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Iwasaki, Hyogo
Masahide Iwasaki, Hyogo JP
| Patent application number | Description | Published |
|---|---|---|
| 20100101728 | PLASMA PROCESS APPARATUS - A disclosed a plasma process apparatus includes a process chamber that houses a substrate subjected to a predetermined plasma process and may be evacuated to a reduced pressure; a microwave generator that generates microwaves for generating plasma; a waveguide pipe that transmits the microwaves from the microwave generator to the process chamber; a waveguide pipe/coaxial pipe converter connected to one end of the waveguide pipe; and a coaxial pipe that forms a line through which the microwaves are transmitted from the waveguide pipe-coaxial pipe converter to the process chamber. An inner conductive body of the coaxial pipe has a hollow portion; and a first process gas supplying portion that supplies a process gas into the process chamber through the hollow portion of the inner conductive body of the coaxial pipe. | 04-29-2010 |
Nobuyuki Iwasaki, Hyogo JP
Ryuta Iwasaki, Hyogo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090079434 | Car power source apparatus - The car power source apparatus is provided with a leakage detection circuit | 03-26-2009 |
Shin Iwasaki, Hyogo JP
| Patent application number | Description | Published |
|---|---|---|
| 20120009291 | DIE FOR UNDERWATER CUTTING TYPE PELLETIZER - A die for an underwater cutting type pelletizer, the die including a die orifice part in which a thermoplastic resin is inhibited from solidifying within the die orifices. The die can have a reduced difference in temperature between the die orifice part and an inner periphery-side fixing part for fixing the die orifice part to a mixer/extruder, and can thereby inhibit the generation of thermal stress. The die is characterized by being equipped with a heating jacket for heating the inner periphery-side fixing part, the heating jacket being disposed within the inner periphery-side fixing part along an inner annular passage formed within either the die orifice part or the inner periphery-side fixing part or both along the boundary between the die orifice part and the inner periphery-side fixing part. | 01-12-2012 |
Takashi Iwasaki, Hyogo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090012405 | Imaging system - An imaging system | 01-08-2009 |
Yasukuni Iwasaki, Hyogo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090229977 | Magnet Structure and Cathode Electrode Unit for Magnetron Sputtering System, and Magnetron Sputtering System - Provided are a magnet structure and the like capable of changing a magnetic force line distribution on a surface of a target to thereby achieve wide erosion of a target, using a simple drive mechanism. A magnet structure ( | 09-17-2009 |
| 20090314199 | Vacuum Chamber - The present invention provides a vacuum chamber capable of simplifying the structure of the arrangement of a cooling passage. The vacuum chamber of the present invention includes a plurality of wall members, the plurality of the wall members are connected to each other to construct a chamber main body by connection portions where connection surfaces each of which is part of a surface of each wall member are hermetically connected to each other, and at least part of the connection portions are built-in gap type connection portions each of which has a gap extending along the corresponding connection surfaces inside the connection surfaces and in which peripheries of the connection surfaces are hermetically connected to each other by welding. | 12-24-2009 |
| 20100230282 | Magnet Structure and Cathode Electrode Unit for Magnetron Sputtering, and Magnetron Sputtering System - A magnet structure and the like are provided, which can reduce the labor required to make a magnet design for producing a tunnel-shaped leakage magnetic field for plasma confinement in a well-balanced manner over an obverse surface of a target, based on a quadridirectional magnetic field produced by magnetic interaction between plural magnets. The magnet structure ( | 09-16-2010 |
Yoichi Iwasaki, Hyogo JP
| Patent application number | Description | Published |
|---|---|---|
| 20110154826 | GAS TURBINE, METHOD OF CONTROLLING AIR SUPPLY AND COMPUTER PROGRAM PRODUCT FOR CONTROLLING AIR SUPPLY - The present invention provides a gas turbine capable of reducing energy consumption while suppressing a so-called cat back phenomenon. The gas turbine includes a combustor-accommodating chamber casing for accommodating therein a combustor which burns fuel and air compressed by a compressor to generate combustion gas and which injects the combustion gas to a turbine. The gas turbine also includes a first air supply passage and a second air supply passage on an upper portion of the combustor-accommodating chamber casing in the vertical direction. The first air supply passage discharges air toward the compressor in the combustor-accommodating chamber casing. The second air supply passage discharges air in a direction different from that of the first air supply passage. | 06-30-2011 |
| 20110154828 | GAS TURBINE, METHOD OF CONTROLLING AIR SUPPLY AND COMPUTER PROGRAM PRODUCT FOR CONTROLLING AIR SUPPLY - The present invention provides a gas turbine capable of reducing energy consumption while suppressing a so-called cat back phenomenon. The gas turbine includes a combustor-accommodating chamber casing for accommodating therein a combustor which burns fuel and air compressed by a compressor to generate combustion gas and which injects the combustion gas to a turbine. The gas turbine also includes a first air supply passage and a second air supply passage on an upper portion of the combustor-accommodating chamber casing in the vertical direction. The first air supply passage discharges air toward the compressor in the combustor-accommodating chamber casing. The second air supply passage discharges air in a direction different from that of the first air supply passage. | 06-30-2011 |
Yoshifumi Iwasaki, Hyogo JP
| Patent application number | Description | Published |
|---|---|---|
| 20110154826 | GAS TURBINE, METHOD OF CONTROLLING AIR SUPPLY AND COMPUTER PROGRAM PRODUCT FOR CONTROLLING AIR SUPPLY - The present invention provides a gas turbine capable of reducing energy consumption while suppressing a so-called cat back phenomenon. The gas turbine includes a combustor-accommodating chamber casing for accommodating therein a combustor which burns fuel and air compressed by a compressor to generate combustion gas and which injects the combustion gas to a turbine. The gas turbine also includes a first air supply passage and a second air supply passage on an upper portion of the combustor-accommodating chamber casing in the vertical direction. The first air supply passage discharges air toward the compressor in the combustor-accommodating chamber casing. The second air supply passage discharges air in a direction different from that of the first air supply passage. | 06-30-2011 |
| 20110154828 | GAS TURBINE, METHOD OF CONTROLLING AIR SUPPLY AND COMPUTER PROGRAM PRODUCT FOR CONTROLLING AIR SUPPLY - The present invention provides a gas turbine capable of reducing energy consumption while suppressing a so-called cat back phenomenon. The gas turbine includes a combustor-accommodating chamber casing for accommodating therein a combustor which burns fuel and air compressed by a compressor to generate combustion gas and which injects the combustion gas to a turbine. The gas turbine also includes a first air supply passage and a second air supply passage on an upper portion of the combustor-accommodating chamber casing in the vertical direction. The first air supply passage discharges air toward the compressor in the combustor-accommodating chamber casing. The second air supply passage discharges air in a direction different from that of the first air supply passage. | 06-30-2011 |
Yuki Iwasaki, Hyogo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090026072 | AL-NI-LA-SI SYSTEM AL-BASED ALLOY SPUTTERING TARGET AND PROCESS FOR PRODUCING THE SAME - The present invention relates to an Al—Ni—La—Si system Al-based alloy sputtering target including Ni, La and Si, in which, when a section from (¼)t to (¾)t (t: thickness) in a cross section vertical to a plane of the sputtering target is observed with a scanning electron microscope at a magnification of 2000 times, (1) a total area of an Al—Ni system intermetallic compound having an average particle diameter of 0.3 μm to 3 μm with respect to a total area of the entire Al—Ni system intermetallic compound is 70% or more in terms of an area fraction, the Al—Ni system intermetallic compound being mainly composed of Al and Ni; and (2) a total area of an Al—Ni—La—Si system intermetallic compound having an average particle diameter of 0.2 μm to 2 μm with respect to a total area of the entire Al—Ni—La—Si system intermetallic compound is 70% or more in terms of an area fraction, the Al—Ni—La—Si system intermetallic compound being mainly composed of Al, Ni, La, and Si. | 01-29-2009 |
| 20090242394 | AL-BASED ALLOY SPUTTERING TARGET AND MANUFACTURING METHOD THEREOF - The present invention provides an Al—(Ni, Co)—(Cu, Ge)—(La, Gd, Nd) alloy sputtering target capable of decreasing a generation of splashing in an initial stage of using the sputtering target, preventing defects caused thereby in interconnection films or the like and improving a yield and operation performance of an FPD, as well as a manufacturing method thereof. The invention relates to an Al-based alloy sputtering target which is an Al—(Ni, Co)—(Cu, Ge)—(La, Gd, Nd) alloy sputtering target comprising at least one member selected from the group A (Ni, Co), at least one member selected from the group B (Cu, Ge), and at least one member selected from the group C (La, Gd, Nd) wherein a Vickers hardness (HV) thereof is 35 or more. | 10-01-2009 |
| 20090242395 | Al-Ni-La-Cu alloy sputtering target and manufacturing method thereof - The present invention provides a technique capable of decreasing a generation of splashing upon depositing by using an Al—Ni—La—Cu alloy sputtering target comprising Ni, La, and Cu. The invention relates to an Al—Ni—La—Cu alloy sputtering target comprising Ni, La and Cu, in which (1) a total area of an Al—Ni intermetallic compound mainly comprising Al and Ni and having an average grain size of 0.3 μm or more and 3 μm or less is 70% or more by area ratio based on an entire area of the Al—Ni intermetallic compound, and (2) a total area of an Al—La—Cu intermetallic compound mainly comprising Al, La and Cu and having an average grain size of 0.2 μm or more and 2 μm or less is 70% or more by area ratio based on an entire area of the Al—La—Cu intermetallic compound, in a case where a portion of the sputtering target is observed within a range of from 1/4 t (t: thickness) to 3/4 t along a cross section vertical to a plane of the sputtering target by using a scanning electron microscope at a magnification of 2000. | 10-01-2009 |