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Iyad
Iyad Alhayed, Schaumburg, IL US
| Patent application number | Description | Published |
|---|---|---|
| 20080236782 | THERMAL DISSIPATION IN CHIP - A system for dissipating heat from a semiconductor board includes a first substrate including an opening formed therein, a second substrate attached to a surface of the first substrate, and a microchip positioned in the opening and bumped to the second substrate. The system further includes a heat sink directly adhered to the microchip. A method of manufacturing a heat dissipating semiconductor board includes forming an opening in a first substrate and positioning a microchip in the opening. The method further includes directly adhering the microchip to a heat sink, bonding the microchip to a second substrate and boding a surface of the first substrate to the second substrate. | 10-02-2008 |
Iyad Al-Zaharnah, Dhahran SA
| Patent application number | Description | Published |
|---|---|---|
| 20100280800 | Method of modeling flexural characteristics of a bar subjected to local heating - The method of modeling flexural characteristics of a bar subjected to local heating utilizes thermal diffusion equations and the finite element method to model vibrational frequency and amplitude variation in a substrate material subjected to local heating. Both heated and non-heated cases are considered. | 11-04-2010 |
| 20110060562 | Method of determining the elastic modulus of coatings - The method of determining the elastic modulus of coatings utilizes numerical modeling and simulation methods to determine physical characteristics of coatings based upon comparisons of measured flexural characteristics with the numerical models and simulations. Particularly, the method of determining the elastic modulus of coatings utilizes a numerical modeling technique, such as the finite element method, to model vibrational frequency and amplitude variation in a substrate material with a metallic or ceramic coating. | 03-10-2011 |
Iyad Muslet, Mason, OH US
| Patent application number | Description | Published |
|---|---|---|
| 20080207071 | ELASTOMERIC LAMINATE MATERIALS THAT DO NOT REQUIRE MECHANICAL ACTIVATION - An elastomeric laminate that does not require mechanical activation comprises an elastomeric polymer film layer bonded to one or more other substrate layers. The elastomeric film composition, physical properties of the substrate, and bonding conditions are selected and controlled to form an elastomeric laminate that is stretchable and recoverable without the use of excess material or post-lamination mechanical activation. The resulting elastomeric laminate may be manufactured on relatively simple high-speed equipment at lower cost and with improved physical properties. | 08-28-2008 |
| 20090264844 | EXTRUSION BONDED LAMINATES FOR ABSORBENT ARTICLES - An absorbent article of the present invention may comprise a topsheet, an outer cover, and an absorbent core disposed therebetween. The outer cover may comprise an extrusion bonded laminate. The EBL may comprise a multi-layer coextruded elastomeric film and a nonwoven. The film may comprise a core layer, a first outer layer, and a second outer layer, wherein the core layer is between the first and second outer layers. The nonwoven may comprise fibers and/or filaments. The first outer layer may be non-adhesively joined to the nonwoven via extrusion coating. Further, the outer cover may be elastic to at least about 50% engineering strain. The nonwoven may have high chemical affinity for the first outer layer. The first outer layer may have a low chemical affinity for the core layer; and the multi-layer coextruded elastomeric film may have a basis weight no greater than about 40 gsm. | 10-22-2009 |
| 20100040826 | Extrusion Bonded Laminates for Absorbent Articles - An absorbent article of the present invention may comprise a topsheet, an outer cover, and an absorbent core disposed therebetween. The outer cover may comprise an extrusion bonded laminate. The EBL may comprise a multi-layer coextruded elastomeric film and a nonwoven. The film may comprise a core layer, a first outer layer, and a second outer layer, wherein the core layer is between the first and second outer layers. The nonwoven may comprise fibers and/or filaments. The first outer layer may be non-adhesively joined to the nonwoven via extrusion coating. Further, the outer cover may be elastic to at least about 50% engineering strain. The nonwoven may have high chemical affinity for the first outer layer. The first outer layer may have a low chemical affinity for the core layer. And, the first outer layer may comprise an amount of draw down polymer greater than about 45 wt %. | 02-18-2010 |
Iyad Saadeddin, Naplouse PK
| Patent application number | Description | Published |
|---|---|---|
| 20090315001 | PROCESS FOR PREPARING CERAMICS, CERAMICS THUS OBTAINED AND USES THEREOF, ESPECIALLY AS A SPUTTERING TARGET - Process for preparing a ceramic from an inorganic base material that is in the form of a powder having a high melting point, comprising a step of mixing the powder of the inorganic base material with a second inorganic component also in powder form and which acts as a dopant for the inorganic base material. The dopant is constituted by a single inorganic material or by a mixture of at least two inorganic materials having a dopant effect on the inorganic base material. The process comprises a sintering step carried out at a high temperature. The ceramics obtained, because of their high density, are advantageously used as a target element. Films and electrodes obtained from these ceramics exhibit particularly advantageous properties. | 12-24-2009 |