Patent application number | Description | Published |
20090057700 | Light emitting element and a manufacturing method thereof - A light emitting element and a method for manufacturing the same are disclosed. In accordance with the element and the method, the dielectric thin film including the embossed pattern partially covering the sapphire substrate prevents damage of a sapphire substrate that occurs during a texturing of the sapphire substrate and a defect of an epitaxial thin film formed in a subsequent process. | 03-05-2009 |
20090195072 | Auto Power Controller of External Equipment on Valid Check - The present invention relates to a power controller for at least one piece of external equipment, the power controller being connected to the external equipment. The power controller includes a main unit ( | 08-06-2009 |
20090261345 | METHOD FOR MANUFACTURING COMPLIANT SUBSTRATE, COMPLIANT SUBSTRATE MANUFACTURED THEREBY, GALLIUM NITRIDE BASED COMPOUND SEMICONDUCTOR DEVICE HAVING THE COMPLIANT SUBSTRATE AND MANUFACTURING METHOD THEREOF - A compliant substrate having a reduced stress, a method for manufacturing the same having a reduced manufacturing time, a gallium nitride based compound semiconductor device including the compliant substrate and a method for manufacturing the same are disclosed. The compliant substrate is manufactured by heating a substrate and a group III metal including at least one of an aluminum, a gallium and an indium, and a chloride based compound generated by introducing a HCl gas to the melted group III metal reacts with a NH | 10-22-2009 |
20100270528 | RESISTIVE RANDOM ACCESS MEMORY DEVICE AND METHOD OF SAME - Disclosed are a resistive random access memory device (ReRAM) and a method for manufacturing the same. The ReRAM includes a cell array including a metal oxide nanowire formed inside a micropore array of a porous template, a first electrode electrically connected to an upper protrusion of the metal oxide nanowire, the upper protrusion being exposed to an upper portion of the porous template, and located in an upper portion of the cell array, and a second electrode electrically connected to a lower protrusion of the metal oxide nanowire, the lower protrusion being exposed to a lower portion of the porous template, and located in a lower portion of the cell array. | 10-28-2010 |
20110102009 | TEST SOCKET ELECTRICAL CONNECTOR, AND METHOD FOR MANUFACTURING THE TEST SOCKET - A test socket, an electrical connector, and a method for manufacturing the test socket. In detail, the test socket for electrically connecting terminals of a semiconductor device to pads of a test apparatus includes: a housing having through-holes vertically extending to correspond in position to the terminals of the semiconductor device; contact pins disposed to correspond in position to the through-holes of the housing and contacting the terminals of the semiconductor device; and elastic members connected to the contact pins in the through-holes of the housing to contract and expand, wherein the elastic members are adhered to the contact pins by using an adhesive material. | 05-05-2011 |
20110121850 | SPRING STRUCTURE AND TEST SOCKET USING THEREOF - Spring assemblies and a test socket using the spring assemblies. The spring assemblies are used in a test socket electrically connecting lead terminals of a semiconductor chip to test terminals of a test device by contacting the lead terminals and the test terminals, and include: first springs in which a first steel wire having elasticity and conductivity is coiled in a spiral in one direction; and second springs in which a second steel wire having elasticity and conductivity is coiled in a spiral in an opposite direction to the direction in which the first springs are coiled, which have outer diameters narrower than inner diameters of the first springs, and are inserted into the first springs. Accordingly, electric resistances and inductances of two spring assemblies coiled in a spiral are reduced to improve electricity transmission characteristic. A height of a test socket is easily adjusted using spring assemblies having desired lengths. Also, since only plating is performed on the springs to form the spring assemblies, the spring assemblies are formed at a very low cost and have a wide range of applications. | 05-26-2011 |
20120091461 | THIN FILM TRANSISTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A thin film transistor display substrate and a method of manufacturing the same are provided. The thin film transistor substrate includes a gate electrode formed on a display substrate, an active layer formed on the gate electrode to overlap with the gate electrode and including polycrystalline silicon, a first ohmic contact layer formed on the active layer, a second ohmic contact layer formed on the first ohmic contact layer, and a source electrode and a drain electrode each formed on the second ohmic contact layer. | 04-19-2012 |
20130037813 | CRYSTALLIZATION METHOD OF THIN FILM TRANSISTOR, THIN FILM TRANSISTOR ARRAY PANEL AND MANUFACTURING METHOD FOR THIN FILM TRANSISTOR ARRAY PANEL - Exemplary embodiments of the invention disclose a method of manufacturing a thin film transistor array panel having reduced overall processing time and providing a uniform crystallization. Exemplary embodiments of the invention also disclose a crystallization method of a thin film transistor, including forming on a substrate a semiconductor layer including a first pixel area, a second pixel area, and a third pixel area. The crystallization method includes crystallizing a portion of the semiconductor layer corresponding to a channel region of a thin film transistor using a micro lens array. | 02-14-2013 |
20140028339 | SPRING ASSEMBLY AND TEST SOCKET USING THE SAME - Spring assemblies and a test socket using the spring assemblies. The spring assemblies are used in a test socket electrically connecting lead terminals of a semiconductor chip to test terminals of a test device by contacting the lead terminals and the test terminals, and include: first springs in which a first steel wire having elasticity and conductivity is coiled in a spiral in one direction; and second springs in which a second steel wire having elasticity and conductivity is coiled in a spiral in an opposite direction to the direction in which the first springs are coiled, which have outer diameters narrower than inner diameters of the first springs, and are inserted into the first springs. Accordingly, electric resistances and inductances of two spring assemblies coiled in a spiral are reduced to improve electricity transmission characteristic. A height of a test socket is easily adjusted using spring assemblies having desired lengths. Also, since only plating is performed on the springs to form the spring assemblies, the spring assemblies are formed at a very low cost and have a wide range of applications. | 01-30-2014 |
20140264350 | CRYSTALLIZATION METHOD OF THIN FILM TRANSISTOR, THIN FILM TRANSISTOR ARRAY PANEL AND MANUFACTURING METHOD FOR THIN FILM TRANSISTOR ARRAY PANEL - Exemplary embodiments of the invention disclose a method of manufacturing a thin film transistor array panel having reduced overall processing time and providing a uniform crystallization. Exemplary embodiments of the invention also disclose a crystallization method of a thin film transistor, including forming on a substrate a semiconductor layer including a first pixel area, a second pixel area, and a third pixel area. The crystallization method includes crystallizing a portion of the semiconductor layer corresponding to a channel region of a thin film transistor using a micro lens array. | 09-18-2014 |
20140326177 | MASK AND A METHOD FOR MANUFACTURING THE SAME - A mask and a method for manufacturing the mask are disclosed. The method for manufacturing the mask comprises forming an insulating pattern layer on a substrate, forming a metal plating film on the substrate formed with the insulating pattern layer through a plating process, and separating the metal plating film from the substrate formed with the insulating pattern layer. | 11-06-2014 |
20140326402 | METHOD FOR MANUFACTURING METAL ENCAPSULATION MEMBER - A method for manufacturing a metal encapsulation member is disclosed. The method comprises: preparing a substrate on one side of which an adhesive material is applied; adhering a metal member onto the one side of the substrate; attaching an adhesive member onto the metal member; and removing predetermined portions of the metal member and the adhesive member. | 11-06-2014 |
20150027376 | DEPOSITION FILM FORMING APPARATUS INCLUDING ROTATING MEMBERS - A deposition film forming apparatus including rotary members includes a plurality of substrate supports, wherein a plurality of substrates are disposed on each of the substrate supports, and each of the substrates is rotated on the substrate supports by means of a gas-foil method. | 01-29-2015 |