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Ishino, Tokyo

Atsushi Ishino, Tokyo JP

Patent application numberDescriptionPublished
20090266502Shoe Press Belt - The present invention relates to a shoe press belt for a paper machine, comprising a substrate and a polyurethane resin impregnated to laminate on the surfaces of both the shoe side and the felt side thereof, which is excellent in abrasion resistance, crack resistance and processability. In the present invention, a polyurethane resin is produced by using a combination of two kinds of diisocyanates, that is, tolylene diisocyanate (TDI) and diphenylmethane diisocyanate (MDI) as starting materials.10-29-2009
20100059193Belt for Shoe Press03-11-2010
20100186918SHOE PRESS BELT FOR PAPER-MAKING MACHINE AND PROCESS FOR PRODUCING THE SAME - A shoe press belt for paper-making machine that reduces belt damages attributed to the friction between belt and shoe. The shoe press belt for paper-making machine having a wet paper contact surface and a shoe contact surface, is characterized in that the shoe press belt for paper-making machine has a base member and at least a polymer elastic part constituting the shoe contact surface and that the shoe contact surface of the polymer elastic part has a surface roughness (Ra) of 1.0 to 3.5 μm.07-29-2010
20100186920SHOE PRESS BELT FOR PAPER MAKING - Disclosed is a shoe press belt (07-29-2010
20100314067SHOE PRESS BELT FOR PAPERMAKING - A belt for papermaking shoe press is provided which comprises a reinforcing fibrous base (12-16-2010
20110127000PROCESS BELT FOR PAPERMAKING AND METHOD FOR MAKING THE SAME - A process belt for papermaking with a long operational life comprises an integrated structure of a reinforcing fibrous base material 06-02-2011
20110203758PAPERMAKING PROCESS BELT AND METHOD FOR MAKING THE SAME - A process belt for papermaking with a long operational life comprises an integrated structure of a reinforcing fibrous base material 08-25-2011

Patent applications by Atsushi Ishino, Tokyo JP

Koji Ishino, Tokyo JP

Patent application numberDescriptionPublished
20090178908SWITCH STRUCTURE OF AUTOMATIC EXTERNAL DEFIBRILLATOR - A switch structure of an automatic external defibrillator including a housing member and a flap member for covering the housing member, open and closed states of the flap member and ON and OFF of a switch of the automatic external defibrillator which are associated with each other, the switch structure includes a movable unit for turning ON the switch when the flap member is in the open state and turning OFF the switch when the flap member is in the closed state and an operator performs further operation.07-16-2009
20110009936INTERNAL PADDLE ELECTRODE - An internal paddle electrode includes: an electrode which is to be in contact with a living body to apply a voltage; a cable which includes a voltage supply path that extends between a voltage supply source and the electrode; a handle which includes: a first portion that supports the electrode and is hermetically sealed with the electrode; and a second portion that is connected to the cable and is hermetically sealed with the cable; and a gas passage through which a gas in the handle communicates with external air that is outside the handle.01-13-2011

Patent applications by Koji Ishino, Tokyo JP

Masaaki Ishino, Tokyo JP

Patent application numberDescriptionPublished
20090013765GAS LEAK DETECTION APPARATUS AND METHOD - According to the present invention, mistaken detection of a gas leak can be prevented even when using an appliance which has been newly installed in a dwelling receiving a gas supply, and whereby a gas leak can be detected rapidly, efficiently and accurately. The characteristics extraction means 01-15-2009
20090018782GAS APPLIANCE JUDGMENT APPARATUS AND METHOD - According to the present invention, the type of gas appliance in use can be identified and a gas leak can be detected, efficiently and accurately. The flow volume data noise removal means 01-15-2009

Masakazu Ishino, Tokyo JP

Patent application numberDescriptionPublished
20090109641Wafer of circuit board and joining structure of wafer or circuit board - A wafer (or a circuit board), which is used to perform three-dimensional mounting, has protrusion 04-30-2009
20090134498SEMICONDUCTOR APPARATUS - The present invention includes a semiconductor element provided with an electrode passing through front and back sides. The electrode is formed as a cylinder including a hollow portion, and stress relaxing material is provided in the hollow portion, which is used to reduce stress that is induced between the semiconductor element and the electrode. The stress relaxing material is an elastic body made of resin material.05-28-2009
20090294990SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor memory device has a plurality of core chips and an interface chip, whose specification can be easily changed, while suppressing the degradation of its reliability. The device has an interposer chip. First internal electrodes connected to core chips are formed on the first surface of the interposer chip. Second internal electrodes connected to an interface chip and third internal electrodes connected to external electrodes are formed on the second surface of the interposer chip. The interface chip can be mounted on the second surface of the interposer chip whenever desired. Therefore, the memory device can have any specification desirable to a customer, only if an appropriate interface chip is mounted on the interposer chip, as is demanded by the customer. Thus, the core chips do not need to be stocked in great quantities in the form of bare chips.12-03-2009
20110104852SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor memory device has a plurality of core chips and an interface chip, whose specification can be easily changed, while suppressing the degradation of its reliability. The device has an interposer chip. First internal electrodes connected to core chips are formed on the first surface of the interposer chip. Second internal electrodes connected to an interface chip and third internal electrodes connected to external electrodes are formed on the second surface of the interposer chip. The interface chip can be mounted on the second surface of the interposer chip whenever desired. Therefore, the memory device can have any specification desirable to a customer, only if an appropriate interface chip is mounted on the interposer chip, as is demanded by the customer. Thus, the core chips do not need to be stocked in great quantities in the form of bare chips.05-05-2011

Patent applications by Masakazu Ishino, Tokyo JP

Tooru Ishino, Tokyo JP

Patent application numberDescriptionPublished
20110294440HIGH POWER AMPLIFIER, WIRELESS TRANSMITTER, WIRELESS TRANSCEIVER, AND METHOD FOR MOUNTING HIGH POWER AMPLIFIER - A high power amplifier that has a high heat dissipation effect and is produced at low cost, a wireless transmitter and a wireless transceiver with the high power amplifier and a method for mounting a high power amplifier are provided. The high power amplifier comprises a transistor with lead wires extending from both side surfaces of a mold provided on a heat dissipation member to the outside, a double-sided wiring board of which the heat dissipation member is inserted in an opening of the double-sided wiring board and a wiring pattern on one surface of the double-sided wiring board is electrically connected to the lead wires, and a case for accommodating the double-sided wiring board. Further, the high power amplifier comprises a plate of which one main surface is in contact with an inner wall of the case and the other main surface is connected to the heat dissipation member and a wiring pattern on the other main surface of the double-sided wiring board.12-01-2011

Yukinobu Ishino, Tokyo JP

Patent application numberDescriptionPublished
20090009608Digital image storage system that deletes images from digital camera memory after tramsmission and storage in external storage medium - A digital image storage system includes a digital camera having a memory storing digital images, a docking station on which the digital camera can be placed for transmitting one or more of the digital images from the memory of the digital camera, and a data storage separate from the docking station and having a storage medium that stores digital images transmitted from the memory of the digital camera through the docking station. A controller communicates with the data storage and the digital camera while the digital camera is placed on the docking station, and causes digital images stored in the memory of the digital camera to be deleted from the memory after being successfully transmitted from the memory and stored in the storage medium of the data storage. The controller does not delete from the memory digital images protected against deletion.01-08-2009
20090009625Image storage and camera system in which protected image data in camera can be forcibly deleted - An image storage includes a built-in memory having large capacity for storing plural image data taken by a digital camera. A digital circuit retrieves desired one of the image data from the built-in memory. A connector electrically connects with the digital camera for data transmission. A detector detects the connection of the digital camera to the connector. A controller causes the image storage to receive the image data transmitted from the digital camera through the connector to store that data in the built-in memory in response to detection of the connection by the detector. The controller can transmit a signal to the digital camera to delete the image data that has been transmitted to and stored in the built-in memory. The signal is effective to forcibly delete the image data from the digital camera even if the image data is protected against deletion according to a digital camera setting.01-08-2009

Patent applications by Yukinobu Ishino, Tokyo JP