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Itsuo
Itsuo Araki, Kikuchi-Gun JP
| Patent application number | Description | Published |
|---|---|---|
| 20080241412 | Member for plasma etching device and method for manufacture thereof - A member for a plasma etching device, which comprises a device substrate comprising quartz glass, aluminum, alumite or a combination thereof and, formed on the surface thereof, a coating film of yttrium oxide or YAG having a film thickness of 10 μm or more and a variation in the thickness of 10% or less, and preferably a surface roughness (Ra) of 1 μm or less; and a method for manufacturing the member for a plasma etching device, which comprises a step of plasma-spraying yttrium oxide or YAG to the surface of said device substrate or a step of fusing yttrium oxide or YAG with an oxyhydrogen flame, followed by coating the surface with the fused product, or a step of applying a solution containing yttrium, a yttrium compound or YAG on the above surface, followed by heating to fuse the resultant coating, or a combination of the above steps, thereby forming a coating film of yttrium oxide or YAG having a film thickness 10 μm or more and a variation in the thickness of 10% or less, and preferably a surface roughness (Ra) of 1 μm or less. The member for a plasma etching device is capable of retaining high plasma resistance for a long period of time, is free from the occurrence of the abnormal etching owing to partial change of electric characteristics, and thus can be used for a long time, in particular, even in the treatment of a large semiconductor device of a 12 inch silicon wafer. | 10-02-2008 |
Itsuo Araki, Kumamoto JP
| Patent application number | Description | Published |
|---|---|---|
| 20080216513 | Method for the Regeneration of a Worn Quartz Glass Jig - To provide a technique with which a quartz glass jig and a doped quartz glass jig are regenerated by completely removing the impurities which are attached to the surface and the impurities which have diffused into the interior from quartz glass jigs which have been used in semiconductor production processes and then carrying out working repair and removing the contamination from the working processes as well. After use, the impurities are removed from the aforementioned quartz glass jigs in the said purification treatment process which includes a purification treatment process in which the quartz glass jigs are subjected to a purification treatment in a gaseous atmosphere which includes a halogen element at a temperature within the region above a prescribed temperature. | 09-11-2008 |
Itsuo Endo, Shizuoka-Ken JP
| Patent application number | Description | Published |
|---|---|---|
| 20110173803 | SELF-PIERCING RIVET SETTING MACHINE - A self-piercing rivet setting machine comprises a C-shaped arm and a receiver section disposed at one end of the C-shaped arm to receive a self-piercing rivet fed from a feeder. The receiver section has a rivet-reach detection sensor to detect the presence or absence of a self-piercing rivet in a driving chamber therein. If the rivet-reach detection sensor detects the absence of any self-piercing rivet in the driving chamber, the sensor outputs a signal to prevent a punch from being driven. | 07-21-2011 |
Itsuo Fukuoka, Nishinomiya-City JP
| Patent application number | Description | Published |
|---|---|---|
| 20090201766 | UNDERWATER DETECTOR - The present disclosure provides an underwater detector including a power source for applying a predetermined voltage, a voltage control circuit for controlling the voltage based on a control signal, a gate signal generating module for outputting a gate signal, a switching circuit for outputting a reference signal based on the voltage controlled by the voltage control circuit and the gate signal outputted from the gate signal generating module, and a transducer for transmitting an ultrasonic signal underwater, an envelope of which being controlled based on a waveform of the control signal by being applied with the reference signal. | 08-13-2009 |
Itsuo Honda, Yokohama-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20100200079 | VENT CONTROL VALVE FOR A FUEL TANK - In a vent control valve for a fuel tank, a housing receiving a float assembly therein is provided with a communication hole passed across a wall of the housing, and an opening of the communication hole facing an interior of the housing is directly exposed to an interior of the housing when the float assembly is in a low position and overlaps with a peripheral wall of the float assembly when the float assembly is in a high position. By suitably selecting the size of the communication hole and/or the number thereof, a desired delay in the dropping of the liquid fuel level in the housing following the filling up of the fuel tank can be achieved. Thereby, overfilling of the fuel tank can be avoided. As the float assembly drops to such an extent as to clear the communication hole, the fuel vapor is allowed to flow more freely into the interior of the housing via the communication hole, and this causes an increase in the speed of the float to drop. Thereby, the venting of the fuel tank can be resumed at an appropriately earlier stage following the filled up state of the fuel tank. Thus, the closing and opening of the communication with the exterior of the fuel tank can be accomplished even when the vertical dimension of the housing is relatively small. | 08-12-2010 |
Itsuo Ito, Kyoto-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20120075616 | WHOLE BLOOD IMMUNITY MEASURING DEVICE AND WHOLE BLOOD IMMUNITY MEASURING METHOD - A whole blood immunity measuring device includes a hemolytic reagent supply device that supplies a hemolytic reagent to a whole blood sample, a first light source that irradiates light on a first blood sample as being the whole blood sample to which the hemolytic reagent is added, a first light detection device that detects transmitted first light intensity, and a Hgb calculation part that calculates concentration of hemoglobin based on the first light intensity. An immunoreagent supply device supplies an immunoreagent to the first sample, a whole second light source irradiates light on a second blood sample as being the first sample to which the immunoreagent is added. A second light detection device detects transmitted second light intensity, and a measuring object calculation part that calculates a concentration of the measuring object based on the second light intensity. | 03-29-2012 |
Itsuo Kodama, Aichi JP
| Patent application number | Description | Published |
|---|---|---|
| 20100056437 | Compositions for Treating or Preventing Myocardial Damage or Heart Failure - The present inventors compared myocardial damages after ischemia/reperfusion in wild-type mice and Midkine (MK)-deficient mice to confirm the effects and functions of MK. MK administration was found to significantly prevent cardiomyocyte apoptosis in both cultured cardiomyocytes (in vitro) and mouse models (in vivo). | 03-04-2010 |
Itsuo Kodama, Nagoya-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20100105613 | THERAPEUTIC AGENT FOR OCCLUSIVE PERIPHERAL VASCULAR DISEASE, AND USE THEREOF - A study was made on the therapeutic effect of midkine on an occlusive peripheral vascular disease, and it was found that midkine has an activity of promoting neovascularization and that a blood vessel can be proliferated and the blood flow in the upper and lower limbs can be improved (in other words, the condition of an ischemic disease in the upper and lower limbs can be ameliorated) by introducing midkine into a site affected by the occlusive peripheral vascular disease. | 04-29-2010 |
| 20100197577 | NITRIC OXIDE SYNTHASE ACTIVATOR - The object is to find a nitric oxide synthase activator, a method for the administration of the activator, and the amount of the activator to be administered. Disclosed is a nitric oxide synthase activator comprising a midkine family protein or a midkine derivative as an active ingredient. Specifically disclosed is a nitric oxide synthase activator which is intended to be administered through the blood, a coronary artery or a vein and which comprises a midkine family protein or a midkine derivative as an active ingredient. | 08-05-2010 |
Itsuo Kojima, Nagoya-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090079246 | Spiral Spring Assembly - An object of the present invention is to provide a spiral spring assembly that is capable of suppressing lateral force generated in a central shaft. | 03-26-2009 |
Itsuo Makino, Osaka-Fu JP
| Patent application number | Description | Published |
|---|---|---|
| 20090197881 | Azaindole Derivative Having PGD2 Receptor Antagonistic Activity - The present invention creates an azaindole derivative having DP receptor antagonistic activity and a pharmaceutical composition comprising the said compound as an active ingredient, and further providing a therapeutic agent for treating allergic diseases. | 08-06-2009 |
Itsuo Makino, Osaka-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20110028717 | AZAINDOLE DERIVATIVE HAVING PGD2 RECEPTOR ANTAGONISTIC ACTIVITY - The present invention creates an azaindole derivative having DP receptor antagonistic activity and a pharmaceutical composition comprising the said compound as an active ingredient, and further providing a therapeutic agent for treating allergic diseases. | 02-03-2011 |
Itsuo Murata, Aichi-Gun JP
| Patent application number | Description | Published |
|---|---|---|
| 20090190869 | FLUID DYNAMIC BEARING DEVICE - The fluid dynamic bearing device includes a housing, two bearing sleeves fixed to the housing at positions axially spaced apart from each other, and a shaft member inserted along inner peripheries of the bearing sleeves. The housing includes a spacer portion protruding further radially inwardly than inner peripheral surfaces to which the bearing sleeves are fixed. An axial fluid path is formed in the spacer portion, and the axial fluid path communicates to flow paths formed by axial grooves of the bearing sleeves. | 07-30-2009 |
Itsuo Watanabe, Ibaraki-Ken JP
| Patent application number | Description | Published |
|---|---|---|
| 20110114893 | CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTURE AND CONNECTING METHOD - A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material. | 05-19-2011 |
Itsuo Watanabe, Shimodate JP
| Patent application number | Description | Published |
|---|---|---|
| 20090314533 | ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION - An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition. | 12-24-2009 |
| 20110247867 | ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION - An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition. | 10-13-2011 |
| 20110247873 | ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION - An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition. | 10-13-2011 |
| 20110247874 | ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION - An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition. | 10-13-2011 |
Itsuo Watanabe, Chikusei-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090321116 | CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF MANUFACTURING THE SAME - The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 μm or greater but less than 10 μm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment. | 12-31-2009 |
| 20110247757 | CIRCUIT CONNECTION MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE, AND METHOD OF MANUFACTURING THE SAME - The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 μm or greater but less than 10 μm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment. | 10-13-2011 |
| 20110247870 | CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF MANUFACTURING THE SAME - The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 μm or greater but less than 10 μm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment. | 10-13-2011 |