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Itzik

Itzik Avneri, Tel Aviv IL

Patent application numberDescriptionPublished
20110077729DEVICES AND METHODS FOR CONTROL OF BLOOD PRESSURE - Apparatus and methods are described, including identifying a subject as suffering from hypertension. In response to the identifying (a) a radius of curvature of a first set of at least three regions of an arterial wall of the subject is increased at a given longitudinal location, while (b) allowing the first set of regions of the arterial wall to pulsate. A device is implanted inside the artery at the longitudinal location such that the device applies pressure to the arterial wall at a second set of at least three regions of the artery, but does not contact the first set of regions, the first set of regions and the second set of regions alternating with each other. Other embodiments are also described.03-31-2011
20110178416DEVICES AND METHODS FOR CONTROL OF BLOOD PRESSURE - Apparatus and methods are described including an implantable device shaped to define (a) at least two artery-contact regions, the artery-contact regions comprising struts that are configured to stretch an arterial wall by applying pressure to the arterial wall, and (b) at least two crimping regions that comprise locking mechanisms configured to prevent the crimping regions from becoming crimped due to pressure from the wall of the artery on the artery-contact regions. The crimping regions are configured to be crimped during insertion of the device, via a catheter, by the locking mechanisms being unlocked during insertion of the device. Other embodiments are also described.07-21-2011
20110213408DEVICES AND METHODS FOR CONTROL OF BLOOD PRESSURE - Apparatus is provided for reducing hypertension of a subject. A selective circumferential pressure applicator (09-01-2011

Itzik Harosh, Paris FR

Itzik Nisany, Herzeliya IL

Patent application numberDescriptionPublished
20090183583WAFER INSPECTION SYSTEM AND A METHOD FOR TRANSLATING WAFERS [PD] - A method for inspecting a wafer and a system. The system includes: a chuck; and a robot that includes a movable element connected to a detachable adaptor selected from a group of diced wafer detachable adaptors and non-diced wafer detachable adaptors; wherein a diced wafer detachable adaptor is shaped such to partially surround the diced wafer and comprises at least one vacuum groove adapted to apply vacuum on a tape that supports the diced wafer; and wherein the robot is adapted to fetch the wafer from a cassette and to place the wafer on the chuck.07-23-2009

Itzik Nissany, Herzeliya IL

Patent application numberDescriptionPublished
20120087774Diced Wafer Adaptor and a Method for Transferring a Diced Wafer - A diced wafer adaptor that includes: a cylindrical shaped inner portion, adapted to support and hold an annular frame and a membrane suspended within the annular frame and to apply vacuum to an outer portion of the membrane; wherein an inner portion of the membrane supports a diced wafer and is surrounded by the outer portion of the membrane; and an outer portion having a perimeter shaped substantially as a perimeter of a non-diced wafer.04-12-2012