| Patent application number | Description | Published |
|---|
| 20090191665 | Electronic Device and Method of Manufacturing Same - This application relates to a method of manufacturing an electronic device comprising placing a first chip on a carrier; applying an insulating layer over the first chip and the carrier; applying a metal ions containing solution to the insulating layer for producing a first metal layer of a first thickness; and producing a second metal layer of a second thickness on the insulating layer wherein at least one of the first metal layer and the second metal layer comprises at least a portion that is laterally spaced apart from the respective other metal layer. | 07-30-2009 |
| 20090206456 | MODULE INCLUDING A SINTERED JOINT BONDING A SEMICONDUCTOR CHIP TO A COPPER SURFACE - A module includes a substrate including a first copper surface and a semiconductor chip. The module includes a first sintered joint bonding the semiconductor chip directly to the first copper surface. | 08-20-2009 |
| 20090273063 | SEMICONDUCTOR DEVICE - One embodiment provides a semiconductor device including a carrier, a first chip attached to the carrier, a structured dielectric coupled to the chip and to the carrier, and a conducting element electrically connected with the chip and extending over a portion of the structured dielectric. The conducting element includes a sintered region. | 11-05-2009 |
| 20090273066 | SEMICONDUCTOR DEVICE AND METHOD - An electronic device and fabrication of an electronic device. One embodiment provides applying a paste including electrically conductive particles to a surface of a semiconductor wafer. The semiconductor wafer is singulated with the electrically conductive particles for obtaining a plurality of semiconductor chips. At least one of the plurality of semiconductor chips is placed over a carrier with the electrically conductive particles facing the carrier. The electrically conductive particles are heated until the at least one semiconductor chip adheres to the carrier. | 11-05-2009 |
| 20090294963 | MODULE INCLUDING A SINTERED JOINT - A method comprises applying a paste comprising metal grains, a solvent, and a sintering inhibitor to one of a die and a metal layer. The method comprises evaporating the solvent in the paste and placing the one of the die and the metal layer on the other of the die and the metal layer such that the paste contacts the die and the metal layer. The method comprises applying a force to the one of the die and the metal layer and decomposing the sintering inhibitors to form a sintered joint joining the die to the metal layer. | 12-03-2009 |
| 20100044885 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD - A semiconductor device and manufacturing method. One embodiment provides at least two semiconductor chips. A dielectric material is applied to the at least two semiconductor chips to attach the at least two semiconductor chips to each other. A portion of the dielectric material is selectively removed between the at least two semiconductor chips to form at least one recess in the dielectric material. Metal particles including paste is applied to the at least one recess in the dielectric material. | 02-25-2010 |
| 20100055839 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device. One embodiment provides a carrier. A semiconductor chip is provided with a first face and a second face opposite to the first face. The semiconductor chip is placed over the carrier with the first face facing the carrier. A voltage is applied between the second face of the semiconductor chip and the carrier for attaching the semiconductor chip to the carrier. | 03-04-2010 |
| 20100059857 | METHOD OF FABRICATING A SEMICONDUCTOR DEVICE - A method of fabricating a semiconductor device. One embodiment provides a metal carrier. A semiconductor chip is provided. A porous layer is produced at a surface of at least one of the carrier and the semiconductor chip. The semiconductor chip is placed on the carrier. The resulting structure is heated until the semiconductor chip is attached to the carrier. | 03-11-2010 |
| 20100072616 | METHOD OF MANUFACTURING AN ELECTRONIC SYSTEM - A method of manufacturing an electronic system. One embodiment provides a semiconductor chip having a first main face and a second main face opposite to the first main face. A mask is applied to the first main face of the semiconductor chip. A compound is applied to the first main face of the semiconductor chip. The compound includes electronically conductive particles. The semiconductor chip is coupled to a carrier with the compound facing the carrier. | 03-25-2010 |
| 20100072628 | SEMICONDUCTOR DEVICE - A semiconductor device includes a carrier and a first chip attached to the carrier. The semiconductor device includes a sintered insulation material over at least a portion of the carrier and the first chip. | 03-25-2010 |
| 20100148381 | SEMICONDUCTOR DEVICE - A semiconductor device is disclosed. One aspect provides a semiconductor device that includes a semiconductor chip including a first face and a second face opposite the first face, an encapsulant including inorganic particles encapsulating the semiconductor chip, a first metal layer attached to the first face of the semiconductor chip, a second metal layer attached the second face of the semiconductor chip, and electrically conducting material configured to connect the first metal layer with the second metal layer. | 06-17-2010 |
| 20100207263 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first chip coupled to an electrical insulator, and a sintered heat conducting layer disposed between the electrical insulator and the first chip. | 08-19-2010 |
| 20100230798 | SEMICONDUCTOR DEVICE INCLUDING SPACER ELEMENT - A semiconductor device includes a metal carrier and a spacer element attached to the metal carrier. The semiconductor device includes a first sintered metal layer on the spacer element and a semiconductor chip on the first sintered metal layer. | 09-16-2010 |
| 20110074040 | Semiconductor Device And Method For Making Same - One or more embodiments may relate to a method for making a semiconductor structure, the method including: forming an opening at least partially through a workpiece; and forming an enclosed cavity within the opening, the forming the cavity comprising forming a paste within the opening. | 03-31-2011 |
| 20110084369 | DEVICE INCLUDING A SEMICONDUCTOR CHIP AND A CARRIER AND FABRICATION METHOD - A description is given of a method. In one embodiment the method includes providing a semiconductor chip with semiconductor material being exposed at a first surface of the semiconductor chip. The semiconductor chip is placed over a carrier with the first surface facing the carrier. An electrically conductive material is arranged between the semiconductor chip and the carrier. Heat is applied to attach the semiconductor chip to the carrier. | 04-14-2011 |
| 20110108971 | LAMINATE ELECTRONIC DEVICE - A laminate electronic device comprises a first semiconductor chip, the first semiconductor chip defining a first main face and a second main face opposite to the first main face, and having at least one electrode pad on the first main face. The laminate electronic device further comprises a carrier having a first structured metal layer arranged at a first main surface of the carrier. The first structured metal layer is bonded to the electrode pad via a first bond layer of a conductive material, wherein the first bond layer has a thickness of less than 10 μm. A first insulating layer overlies the first main surface of the carrier and the first semiconductor chip. | 05-12-2011 |
