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Ishimatsu, JP
Kenji Ishimatsu, Kanagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20100054709 | INFORMATION PROCESSING APPARATUS AND PROGRAM - An information processing apparatus is provided that includes a control unit to execute an operating system and selectively output a first video signal or both the first video signal and a first audio signal, an external input unit to which an external content signal containing a second video signal and a second audio signal transmitted from an external apparatus is input, and a reproduction state switch control unit to selectively switch a first reproduction state for reproducing the first video signal or both the first video signal and the first audio signal, and a second reproduction state for reproducing the second video signal and the second audio signal, wherein, if input of the external content signal to the external input unit is detected during a reproduction standby state, the reproduction state switch control unit switches the reproduction standby state with the second reproduction state. | 03-04-2010 |
Manabu Ishimatsu, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20120069685 | Semiconductor device having optical fuse and electrical fuse - A semiconductor device includes a plurality of first chips, a second chip that controls the first chips, and internal wiring that connects the first chips and the second chip. The first chips each include: an optical fuse; a first latch circuit that retains information on the optical fuse; a second latch circuit that retains information on an electrical fuse, the information being supplied from the second chip through the internal wiring; and a select circuit that selects the information retained in either one of the first and second latch circuits. A redundancy determination signal is generated from the information selected. The information on the electrical fuse is transferred from the second chip to the first chips through the internal wiring. | 03-22-2012 |
Shin Ishimatsu, Fuchu-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090021553 | WIPING METHOD FOR INKJET RECORDING HEAD - A discharge-port surface of a recording head having a plurality of discharge-port rows from which ink is discharged is wiped with processing liquid applied between the discharge-port surface and the wiper. The amount of processing liquid applied to the discharge-port surface or the wiper differs for each discharge-port row. Alternatively, at least two kinds of processing liquid are applied for the discharge-port rows. Alternatively, the processing liquid to be applied is selected from a plurality of kinds of processing liquid depending on the ambient temperature. | 01-22-2009 |
| 20090085964 | CAPPING UNIT AND INK JET RECORDING UNIT - A capping unit is detachably mountable to an ink jet recording head. The ink jet recording head has an ejection outlet surface provided with ejection outlets for ejecting ink. The capping unit includes: a liquid-absorbing member provided with a projection contactable to a periphery of an area, in which the ejection outlets are formed, on the ejection outlet surface so as to form a gap between the area and the liquid-absorbing chamber; and a capping member including an engaging portion and an elastic portion for contacting a rear surface opposite from a surface on which the projection of said liquid-absorbing member is formed to press said liquid-absorbing member against the ejection outlet surface. | 04-02-2009 |
Tadashi Ishimatsu, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090040345 | Color imaging device and color imaging device manufacturing method - A color imaging device includes a semiconductor substrate including a plurality of photoelectric transducers, and a color filter including a plurality of coloring layers provided to associate with the photoelectric transducers of the semiconductor substrate. Each of the coloring layers of the color filter including a side surface that is erected with respect to a surface of the semiconductor substrate, and an inclined surface that is continuous from an end of the side surface located in the opposite side of the semiconductor substrate toward an end portion of the coloring layer located in the opposite side of the semiconductor substrate. The coloring layers are arranged with their side surfaces being in contact with each other without a gap therebetween, and the end portion of the coloring layer has a curved surface shape protruding toward the opposite side of the corresponding photoelectric transducer. | 02-12-2009 |
| 20090206435 | Solid state imaging device, manufacturing method of the same, and substrate for solid state imaging device - A method of manufacturing a solid state imaging device having photoelectric conversion devices, the method including: 1) forming a plurality of color filters differing in color from each other, 2) forming a transparent resin layer on the color filters, 3) forming an etching control layer on the transparent resin layer, the etching control layer being enabled to be etched at a different etching rate from the etching rate of the transparent resin layer, 4) forming a lens master on the etching control layer by using a heatflowable resin material, 5) transferring a pattern of the lens master to the etching control layer by dry etching to form an intermediate micro lens, and 6) transferring a pattern of the intermediate micro lens to the transparent resin layer by dry etching to form the transfer lenses. | 08-20-2009 |
| 20100261303 | Manufacturing method for solid state image pickup device - A method of manufacturing a solid state image pickup device including photoelectric conversion elements which are two-dimensionally arranged in a semiconductor substrate, and a color filter having a plurality of color filter patterns differing in color from each other and disposed on a surface of the semiconductor substrate according to the photoelectric conversion elements. The method includes successively subjecting a plurality of filter layers differing in color from each other to a patterning process to form the plurality of color filter patterns. At least one color filter pattern to be formed at first among the plurality of color filter patterns is formed by dry etching, and the rest of the plurality of the color filter pattern is formed by photolithography. | 10-14-2010 |
Takakazu Ishimatsu, Nagasaki JP
| Patent application number | Description | Published |
|---|---|---|
| 20100224198 | AIRWAY-OPENING DEVICE - The present invention provides an airway securing device which more sufficiently secures the airway to enable resolution of snoring, prevention and treatment of sleep apnea syndrome, and other airway securing. The airway securing device of the present invention is provided with a wearable body | 09-09-2010 |
Takashi Ishimatsu, Himeji-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090101723 | Bill/coin processing system - A bill and coin processing system including a bill and coin processing apparatus having: an interface unit capable of exchanging information via a communication unit with the point-of-sales terminal machine; a money receiving unit receiving money by way of a price of a commercial product; a discriminating unit discriminating between at least denominations of the bills and coins received from the money receiving unit; a storing/discharging unit stored with the received bills and coins on the basis of a result of the discrimination made by the discriminating unit and capable of discharging the bills and coins by giving a discharge instruction to the bill and coin processing apparatus from the point-of-sales terminal machine; a money discharging unit discharging the bills and coins outside a machine, which have been discharged from the storing/discharging unit; and a control unit controlling the money discharging unit to discharge the bills and coins from the storing/discharging unit on the basis of a discharge instruction accepted by the interface unit and given to the bill and coin processing apparatus from the point-of-sales terminal machine. | 04-23-2009 |
| 20100230234 | DEFORMED-COIN DETECTOR - A deformed-coin detector accurately detecting a deformed coin without being affected by a variation in transporting speed of a coin. A coin transported along a coin transporting face comes into contact with detecting elements of coin-thickness detecting bodies, the detecting elements move by a distance corresponding to the dimension of the coin in its thickness direction and simultaneously, light shielding portions of the coin-thickness detecting bodies move. A light detecting portion detects a light shielding amount that varies due to movement of the light shielding portions. A coin denomination determining unit determines a denomination of the coin transported along the coin transporting face and reads a reference light-shielding amount pre-stored in a reference light shielding amount storing unit regarding the denomination. The light shielding amount detected by the light detecting portion is compared with the reference light shielding amount, and when the detected light shielding amount is out of a predetermined range with respect to the reference light shielding amount, the coin is judged to be a deformed coin. | 09-16-2010 |
Tomoyuki Ishimatsu, Tochigi JP
| Patent application number | Description | Published |
|---|---|---|
| 20100065303 | ANISOTROPIC CONDUCTIVE FILM, JOINED STRUCTURE AND METHOD FOR PRODUCING THE JOINED STRUCTURE - Provided is an anisotropic conductive film having enhanced adhesion strength to a circuit member and attaining high conduction reliability; a joined structure; and a method for producing the joined structure | 03-18-2010 |
| 20100080995 | METHOD FOR CONNECTING ELECTRONIC PART AND JOINED STRUCTURE - A method for connecting an electronic part, which contains: mixing a dispersing solvent, an adhesive resin which is dissolved in the dispersing solvent, conductive particles, and insulating particles which have smaller particle diameters than those of the conductive particles so as to prepare an anisotropic conductive adhesive; placing a terminal of a substrate and a terminal of an electronic part so as to face each other via the anisotropic conductive adhesive, and applying heat and pressure to the substrate and the electronic part so as to sandwich the conductive particles between the terminal of the substrate and the terminal of the electronic part to thereby deform the conductive particles, in which the pressure is smaller than pressure at which the conductive particles are destroyed, and smaller than pressure at which the particle diameters of the conductive particles become equal to the particle diameters of the insulating particles. | 04-01-2010 |
| 20100096175 | ADHESIVE FILM, CONNECTING METHOD, AND JOINED STRUCTURE - An adhesive film, containing a first adhesive layer in which conductive particles are dispersed, and a second adhesive layer adhered to the first adhesive layer, wherein the lowest viscosity of the first adhesive layer attained at or below the curing temperature is higher than that of the second adhesive layer attained at or below the curing temperature, where the curing temperature is a temperature at which the adhesive layer starts to cure, wherein the first and second adhesive layers are respectively disposed to a substrate side and an electronic part side, and the adhesive film is configured to join the electronic part and the substrate by heating and pressurizing the substrate and the electronic part with the adhesive layer being therebetween, and wherein the first adhesive layer has a thickness which is less than two times of an average particle diameter of the conductive particles. | 04-22-2010 |
| 20100116533 | ADHESIVE FILM, CONNECTING METHOD, AND JOINED STRUCTURE - An adhesive film including a first adhesive layer containing a first main resin component and dispersed conductive particles, and a second adhesive layer containing a second main resin component and adhering to the first adhesive layer, each of the adhesive layers containing a secondary resin component, wherein the first main resin component has a glass transition temperature higher than that of the secondary resin component, and the second main resin component has a glass transition temperature higher than that of the secondary resin component and lower than that of the first main resin component, and a reaction peak temperature of each of the adhesive layers is lower than the glass transition temperature of the first main resin component and higher than the glass transition temperature of the second main resin component, and is a temperature at which a calorific value of the adhesive layer is maximum during temperature rise. | 05-13-2010 |
| 20110088935 | CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE FILM, JOINED STRUCTURE, AND JOINING METHOD - The present invention aims to provide conductive particles which can reduce the stress while maintaining high hardness (hardly causing cracks even in a state of being crushed in connection process) by improving rolling properties and can ensure adequate conductive reliability not only with respect to ITO substrates, but also with respect to IZO substrates, an anisotropic conductive film provided with the conductive particles, a joined structure provided with the anisotropic conductive film, and a joining method using the anisotropic conductive film. The conductive particles of the present invention include polymer fine particles, and a conductive layer formed on surfaces of the polymer fine particles, wherein an outermost surface shell of the conductive layer is a nickel-palladium alloy layer. | 04-21-2011 |
| 20110120767 | ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND METHOD FOR MANUFACTURING CONNECTION ASSEMBLY USING THE SAME - An anisotropic conductive film that may give rise to high connection reliability, and a method for manufacturing a connection assembly with the use of the anisotropic conductive film, are disclosed. An anisotropic conductive film ( | 05-26-2011 |
| 20110223430 | CONNECTING FILM, AND JOINED STRUCTURE AND METHOD FOR PRODUCING THE SAME - To provide a connecting film including an organic resin layer which contains a color-erasing pigment, a curable organic resin, a curing agent and a conductive particle. | 09-15-2011 |
| 20120055703 | Joined Structure and Method for Producing the Same - A method for producing a joined structure, containing: after placing an anisotropic conductive film in the predetermined manner, placing a wiring member containing a wiring plate formed thereon, where the wiring plate has a resist region in which the wiring plate is covered with a resist layer, and a second electrode region in which the wiring plate is not covered with the resist layer, so that the edge of the resist region at a boundary with the second electrode region comes above the chamfer part of the substrate; and heating and compressing the anisotropic conductive film from the side of the wiring member to melt and make the anisotropic conductive film flow into the side of the resist region to thereby cover the second electrode region with the anisotropic conductive film, so as to electrically connect the first electrode region and the second electrode region. | 03-08-2012 |
Tomoyuki Ishimatsu, Kanuma-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20100285305 | CONNECTING FILM, AND JOINED STRUCTURE AND METHOD FOR PRODUCING THE SAME - A connecting film which electrically connects a first circuit member with a second circuit member having a nitrogen atom-containing film on a surface thereof facing the first circuit member, the connecting film including a first layer which is to be located at the first circuit member side, and a second layer which is to be located at the second circuit member side, wherein the first layer contains a cationic curing agent and an epoxy resin, and the second layer contains a radical curing agent, an acrylic resin and an epoxy compound, wherein one of the first layer and the second layer is a conductive particle-containing organic resin layer, and the other layer is an insulating organic resin layer containing no conductive particles, and wherein the minimum melt viscosity of the conductive particle-containing organic resin layer is ten times or more greater than that of the insulating organic resin layer. | 11-11-2010 |
Yosuke Ishimatsu, Hitachi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090027867 | High-speed signal transmission apparatus - A high-speed signal transmission apparatus comprises: a housing; a plurality of daughter boards juxtaposed to one another in the housing; board-side connectors each provided on corresponding each of the juxtaposed daughter boards; and cable-side connectors fixed in the housing; wherein each of the board-side connectors is insertable/removable into/from corresponding each of the cable-side connectors, and wherein a cable group whose impedance matching can be achieved makes connection between the predetermined cable-side connectors. | 01-29-2009 |
| 20110083877 | DIFFERENTIAL SIGNALING CABLE, TRANSMISSION CABLE ASSEMBLY USING SAME, AND PRODUCTION METHOD FOR DIFFERENTIAL SIGNALING CABLE - A differential signaling cable according to the present invention comprises: a pair of signal conductors provided in parallel; an insulator which covers the periphery of the pair of signal conductors in a batch; and a shield conductor provided on the outer periphery of the insulator, in which an interval between the pair of signal conductors is specified so that even-mode impedance becomes 1.5 to 1.9 times odd-mode impedance. | 04-14-2011 |
Yumiko Ishimatsu, Kanagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20100311163 | CELL TRANSFORMED BY HUMAN WNT3A GENE - Disclosed is a cell transformed by a vector containing human Wnt3a gene, wherein the cell is selected from a group consisting of hair follicle-derived cells and prostate cancer-derived cells. | 12-09-2010 |
Yumiko Ishimatsu, Yokohama-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20110112019 | METHOD FOR PROMOTING HAIR GROWTH OR HAIR REGENERATION BY MAINTAINING OR INCREASING EXPRESSION OF CELL-ADHESION FACTOR - An object of the present invention is to promote hair growth or hair regeneration by promoting formation and/or regeneration of hair follicles. A method is provided for promoting formation and/or regeneration of hair follicles, comprising maintaining or increasing expression of one or a plurality of genes involved in cell adhesion in dermal papilla cells. | 05-12-2011 |