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Iwamizu

Keita Iwamizu, Fukuroi-Shi JP

Patent application numberDescriptionPublished
20100051587Welding Apparatus, Tubular Body With a Covered Tip End and Welding Method - The tip end of a tubular body is oriented towards an inner bottom face of a recess for holding a heating body, then the outer peripheral surface is oriented towards the inner peripheral surface of a heating body, and said tubular body is inserted into the heating body from the open side of the recess in the axial direction. This allows a film to be shaped from the tip end around the outer peripheral surface of the tubular body. The film and the heating body are heated in an overlapping state, and the film is welded to the outer peripheral surface of the tubular body.03-04-2010
20100178014Plug and Connecting Structure for Endoscope Provided Therewith - A plug in which the base end portions of an image guide comprise an image guide fiber and an image guide rod. A light guide comprising a light guide fiber and a light guide rod are fixed to a plug main body in a parallel state. The plug and a socket can be connected. The diameter of a position-aligning hole portion into which the base end of the image guide rod is inserted is set to be substantially the same as the outer diameter of the image guide rod , while the diameter of a position-aligning hole portion into which the base end of the light guide rod is inserted is set to be greater than the outer diameter of the light guide rod.07-15-2010
20110130629ENDOSCOPE COVER FIXING DEVICE AND FIXING SYSTEM - An endoscope cover fixing device to reliably fix a cover to an endoscope without associated damage. The endoscope cover fixing device includes a fixing device main body and a pair of fixing protrusion portions. The fixing device main body includes a curved portion and insert holes, and is deformable in the direction in which the bend amount increases. The pair of fixing protrusion portions, which have contact surfaces, are provided to protrude from a concave surface side of the fixing device main body and are disposed in two opposing regions of the concave surface. The contact surfaces are disposed in parallel with a fixed distance therebetween. During deformation of the fixing device main body, the pair of fixing protrusion portions move in parallel in opposing directions. As a result, the contact surfaces contact opposing positions on the outer circumferential surface of the endoscope by way of the cover.06-02-2011
20110152617ENDOSCOPE COVER FIXING DEVICE AND FIXING SYSTEM - An endoscope cover fixing device able to reliably fix the position of a cover to an endoscope without associated damage. The endoscope cover fixing device includes a fixing device main body and a wedge-shaped portion. Insert portions 06-23-2011

Morio Iwamizu, Matsumoto City JP

Patent application numberDescriptionPublished
20090289670SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A buffer circuit is provided between a gate terminal of a pull-down transistor and a threshold circuit receiving a gate signal as an input signal. A voltage applied to an output terminal of a power semiconductor element from an external battery power supply is supplied to the buffer circuit through a resistive element. The buffer circuit converts the level of an on-signal output from the threshold circuit into a voltage higher than the threshold of the pull-down transistor, so that the pull-down transistor operates surely to turn off the power semiconductor element even when the level of the gate signal is low. Thus, there is provided a semiconductor integrated circuit device having a power semiconductor element which can be turned off by sure operation of a pull-down semiconductor element.11-26-2009

Morio Iwamizu, Nagano JP

Patent application numberDescriptionPublished
20090153227TEMPERATURE SENSOR CIRCUIT - A temperature sensor circuit is provided that facilitates preventing a too-high overshooting voltage from occurring at an output terminal when a power supply is connected to the temperature sensor circuit. The temperature sensor circuit includes a short-circuiting device, disposed in parallel to depletion mode NMOS, that short-circuits the drain and source of depletion mode NMOS when a power supply is connected; and delay device that transmits a signal for short-circuiting the drain and source of depletion mode NMOS for a certain period from the time point of power supply connection to short-circuiting device for preventing the voltage at output terminal of temperature sensor circuit from overshooting.06-18-2009