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Iwashita, Kanagawa

Futoshi Iwashita, Kanagawa JP

Patent application numberDescriptionPublished
20110181536DISPLAY APPARATUS AND DISPLAY METHOD THEREOF - Desired character information can be effectively obtained. The display apparatus (display terminal) includes a display part, a plurality of operation portions, to which different characters are assigned and which are provided adjacent to one another, an operation detection part which detects operation states of the plurality of operation portions, and a control part which displays character information about a character assigned to an operation portion, to which an operation is detected by the operation detection part, wherein if it is determined that a first operation portion among the plurality of operation portions is operated based on detection of an operation state by the operation detection part, the control part displays character information about a character assigned to the first operation portion on the display part, and further specifies a second operation portion associated with the first operation portion based on the operation state to the first operation portion, and displays character information about a character assigned to the second operation portion on the display part.07-28-2011

Jun Iwashita, Kanagawa JP

Patent application numberDescriptionPublished
20100062379METHOD OF FORMING RESIST PATTERN - Disclosed is a method of forming a resist pattern, including: applying a positive resist composition on a support 03-11-2010

Ryuji Iwashita, Kanagawa JP

Patent application numberDescriptionPublished
20110116774IMAGING APPARATUS - Disclosed herein is an imaging apparatus including: an apparatus body in which a heat radiating part is disposed; and a heat dissipating section formed at an upper portion of the apparatus body, wherein the heat dissipating section has a recess provided in an upper portion of the apparatus body, and a closing plate so mounted as to close the recess, a space is formed between the recess and the closing plate, the recess is formed with a vent hole through which the inside of the apparatus body and the space communicate with each other, the closing plate is provided with a heat dissipating hole through which the space communicates with the exterior, and the vent hole and the heat dissipating hole are positionally deviated from each other.05-19-2011

Shin-Ichi Iwashita, Kanagawa JP

Patent application numberDescriptionPublished
20100110747SEMICONDUCTOR MEMORY DEVICE - The semiconductor memory device proposed in the present invention comprises memory cells disposed in the row direction and the column direction, a plurality of first lines by which supply voltages are supplied in order to select memory cells disposed in the row direction among the plurality of cells, a plurality of second lines by which supply voltages are supplied in order to select memory cells disposed in the column direction among the plurality of cells, the data lines which input and output the data to the selected memory cells, the first power voltage supply circuit which supplies the predetermined supply voltages to the first lines corresponding with the externally input row address synchronizing with an act command, and the second power voltage supply circuit which supplies the predetermined supply voltages to the second lines corresponding with the externally input column address synchronizing with an act command. It also comprises m pieces of memory banks (m is a natural number larger than 2) which write or read the data into or from the memory cells which are selected one after another in the row or column directions, data input circuits in which multiple bits of serial data which is larger than 512 bits to be written in the m pieces of memory banks, data output circuits which reads the data from the m pieces of memory banks and output in a form of multiple bits of serial data which is larger than 512 bits, and data conversion circuits which convert the serial data input in the data input circuits to parallel data so that it can be written in each memory bank or to convert each parallel data read from each memory bank to serial data so that such data are supplied to the data output circuits.05-06-2010

Takuro Iwashita, Kanagawa JP

Patent application numberDescriptionPublished
20090007547Control Method of Exhaust Gas Purification System and Exhaust Gas Purification System - At regeneration control while a vehicle mounting an internal combustion engine (01-08-2009
20090025372Method for Controlling Exhaust Gas Purification System and Exhaust Gas Purification System - In regeneration control, when the catalyst temperature index temperature (Tg01-29-2009
20090150045FUEL INJECTION CONTROL DEVICE - A fuel injection control device that prevents a misfire is provided. The fuel injection control device comprises: target injection amount determination means 06-11-2009
20090183494Control Method of Exhaust Gas Purification System and Exhaust Gas Purification System - In forced regeneration control of an exhaust gas purification device 07-23-2009
20100089032EXHAUST EMISSION PURIFICATION METHOD AND EXHAUST EMISSION PURIFICATION SYSTEM - In case of emergency regeneration, i.e. any one of forced regeneration after a judgment is made that purification is insufficient in purification judgment after ending forced regeneration, forced regeneration after time has expired before completing of forced regeneration, or forced regeneration when the pressure difference across a DPF exceeds a predetermined first judging pressure difference under a state where traveling distance of a vehicle is shorter than a predetermined distance for judgment an alarm for urging manual regeneration is issued, and wherein when manual regeneration is designated thereafter manual regeneration is performed and when predetermined conditions are satisfied without the reception of a designation of manual regeneration, automatic regeneration is performed. In forced regeneration of the DPF for purifying PM in exhaust gas, forced regeneration is performed surely even if manual regeneration is not selected at the time of emergency regeneration, and convenience is enhanced by reducing burden on a driver.04-15-2010

Tomohiro Iwashita, Kanagawa JP

Patent application numberDescriptionPublished
20120069690SEMICONDUCTOR INTEGRATED CIRCUIT AND CONTROL METHOD - A semiconductor integrated circuit for selecting one from a plurality of external storage devices and loading an execution program that includes a fuse part having a plurality of internal fuse circuits, and a processing unit that loads the execution program from the external storage device selected according to a value indicated by the internal fuse circuit.03-22-2012

Tooru Iwashita, Kanagawa JP

Patent application numberDescriptionPublished
20100052698Integrated circuit architecture for testing variable delay circuit - An integrated circuit is provided with first and second variable delay circuits, a test data feeding circuitry, a test control circuit, and a wire-connection line. The test data feeding circuitry feeds first and second test data signals to the first and second variable delay circuits, respectively. The first and second test data signals are complement to each other. The test control circuit feeds first and second drive capability control signals to the first and second variable delay circuits to control drive capabilities of the first and second variable delay circuits. The wire-connection line provides a wire-connection for outputs of the first and second variable delay circuits.03-04-2010

Yumiko Iwashita, Kanagawa JP

Patent application numberDescriptionPublished
20080277033COPPER ALLOY AND METHOD OF MANUFACTURING THE SAME - Raw materials for a copper alloy are melted in a high frequency smelter and cast, and milling, rolling, and annealing are carried out. Then, rolling is again carried out. Thereafter, the materials are heated at a temperature of 900° C. for one minute and are quenched in water, to be solution treated. Subsequently, the materials are heated at a temperature of 500° C. for five hours for aging, and then are cooled at a cooling rate in a range of 10 to 50° C. per hour until the materials are cooled to a temperature of 380° C.11-13-2008