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Itaru Oshiyama

Itaru Oshiyama, Kanagawa JP

Patent application numberDescriptionPublished
20090096049SOLID STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND IMAGING APPARATUS - A solid state imaging device having a light sensing section that performs photoelectric conversion of incident light includes: an insulating layer formed on a light receiving surface of the light sensing section; a layer having negative electric charges formed on the insulating layer; and a hole accumulation layer formed on the light receiving surface of the light sensing section.04-16-2009
20100060758SOLID-STATE IMAGING DEVICE AND METHOD OF PRODUCING SOLID-STATE IMAGING DEVICE - A solid-state imaging device includes a sensor including an impurity diffusion layer provided in a surface layer of a semiconductor substrate; and an oxide insulating film containing carbon, the oxide insulating film being provided on the sensor.03-11-2010
20100148274SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - A semiconductor device including an N-channel insulated gate field effect transistor and a P-channel insulated gate field effect transistor, the device having: a first insulating layer and a second insulating layer; and gate electrode contact plugs. Each of the gate electrodes of the N-channel insulated gate field effect transistor and the P-channel insulated gate field effect transistor is buried in a gate electrode formation opening provided in the first insulating layer.06-17-2010
20100200942SOLID STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND IMAGING APPARATUS - A solid state imaging device having a light sensing section that performs photoelectric conversion of incident light includes: an insulating layer formed on a light receiving surface of the light sensing section; a layer having negative electric charges formed on the insulating layer; and a hole accumulation layer formed on the light receiving surface of the light sensing section.08-12-2010
20100203669SOLID STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND IMAGING APPARATUS - A solid state imaging device having a light sensing section that performs photoelectric conversion of incident light includes: an insulating layer formed on a light receiving surface of the light sensing section; a layer having negative electric charges formed on the insulating layer; and a hole accumulation layer formed on the light receiving surface of the light sensing section.08-12-2010
20110089312SOLID STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND IMAGING APPARATUS - A solid state imaging device having a light sensing section that performs photoelectric conversion of incident light includes: an insulating layer formed on a light receiving surface of the light sensing section; a layer having negative electric charges formed on the insulating layer; and a hole accumulation layer formed on the light receiving surface of the light sensing section.04-21-2011
20110089313SOLID STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND IMAGING APPARATUS - A solid state imaging device having a light sensing section that performs photoelectric conversion of incident light includes: an insulating layer formed on a light receiving surface of the light sensing section; a layer having negative electric charges formed on the insulating layer; and a hole accumulation layer formed on the light receiving surface of the light sensing section.04-21-2011

Patent applications by Itaru Oshiyama, Kanagawa JP

Itaru Oshiyama, Kumamoto JP

Patent application numberDescriptionPublished
20100224946SOLID-STATE IMAGE PICKUP ELEMENT, METHOD OF MANUFACTURING THE SAME, AND IMAGE PICKUP APPARATUS INCLUDING THE SAME - An embodiment of the invention provides a solid-state image pickup element, including: a semiconductor layer having a photodiode, photoelectric conversion being carried out in the photodiode; a silicon oxide film formed on the semiconductor layer in a region having at least the photodiode by using plasma; and a film formed on the silicon oxide film and having negative fixed charges.09-09-2010
20110025872SOLID-STATE IMAGE PICKUP ELEMENT AND A METHOD OF MANUFACTURING THE SAME, AND IMAGE PICKUP DEVICE INCLUDING THE SAME - Disclosed herein is a solid-state image pickup element, including: a semiconductor layer in which a photodiode for carrying out photoelectric conversion is formed; a first film containing negative fixed charges and formed on the semiconductor layer in a region in which at least the photodiode is formed by utilizing either an atomic layer deposition method or a metal organic chemical vapor deposition method; a second film containing the negative fixed charges and formed on the first film containing therein the negative fixed charges by utilizing a physical vapor deposition method; and a third film containing the negative fixed charges and formed on the second film containing therein the negative fixed charges by utilizing either the atomic layer deposition method or the metal organic chemical vapor deposition method.02-03-2011
20110031376SOLID-STATE IMAGE PICKUP ELEMENT, METHOD OF MANUFACTURING THE SAME, AND IMAGE PICKUP APPARATUS INCLUDING THE SAME - A solid-state image pickup element 02-10-2011