-2013 |
20130293816 | CHIP-ON-FILM PACKAGE AND DEVICE ASSEMBLY INCLUDING THE SAME - Chip-on-film packages and device assemblies including the same may be provided. The device assembly includes a film package including a semiconductor chip, a panel substrate connected to one end of the film package, a display panel disposed on the panel substrate, and a controlling part connected to another end of the film package. The film package includes a film substrate, a first wire disposed on a top surface of the film substrate, and a second wire disposed on a bottom surface of the film substrate. | 11-07-2013 |
20140054793 | Chip on Film (COF) Substrate, COF Package and Display Device Including the Same - A COF substrate may include a base film, first upper conductive patterns, at least one second upper conductive pattern and lower conductive patterns. The first upper conductive patterns may be arranged on an upper surface of the base film. Each of the first upper conductive patterns may have an inner pattern and an outer pattern spaced apart from each other. The second upper conductive pattern may be arranged on the upper surface of the base film between the first upper conductive patterns. The lower conductive patterns may be arranged on a lower surface of the base film. The lower conductive patterns may be electrically connected between the inner pattern and the outer pattern. Thus, conductive materials causing a short between the panel patterns may not exist between the inner pattern and the outer pattern on the upper surface of the base film. | 02-27-2014 |
20140246687 | CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME - A chip on film package includes a flexible base film having a first surface and a second surface opposite to each other that includes at least one through hole therein, a plurality of wirings disposed on the first surface and the second surface of the base film, respectively, that include a first lead and a second lead connected to each other through the at least one through hole, and a display panel driving chip and a touch panel sensor chip, each mounted on any one of the first surface and the second surface of the base film, wherein at least one of the display panel driving panel and the touch panel sensor chip is electrically connected to the first and second leads. | 09-04-2014 |
20140300849 | CHIP-ON-FILM PACKAGE AND DEVICE ASSEMBLY INCLUDING THE SAME - Provided are a chip-on-film (COF) package and a device assembly including the same. The device assembly includes a COF package including a film substrate on which a plurality of film-through wires are formed. The device assembly includes a panel unit including a panel substrate on which a plurality of panel-through wires are formed. The panel unit is disposed on the COF package. One end of the panel unit is electrically connected to a first end of the COF package. The device assembly includes a control unit disposed below the panel unit. One end of the control unit is electrically connected to a second end of the COF package. | 10-09-2014 |
20140328031 | DISPLAY APPARATUS - Provided is a display apparatus. The display apparatus includes a display panel, a flexible circuit film having a rear surface connected to the display panel, and a front surface opposite to the rear surface, the front surface having a chip mounted thereon, and a first lead bonding portion electrically connecting the chip to the display panel. The first lead bonding portion includes a first portion connected to the chip and overlying a portion of the flexible circuit film, a second portion passing through the flexible circuit film, and a third portion disposed between the flexible circuit film and the display panel on the rear surface of the flexible circuit film, where the third portion overlaps the first portion. | 11-06-2014 |
20140367659 | DISPLAY DEVICES - A display device includes a substantially planar semiconductor package. The semiconductor package drives unit display elements of the display device. The semiconductor package is not folded and has a flat structure. Thus, the occurrence of defects and/or errors in the display device may be reduced as compared to display devices including folded non-planar semiconductor packages. As a result, reliability of the display device may be improved. | 12-18-2014 |
20150060931 | SEMICONDUCTOR PACKAGES AND DISPLAY DEVICES INCLUDING SEMICONDUCTOR PACKAGES - Semiconductor packages are provided. A semiconductor package may include a semiconductor chip. The semiconductor package may include a substrate and first and second conductive regions on the substrate. In some embodiments, the substrate may be a flexible substrate, and the first and second conductive regions may be on the same surface of the flexible substrate. Display devices including semiconductor packages are also provided. In some embodiments, a display device may include a flexible substrate that is bent such that first and second conductive regions thereof are connected to each other via an intervening third conductive region. | 03-05-2015 |