Patent application number | Description | Published |
20090014503 | Reflow apparatuses and methods for reflow - There are provided reflow apparatuses and a methods therefor. In some embodiments, a reflow apparatus includes a first heating unit capable of heating a solder on a substrate up to just below before a melting point of the solder at ambient pressure such that the solder on the substrate is melted and electronic components mounted on the substrate are then soldered to the substrate; and a second heating unit connected to the first heating unit, the second heating unit capable of heating the solder on the substrate heated in the first heating unit through at least a portion of a solder melting temperature range in a vacuum state. | 01-15-2009 |
20100149776 | PRESSURE CONDUCTIVE SHEET - A pressure conductive sheet includes a connector body formed of a thin plate of insulation material, an elastic body deposited as one body with the connector body, pluralities of connection terminals provided with a given interval to pass through the elastic body and the connector body, and a ground plate constituting a matching circuit, the ground plate being buried by a given width in between the connector body and the elastic body. The ground plate is coupled to a ground terminal among the connection terminals and is separated from an outer circumference face of a signal terminal. The connector body, the elastic body, the connection terminals and the ground plate are combined with one another to substantially reduce an interference between signal terminals through the matching circuit formed based on capacitance of a gap between a ground face of the ground plate and the signal terminal, and to improve electrical characteristics. | 06-17-2010 |
20100210042 | METHOD OF MANUFACTURING SEMICONDUCTOR MODULE - A method of manufacturing a semiconductor module is provided. A semiconductor package is formed, having one or more plate units which are bent by heat. The semiconductor package is aligned on a module substrate, and connection members are disposed between the semiconductor package and the module substrate. Heat is applied to the plate units and the connection members to extend a distance between the module substrate and the semiconductor package, and connection patterns are formed. The height of the connection patterns is larger than that of the connection members. | 08-19-2010 |
20110068151 | METHOD OF ATTACHING A SOLDER BALL AND METHOD OF REPAIRING A MEMORY MODULE - In a method of attaching a solder ball, a first material is coated on a solder ball. A second material is coated on a pad of a substrate where the solder ball is to be attached to exothermically react with the first material. The solder ball makes contact with the pad such that the first material and the second material exothermically react with each other to release heat to adhere the solder ball to the pad using the heat. | 03-24-2011 |
20110216516 | Semiconductor Module, Socket For The Same, And Semiconductor Module/Socket Assembly - A semiconductor module, a socket for the same, and a semiconductor module/socket assembly are disclosed. The semiconductor module includes a printed circuit board including a plurality of semiconductor devices, a plurality of insulating layers and a plurality of metal layers, the plurality of insulating layers and the plurality of metal layers are alternately stacked. Exposed portions of the metal layers are exposed to the outside of the semiconductor module at a first and a second ends of the printed circuit board. The first end and the second end are at opposite ends of the printed circuit board. | 09-08-2011 |
20120244726 | DATA STORAGE DEVICE - A data storage device includes a printed circuit board (PCB), a connection tab, a dummy tab and a guiding member. A memory chip is mounted on the PCB. The connection tab is formed on a first surface of the PCB to electrically connect the PCB with a first cable. The dummy tab is formed on the first surface of the PCB. The guiding member is formed on the dummy tab to guide an insertion direction of the first cable. Thus, the data storage device without a separate connector may be manufactured by a relatively simple process at a lower cost. | 09-27-2012 |
Patent application number | Description | Published |
20090015646 | KICKING UNIT AND IMAGE FORMING APPARATUS INCLUDING THE SAME - An image forming apparatus includes an image forming unit to move in a crossing direction to cross a printing medium feeding direction and to form an image on the printing medium, and a kicker to move together with a movement of the image forming unit and to feed the printing medium. | 01-15-2009 |
20090153424 | DUAL-BAND ANTENNA FOR RECEIVING VHF AND UHF SIGNAL AND COMMUNICATION DEVICE INCLUDING THE SAME - Disclosed herein is a dual-band antenna for a terminal for receiving VHF and UHF signals. A radiator of the dual-band antenna for a terminal for receiving VHF and UHF signals according to the present invention comprises a first patch bent at a part of a distal end thereof, and a second patch electrically connected to the first patch and formed in a spiral shape. A longitudinal portion of the second patch is constructed superposedly in a multi-structure in parallel with that of the first patch, so that the broadband of the VHF and UHF can be covered through an inverted L-shaped folded antenna structure. | 06-18-2009 |
20090244658 | IMAGE READING APPARATUS, MULTI-FUNCTIONAL MACHINE AND DOCUMENT DISCHARGING METHOD - An image reading apparatus with a structure capable of reliably discharging a document, and a multi-functional machine having the same are disclosed. The image reading apparatus includes a document feed path having a document outlet, a reading unit which reads an image of a document fed through the document feed path, and a guide member which is disposed at the document outlet downstream of the reading unit to form a curl on the trailing end portion of the document. The curl formed on the document may make it possible for a subsequent document being discharged to push the curled document out of the document outlet. | 10-01-2009 |
20090268377 | ELECTROLYTE SOLUTION AND SUPER CAPACITOR INCLUDING THE SAME - An electrolyte solution and a super capacitor including the same, which has superior voltage stability, a high operation voltage and a high energy density, are disclosed. The electrolyte solution includes: a C | 10-29-2009 |
20100149049 | BROADBAND ANTENNA OF DUAL RESONANCE - Disclosed herein is a dual-resonance broadband antenna, and more particularly, to such a dual-resonance broadband antenna in which dual resonance is caused to occur using an antenna consisting of a strip line, a microstrip line or the like having a meander pattern so as to receive a signal for a wireless communication service at a relatively low frequency band, particularly, a signal with a terrestrial digital multimedia broadcasting (T-DMB) service frequency band of 174-216 MHz among a very high frequency (VHF) band. Particularly, the dual-resonance broadband antenna of the present invention is remarkably red used in its size (length) as compared to a general helical antenna, a monopole antenna, a dipole antenna or the like while using a wireless communication service at a relatively low frequency band, thereby achieving miniaturization thereof. Further, it is possible to improve quality and reliability of the small-sized dual-resonance broadband antenna according to the present invention as well as enhance the qualities of a portable terminal and a transmission and reception device for wireless communication employing the antenna according to the present invention. | 06-17-2010 |
20100182210 | ULTRA-WIDEBAND ANTENNA HAVING A BAND NOTCH CHARACTERISTIC - The present invention discloses an antenna for ultra-wideband (UWB) communication having a band-stop characteristic. According to an embodiment of the present invention, the UWB antenna is a patch antenna employing microstrip feeding. In order to expand a bandwidth at a low frequency band, a stub is formed in a radiating element. Furthermore, since steps are formed in a ground plane, an antenna characteristic at an intermediate frequency band can be improved and a UWB characteristic can be obtained. According to another embodiment of the present invention, the UWB antenna is a patch antenna employing microstrip feeding and has a recess formed in the ground plane, thereby implementing the UWB characteristic. The antenna of the present invention has an inverse U-shaped slot formed in the radiating element, thus implementing the band-stop characteristic at the UNII band. In addition, the antenna of the present invention has includes a ground plane having a small area and has omnidirectional radiating patterns accordingly. | 07-22-2010 |
20110148736 | MULTI-INPUT MULTI-OUTPUT ANTENNA FOR IMPROVING ISOLATION - A multi-input multi-output (MIMO) antenna for improving isolation is provided. Split ring resonators (SRRs) are structurally arranged on the lower end of a ground surface between a plurality of antenna patterns spaced apart from each other. Accordingly, permeability of the SRRs has a negative value, which prevents current from flowing between antennas. Consequently, the isolation characteristic of the antennas is improved. | 06-23-2011 |
20120223869 | MICROSTRIP PATCH ANTENNA INCLUDING PLANAR METAMATERIAL AND METHOD OF OPERATING MICROSTRIP PATCH ANTENNA INCLUDING PLANAR METAMATERIAL - Provided is a microstrip patch antenna in which a unit cell of a planar metamaterial may be inserted to have a miniaturized size, a wide bandwidth, or multi-resonance. | 09-06-2012 |
20140034958 | LIGHT EMITTING DEVICE - A light emitting device is disclosed. The light emitting device includes a first-conductive-type semiconductor layer, a second-conductive-type semiconductor layer, and an active layer interposed between the first-conductive-type semiconductor layer and the second-conductive-type semiconductor layer. The second-conductive-type semiconductor layer includes an electron blocking region closely disposed to the active layer and having a pattern with a plurality of elements spaced apart from each other. | 02-06-2014 |
20140110663 | LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE HAVING THE SAME - A light emitting device includes a nano-structure, a first semiconductor layer on the nano-structure, an active layer on the first semiconductor layer, and a second conductive semiconductor layer on the active layer. The nano-structure includes a graphene layer provided under the first semiconductor layer to make contact with the first semiconductor layer; and a plurality of nano-textures extending from a top surface of the graphene layer to the first semiconductor layer and in contact with the first semiconductor layer. | 04-24-2014 |
20140160502 | IMAGE READING APPARATUS, MULTI-FUNCTIONAL MACHINE AND DOCUMENT DISCHARGING METHOD - An image reading apparatus with a structure capable of reliably discharging a document, and a multi-functional machine having the same are disclosed. The image reading apparatus includes a document feed path having a document outlet, a reading unit which reads an image of a document fed through the document feed path, and a guide member which is disposed at the document outlet downstream of the reading unit to form a curl on the trailing end portion of the document. The curl formed on the document may make it possible for a subsequent document being discharged to push the curled document out of the document outlet. | 06-12-2014 |
20140327022 | LIGHT EMITTING DEVICE - A light emitting device includes a substrate, a buffer layer, a first conductive layer, an active layer and a third conductive semiconductor layer. The first conductive layer has a prescribed tensile stress, and a second conductive semiconductor layer has a prescribed compressive stress. | 11-06-2014 |
20140339565 | LIGHT EMITTING DEVICE - A light emitting device includes a first conductive semiconductor layer on a substrate, a control layer interposed between the substrate and the first conductive semiconductor layer. The control layer includes a first nitride semiconductor layer having aluminum (Al), a plurality of nano-structures on the first nitride semiconductor layer, and a second nitride semiconductor layer provided on the first nitride semiconductor layer and having gallium (Ga). | 11-20-2014 |
20150014724 | LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE - A light emitting device includes a light emitting structure including a plurality of compound semiconductor layers. A current spreading layer is provided under the light emitting structure, and a plurality of wavelength conversion structures is provided in the current spreading layer. An electrode layer is provided under the current spreading layer, and an electrode is provided on the light emitting structure. | 01-15-2015 |
20150048981 | HUMAN BODY WEARABLE ANTENNA HAVING DUAL BANDWIDTH - Disclosed is a human body wearable dual band antenna. The disclosed human body wearable antenna comprises: a substrate; a zeroth-order resonance antenna formed on the bottom of the substrate, for receiving a signal from a wireless device which is implanted in a human body; and a micro strip antenna formed on the top of the substrate, for transmitting the signal to a wireless device which is external to the human body. The dual band human body wearable antenna according to the present invention can relay communications between the wireless device which is implanted in the human body and the wireless device which is external to the human body. | 02-19-2015 |
20150061399 | WIRELESS POWER RECEPTION AND TRANSMISSION APPARATUS - A wireless power receiving device and a wireless power transmission apparatus are provided. The wireless power receiver may include a resonator configured to emit an electromagnetic field, a blocker configured to surround a portion of an exterior of the resonator, and a spacer disposed between the resonator and the blocker. | 03-05-2015 |
20150083995 | LIGHT EMITTING DEVICE - Disclosed is a light emitting device package capable of improving luminous efficiency. The light emitting device includes a substrate; a first buffer layer on the substrate; a first insulating layer on the first buffer layer; a second buffer layer on the first insulating layer; a second insulating layer on the second buffer layer; a third buffer layer around the second buffer layer and the insulating layer; and a light emitting structure on the third buffer layer. | 03-26-2015 |
20160049545 | LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE HAVING THE SAME - Disclosed is a light emitting device. The light emitting device includes a nano-structure, a first semiconductor layer on the nano-structure, an active layer on the first semiconductor layer, and a second conductive semiconductor layer on the active layer. The nano-structure includes a graphene layer disposed under the first semiconductor layer to make contact with the first semiconductor layer; and a plurality of nano-textures extending from a top surface of the graphene layer to the first semiconductor layer and contacted with the first semiconductor layer. | 02-18-2016 |
Patent application number | Description | Published |
20110117394 | POUCH TYPE SECONDARY BATTERY - A pouch type secondary battery which can prevent a cut portion from electrically contacting a protective circuit module, thereby preventing an electrical short circuit and acceleration of corrosion of a core material and enhancing safety includes an electrode assembly having a first electrode plate, a second electrode plate, and a separator; a pouch case made of a flexible material, and having a container, insulated at least on its inner surface and accommodating the electrode assembly, and sealing portions along an edge of the container, the sealing portions including a first sealing portion through which electrode taps of the electrode assembly extend from the pouch case, and a second sealing portion and a third sealing portion respectively positioned at opposite sides of the first sealing portion, the second an third sealing portions being folded at least one time; a protective circuit module connected to the electrode tips and mounted on an outer surface of the first sealing portion; and a short circuit protector formed in at least one among the first through third sealing portions to prevent an electrical short circuit between each sealing portion and the protective circuit module. | 05-19-2011 |
20110123772 | CORE SUBSTRATE AND METHOD OF MANUFACTURING CORE SUBSTRATE - A core substrate and a method of manufacturing the core substrate are disclosed. In accordance with an embodiment of the present invention, the core substrate includes an adhesive resin layer having a mineral filler added therein, a metal sheet, which is patterned and embedded in the adhesive resin layer, and an insulation layer, which is stacked on both surfaces of the adhesive resin layer. Since a through-hole is formed to correspond to the number of via holes in accordance with a higher density of a printed circuit board, no conventional land is required to be formed, thereby reducing the defect of eccentricity. | 05-26-2011 |
20110126970 | METALLIC LAMINATE AND MANUFACTURING METHOD OF CORE SUBSTRATE USING THE SAME - A metallic laminate and a method of manufacturing a core substrate using the same are disclosed. In accordance with an embodiment of the present invention, the metallic laminate includes an insulation material, a carrier layer, which is stacked on both surfaces of the insulation layer and in which the carrier layer is a metal, and a first metal foil, which is stacked on one surface of the carrier layer. By symmetrically forming two core substrates on either surface above and below the insulation material, each process of forming the core substrate can be performed at the same time in the shape of a pair of facing core substrates, thereby increasing the productivity by twice. The remaining insulation material having the carrier layer stacked thereon can be used as a base substrate that is used to manufacture a printed circuit board, thus preventing unnecessary waste of the insulation material. | 06-02-2011 |
20110127073 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a metal core having Invar layers formed on either surface of a copper layer, an insulation layer, which is formed on one surface of the metal core, and a circuit pattern, which is coupled to one surface of the insulation layer. Thus, the printed circuit board can improve thermal conductivity and deformation resistance against warpage. | 06-02-2011 |
20130164568 | PROTECTIVE CIRCUIT MODULE - A battery module including a battery including a connection terminal; and a battery cell; and a protective circuit module including a printed circuit board having an inner surface that faces the battery, an outer surface that opposes the inner surface, and a terminal opening, and including a conductive pattern around a periphery of the terminal opening and an insulating part around the periphery of the terminal opening, wherein the connection terminal extends from the battery cell to the outer surface of the printed circuit board through the terminal opening, the conductive pattern is coupled with the battery cell through the connection terminal, and the insulating part contacts a portion of the conductive pattern that is closest to the terminal opening. | 06-27-2013 |
20130196180 | Battery Pack - A battery pack having at least two battery cells arranged parallel to each other, a protection circuit module adjacent to at least one of the battery cells, and a temperature measuring member attached to the protection circuit module and extending between, and in contact with, the two battery cells, the temperature measuring member measuring a temperature of one of the battery cells, the temperature measuring member being fixedly and removably attached to the at least one of the battery cells. | 08-01-2013 |
20130196181 | BATTERY PACK - A battery pack that has one or more batteries and a protection circuit module. The battery pack includes protection tab members that connect to the batteries and the tab members include a tab that has a coupling component that extends towards the batteries. The battery pack also includes a conductive member that connects the connection tab member to the protection circuit module. The battery pack also includes spacers that receive the connection tabs and that couple to the coupling component of the connection tabs and are interconnected to the conductive member and the spacers. | 08-01-2013 |
20150270515 | SECONDARY BATTERY AND MANUFACTURING METHOD FOR THE SAME - A secondary battery and a manufacturing method for the same are disclosed. In one aspect, the method comprises cutting a wound tubing member to a predetermined length and inserting a battery cell including first and second electrode tabs into the cut tubing member. The method further comprises performing a primary heat-contraction process on the tubing member, wherein the primary heat-contraction process comprises applying heat to upper and lower portions of the battery cell. The method also comprises performing a secondary heat-contraction process on the tubing member, wherein the secondary heat-contraction process comprises applying heat to substantially the entire surface of the battery cell. | 09-24-2015 |
20160007449 | CHIP EMBEDDED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a chip embedded substrate including: an insulating layer having outer layer circuit patterns provided on any one of an upper surface and a lower surface thereof; a chip embedded in the insulating layer; and internal circuit patterns included in the insulating layer and disposed between a height of a top surface of the chip and a height of a bottom surface thereof. | 01-07-2016 |