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Jacques Duparre, Jena DE

Jacques Duparre, Jena DE

Patent application numberDescriptionPublished
20090050946CAMERA MODULE, ARRAY BASED THEREON, AND METHOD FOR THE PRODUCTION THEREOF - The invention relates to the development of economical camera modules having objectives contained therein with a minimal constructional length and excellent optical properties. It is made possible as a result that camera modules of this type can be used in mobile telephones or minicomputers, such as PDAs (personal digital assistant).02-26-2009
20090322856IMAGE RECORDING SYSTEM PROVIDING A PANORAMIC VIEW - The invention relates to an image detection system for a panoramic view comprising linearly disposed optical channels with a microlens and a detector which is situated in the focal plane thereof. The camera unit is thereby mounted on a rotating or rotating-oscillating rotational shaft, as a result of which a panoramic view of the image detection system is made possible. Image detection systems of this type are used in medical technology, on vehicles, for inspection of hole-like recesses and also for 360° image detection in rooms.12-31-2009
20090323206IMAGING MODULE WITH SYMMETRICAL LENS SYSTEM AND METHOD OF MANUFACTURE - An imaging module and method of fabrication. The method comprises forming a first lens wafer with a plurality of outer negative lenses and forming a second lens wafer with a plurality of inner negative lenses The method further comprises bonding the first lens wafer and second lens wafer to create a bonded stack; forming a plurality of inner positive lenses on the second lens wafer and bonding a spacer wafer to the second lens wafer; and forming a plurality of outer positive lenses on the first lens wafer.12-31-2009
20100002312Over-molded glass lenses and method of forming the same - Accurate lens substrates on a waferscale are obtained by forming a polymer material on a lens surface formed on a lens wafer. The substrate may also be thinned by the glass lens surface forming process at the portion of the lens. The polymer material may have the same or different optical properties (refractive index and dispersion) as the lens wafer.01-07-2010
20100002313METHOD AND APPARATUS PROVIDING SINGLET WAFER LENS SYSTEM WITH FIELD FLATTENER - Methods and apparatus to correct a curved Petzval focusing surface to a plane using a convex lens, a concave lens, and a space arranged between the curved side of the convex lens and the curved side of the concave lens. The method and apparatus may also include a Fresnel lens arranged between the concave lens and a pixel array.01-07-2010
20100002314Lens system with symmetrical optics - A lens system comprising an inner lens structure and an outer lens structure. The inner lens structure comprises an inner positive lens, a first transparent substrate and an inner negative lens. The outer lens structure comprises an outer positive lens, a second transparent substrate and an outer negative lens.01-07-2010
20100123209Apparatus and Method of Manufacture for Movable Lens on Transparent Substrate - A lens stack having a movable lens attached to a MEMS structure and method of fabricating the same. The method comprises attaching at least one MEMS structure to a transparent substrate. The method further comprises forming a movable lens in contact with the at least one MEMS structure.05-20-2010
20100123260STAMP WITH MASK PATTERN FOR DISCRETE LENS REPLICATION - A method and stamp for forming lenses on a wafer. The stamp includes a mask arranged on a substrate and aligned with a plurality of lens-shaped cavities. The lens-shaped cavities are used to imprint a plurality of lenses into a curable material. The lenses are cured through the mask using radiation. The lenses are separated from the stamp and the uncured material is removed.05-20-2010
20100177235IMAGING DEVICE HAVING MICROLENS ARRAY ADHERED TO WAFER-LEVEL LENS - Methods and apparatuses having imaging structures that include a focusing lens structure, a pixel array, and a transparent material arranged between the focusing lens and the pixel array. A color filter array may be located between the transparent material and the pixels of the pixel array.07-15-2010
20100177408METHOD OF FORMING LENS ARRAYS AND TRANSFERRING SUCH ONTO MOVABLE-MEMS STRUCTURES - Micro-electrical-mechanical (MEMS) wafers in which a lens is formed on a micro-electrical-mechanical structure. The micro-electrical-mechanical wafers can comprise a substrate, MEMS structures, and a lens array. A method of forming a micro-electrical-mechanical wafer comprises providing a substrate, forming a micro-electrical-mechanical structure on the substrate, forming a carrier, forming a lens array on the carrier, and transferring the lens array from the carrier onto the micro-electrical-mechanical structure. The lens array is placed above the micro-electrical-mechanical structure.07-15-2010
20100177411WAFER LEVEL LENS REPLICATION ON MICRO-ELECTRICAL-MECHANICAL SYSTEMS - Movable lens structures in which a lens is formed on a micro-electrical-mechanical system and methods of making the same. A method of forming the lens includes forming a micro-electrical-mechanical system on a substrate, arranging a first mold inside the micro-electrical-mechanical system, and forming a lens on the micro-electrical-mechanical system using the first mold.07-15-2010
20100244165METHOD AND APPARATUS PROVIDING COMBINED SPACER AND OPTICAL LENS ELEMENT - A method and apparatus used for forming a lens and spacer combination, and imager module employing the spacer and lens combination. The apparatus includes a mold having a base, spacer section, and mold feature. The method includes using the mold with a blank to create a spacer that includes an integral lens. The spacer and lens combination and imager modules can be formed on a wafer level.09-30-2010
20100253832LENS SHIELDING STRUCTURES FOR DIGITAL IMAGE SENSORS - Camera modules are provided using wafer level optics structures. Wafers of optical stack components such as spacers, lenses, filters, and aperture layers may be combined to form optical stacks for camera modules. Each optical stack may be formed from pieces of the lens and spacer wafers. The optical stacks may be mounted above digital image sensors to form compact camera modules for devices such as cellular telephones and digital cameras. To reduce lens flare, a lens hood structure may be mounted above the outermost lens in the optical stack structure. The lens hood structure may be formed from a layer of opaque plastic having an inner surface and an outer surface. The layer of plastic may be provided as part of a camera module housing or as a separate structure. A noncircular lens hood aperture may be formed in the outer surface of the lens hood layer. A corresponding inner aperture may be formed in the inner surface of the lens hood layer adjacent to the optical stack structure. The noncircular exterior surface aperture of the lens hood may have a barrel shape, a rectangular shape, an oval shape, a pincushion shape, or other suitable shapes that help reduce flare for digital image sensors with rectangular active areas.10-07-2010
20100271714ACHROMATIC LENS STRUCTURE, METHOD OF FABRICATION, AND IMAGING DEVICES AND SYSTEMS USING THE SAME - Lens structures, imaging devices, and methods of making the same that include a lens and a transparent material having different dispersions and used to correct chromatic and spherical aberrations. The transparent material may be a curable polymer used to join the lens to other elements of the lens structure.10-28-2010
20100277627Image Sensor - Image sensor having a large number of image sensor units in an essentially array-like arrangement, the light-sensitive surfaces of the image sensor units being node points at a spacing relative to each other and these, together with the horizontal and vertical connection lines which connect the node points, spanning a two-dimensional network, and the array-like arrangement having a central region and an edge region, the central region and the edge region being connected to each other along at least connection line, characterised in that the spacing respectively of two adjacent node points of the array-like arrangement is different along the at least one connection line in the central region and in the edge region. Furthermore, a camera system with an image sensor according to the invention and an additionally disposed lens system is disclosed.11-04-2010
20110025899ARRAY OF MICROLENSES WITH INTEGRATED ILLUMINATION - The invention relates to a microlens array with integrated illumination, an imaging system with such a microlens array, an image detection device and also a method for producing the microlens array.02-03-2011
20110080487CAPTURING AND PROCESSING OF IMAGES USING MONOLITHIC CAMERA ARRAY WITH HETEROGENEOUS IMAGERS - Systems and methods for implementing array cameras configured to perform super-resolution processing to generate higher resolution super-resolved images using a plurality of captured images and lens stack arrays that can be utilized in array cameras are disclosed. An imaging device in accordance with one embodiment of the invention includes at least one imager array, and each imager in the array comprises a plurality of light sensing elements and a lens stack including at least one lens surface, where the lens stack is configured to form an image on the light sensing elements, control circuitry configured to capture images formed on the light sensing elements of each of the imagers, and a super-resolution processing module configured to generate at least one higher resolution super-resolved image using a plurality of the captured images.04-07-2011
20110122308CAPTURING AND PROCESSING OF IMAGES USING MONOLITHIC CAMERA ARRAY WITH HETEROGENEOUS IMAGERS - Systems and methods for implementing array cameras configured to perform super-resolution processing to generate higher resolution super-resolved images using a plurality of captured images and lens stack arrays that can be utilized in array cameras are disclosed. Lens stack arrays in accordance with many embodiments of the invention include lens elements formed on substrates separated by spacers, where the lens elements, substrates and spacers are configured to form a plurality of optical channels, at least one aperture located within each optical channel, at least one spectral filter located within each optical channel, where each spectral filter is configured to pass a specific spectral band of light, and light blocking materials located within the lens stack array to optically isolate the optical channels.05-26-2011
20110134040OPTICAL NAVIGATION DEVICE - A device for optical navigation, containing an image sensor which has a large number of image sensor units which are disposed in an array-like manner with respectively at least one light-sensitive surface and at least one lens which is disposed between an object to be imaged and the image sensor. A microlens array is present, at least one microlens being assigned to one image sensor unit.06-09-2011

Patent applications by Jacques Duparre, Jena DE