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Ishikawa, Kawasaki

George Ishikawa, Kawasaki JP

Patent application numberDescriptionPublished
20080266648SIGNAL LIGHT MONITORING APPARATUS, OPTICAL AMPLIFICATION APPARATUS AND OPTICAL RECEPTION APPARATUS, AND SIGNAL LIGHT MONITORING METHOD - According to an aspect of an embodiment, an apparatus includes an optical branching unit for branching an input signal light in four directions, a polarization component extraction unit extracting four polarization components having mutually different polarization parameters from lights branched in four directions by the optical branching unit, and a determination unit determining input/non-input of the signal light based on the four polarization components extracted by the polarization component extraction unit.10-30-2008
20090080894Chromatic dispersion compensating apparatus - In order to compensate for chromatic dispersion ad dispersion slope over an entire wavelength band of the optical signal, the wavelength band is split into a plurality of bands, and chromatic dispersion compensation is made to make chromatic dispersion in a central wavelength of each of the bands zero.03-26-2009
20090238571OPTICAL TRANSMISSION SYSTEM AND METHOD FOR CHROMATIC DISPERSION COMPENSATION - An optical transmission system including an optical transmission path for transmitting WDM signals multiplexed different wavelength optical signals, the WDM signals including different bit rate optical signals or different modulation format optical signals; a repeater arranged in the optical transmission path, the repeater including a chromatic dispersion compensation unit for compensating chromatic dispersion compensation for the WDM signals; and a network management system including processes of determining a dispersion compensation ratio indicating the ratio with respect to the dispersion compensation amount at which the residual dispersion of the WDM signals are zero after transmission via the optical transmission path, on the bases of the mixture ratio of different optical signals included in the WDM signals, and variably setting the dispersion compensation amount for the in-line repeater according to the dispersion compensation ratio.09-24-2009
20090274469Polarization multiplexed optical transmitting and receiving apparatus - In a polarization multiplexed optical transmitting and receiving apparatus, output light from a light source section of a transmission unit is separated in a polarization separating section, and then modulated in first and second modulation sections, and the modulated lights are synthesized in a polarization synthesizing section, and transmitted to an optical transmission line. Then the polarization multiplexed light propagated through the optical transmission line is demodulated in a reception section of a reception unit, and together with this, transmission characteristic information of the reception light is transferred to the transmission unit. The transmission unit that receives the transmission characteristics information controls a delay section that adjusts a delay amount of relative phases of drive signals of the modulation sections, so that the transmission characteristics of the polarization multiplexed light are within an allowable range. As a result, pulse timing between orthogonal polarization components of the polarization multiplexed light can be flexibly changed with a simple configuration.11-05-2009
20100135664Chromatic dispersion compensating apparatus - In order to compensate for chromatic dispersion ad dispersion slope over an entire wavelength band of the optical signal, the wavelength band is split into a plurality of bands, and chromatic dispersion compensation is made to make chromatic dispersion in a central wavelength of each of the bands zero.06-03-2010
20100221013OPTICAL TRANSMISSION APPARATUS, WAVELENGTH DIVISION MULTIPLEXING OPTICAL COMMUNICATION SYSTEM AND OPTICAL TRANSMISSION METHOD - An optical transmission apparatus for suppressing deterioration of transmission quality due to XPM in a wavelength division multiplexing optical communication system in which an intensity modulation optical signal and a phase modulation optical signal exist in a mixed form. The apparatus has an intensity inversion signal light output section which outputs light having an intensity pattern obtained by inverting intensity changes of the intensity modulation optical signal near a wavelength of the intensity modulation optical signal in arrangement on wavelength axis of optical wavelengths that can be multiplexed as a wavelength division multiplexed signal as intensity inversion signal light, and a wavelength division multiplexed optical signal output unit which wavelength-division-multiplexes the intensity modulation optical signal, the phase modulation optical signal and light from the intensity inversion signal light output section and outputs a wavelength division multiplexed optical signal.09-02-2010
20100266293RELAY APPARATUS, SIGNAL PROCESSING APPARATUS AND OPTICAL COMMUNICATION SYSTEM - A relay apparatus including: a first interface 10-21-2010
20110116803TERMINAL APPARATUS, DATA TRANSMISSION SYSTEM AND DATA TRANSMISSION METHOD - There is provided a terminal apparatus including a message monitor to gather transmission request information from each of first and second terminating apparatus, a dynamic bandwidth allocation unit to allocate each transmission band in accordance with the gathered transmission request information, determine a size and an alignment position of a time slot in accordance with the allocated transmission band, determine a transmission start time of the time slot, and allocate an extinction period so as to stop a transmission of an optical signal between a time slot of the optical signal with the second transmission rate and a time slot following the time slot of the optical signal with the second transmission rate, and a MAC controller to generate a control frame for notifying each of the first and second terminating apparatus of the transmission start time and the size of the time slot.05-19-2011
20110176816OPTICAL TRANSMISSION APPARATUS - An optical transmission apparatus according to the present invention comprises: a plurality of optical modulating sections serially connected to each other via optical fibers; driving sections corresponding to the optical modulating sections; delay amount varying sections that provide variable delay amounts for modulating signals to be input to the driving sections, to adjust timing between drive signals to be provided for the optical modulating sections; temperature monitoring sections that monitor the temperature of each of the optical fibers and the like; and a delay amount control section that controls the delay amount in each of the delay amount varying sections based on the monitored temperatures.07-21-2011

Patent applications by George Ishikawa, Kawasaki JP

Kuniko Ishikawa, Kawasaki JP

Patent application numberDescriptionPublished
20080203138Method of mounting an electronic component and mounting apparatus - In a method of mounting an electronic component on a substrate, electrode terminals on at least one of the substrate and the electronic component are composed of solder bumps. The electrode terminals of the substrate and the electrode terminals of the electronic component are placed in contact and ultrasonic vibration is applied to at least one of the substrate and the electronic component to provisionally bond the electrode terminals together. A gap between the substrate and the electronic component is then filled with flux fill, and the electrode terminals of the substrate and the electronic component are bonded by reflowing the solder bumps.08-28-2008
20080206587METHOD OF MANUFACTURING AN ELECTRONIC COMPONENT AND AN ELECTRONIC DEVICE - An electronic component is equipped with electrode protrusions that make it possible to mount the electronic component without covering connection pads of a circuit board with solder and to dispose the connection pads of the circuit board with a narrow pitch while preventing electrical shorting of the connection electrodes during mounting. A method of manufacturing an electronic component equipped with connection electrodes, where electrode protrusions are covered with solder, includes a step of heating a solder sheet to a semi-molten state and pressing the electronic component onto the solder sheet to place the electrode protrusions in contact with the solder sheet and a step of retracting the electronic component from a position where the electrode protrusions contact the solder sheet to transfer solder onto outside surfaces of the electrode protrusions that contacted the solder sheet.08-28-2008
20100075493METHOD OF FORMING ELECTRODE CONNECTING PORTION - A manufacturing method for an electrode connecting portion includes covering an electrode forming surface with a solder sheet, rolling a heating roller on the solder sheet that covers the electrode forming surface, and removing the solder sheet after the heating roller has passed over the solder sheet.03-25-2010
20100327435ELECTRONIC COMPONENT AND MANUFACTURE METHOD THEREOF - An electronic component includes a package substrate, a plurality of conductive pads, an insulating material and a semiconductor device. The plurality of conductive pads is disposed on the package substrate. The insulating material is disposed between the plurality of conductive pads. The insulating material includes a top surface located on an identical plane to an upper surface of the plurality of conductive pads. The semiconductor device includes a conductive bump aligned on a corresponding conductive pad of the plurality of conductive pads.12-30-2010
20110079896SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD - A semiconductor device fabrication method, comprising the steps of: forming a solder portion on an electrode of a substrate on which a semiconductor chip is to be mounted; applying a resin layer onto the substrate to a thickness such that a top region of the solder portion is exposed; curing the resin layer; providing a thermosetting underfill material over a region where the semiconductor chip is to be mounted; placing an electrode of the semiconductor chip face down on the solder portion in such a manner that the electrode faces the solder portion; and heating the underfill material and the solder portion.04-07-2011

Patent applications by Kuniko Ishikawa, Kawasaki JP

Seiji Ishikawa, Kawasaki JP

Patent application numberDescriptionPublished
20080241486Liquid Crystal Display Device with Evaluation Patterns Disposed Thereon, and Method for Manufacturing the Same - Direct exposure equipment having a multiple heads generally conducts overlapping exposure at an exposure area boundary between the heads. In such a case, if the heads are misaligned, a flaw will occur in a pattern shape at an area that is subject to overlapping exposure. To overcome this, TEGs are disposed for evaluating line width and resistance at an overlapping exposure area between the exposure heads and at a returning exposure area formed when direct exposure equipment having a multi-head configuration exposes a substrate. By examining measured values from these TEGs, a misalignment in the multiple exposure heads is detected.10-02-2008
20090262319MASKLESS EXPOSURE METHOD - A maskless exposure method of drawing a circuit pattern includes: moving a substrate with respect to a projection optical system; scanning, by the projection optical system, the substrate in a first direction; shifting a scanning region in a second direction; scanning the substrate in the first direction so that an overlapping part is formed. A plurality of marks different from the circuit pattern are exposed in a vicinity of the overlapping part. The plurality of marks are a set of marks at least including two marks disposed on one side of the overlapping part and two marks disposed on another side of the overlapping part. Deviations between the pair of the scanning regions, an inclination of exposing light, and a yawing angle of a stage are analyzed by measuring deviations of distances among the plurality of marks. Calibration data are obtained from a result of the analyzing.10-22-2009

Shohei Ishikawa, Kawasaki JP

Patent application numberDescriptionPublished
20100164620PREDISTORTION APPARATUS AND PREDISTORTION METHOD - A predistortion apparatus for compensating for a distortion arising from a non linear property in input to output characteristics of an amplifier, by processing calculation of a plurality of coefficients for a plurality of power series defining the predistortion characteristics for a plurality of power ranges, respectively, the predistortion apparatus includes: a coefficient update unit for setting and updating coefficients of the power series to provide the predistortion characteristics for the plurality of power ranges in accordance with a comparison between the input and output of the amplifier; and a determination unit for determining at least one threshold value defining the plurality of power ranges by shifting the threshold value and operating the coefficient update unit for updating the coefficients for each of the power series corresponding to each of the power ranges defined by the shifted threshold value.07-01-2010
20100194474Predistorter and Distortion Compensation Method - A predistorter includes a distortion compensating unit which gives, in advance, a reverse characteristic of a characteristic of input to output of a power amplifier to a transmission signal which is to be input to the power amplifier; a distortion compensation signal generating unit which generates a distortion compensation signal indicating the reverse characteristic based on transmission data that is sample data of the transmission signal and the delayed transmission data; and a delay amount control unit which controls a delay amount of the transmission data according to an output signal of the power amplifier.08-05-2010
20100219889DISTORTION COMPENSATION APPARATUS AND METHOD - A distortion compensation apparatus includes a distortion compensation signal generation unit that performs, on a transmission signal, distortion compensation processing using a series operation; a coefficient updating unit that updates series operation coefficients used for the series operation based on a feedback signal of a power amplification output which is output through power amplification processing of a distortion compensation signal output from the distortion compensation signal generation unit, and based on the distortion compensation signal; a memory that stores the distortion compensation signal corresponding to a transmission signal having a given power value and the feedback signal of the power amplification output as restraint information; and a control unit that performs control so that, in accordance with the power value of the transmission signal, restraint information corresponding to a power value different from the power value of the transmission signal is read and used for updating the series operation coefficients.09-02-2010
20100237937POWER AMPLIFYING DEVICE AND POWER AMPLIFYING METHOD - A power amplifying device includes an amplifier that amplifies a signal which is input in accordance with a voltage signal which is supplied to the amplifier, a voltage control section that controls the voltage signal in accordance with a transmission signal, a distortion compensating section that executes a distortion compensating process on the transmission signal by giving a value indicative of a reverse characteristic of the amplifier to the transmission signal in advance and inputs an output signal obtained by executing the distortion compensating process into the amplifier, an amplitude detecting section that detects an amplitude of the transmission signal, and a timing adjusting section that adjusts timings of the output signal and the voltage signal so that a value relating to the distortion compensating process meets a given condition when a detected value of the amplitude of the transmission signal is less than a given value.09-23-2010
20120019427ANTENNA DEVICE AND COMMUNICATION DEVICE - An antenna device includes a helical antenna that radiates a circularly polarized radio wave in a direction of an axis S, in which the helical antenna is formed with linear conducting bodies each helically winding around the predetermined axis and adjacent linear conducting bodies are spaced a distance P apart. The antenna device further includes a director that is on the axis S, along which a radio wave is radiated from the helical antenna, at a position a distance X away from the helical antenna, the distance X being substantially equal to the distance P.01-26-2012

Taichi Ishikawa, Kawasaki JP

Patent application numberDescriptionPublished
20100129075TRANSMISSION SYSTEM, TRANSMISSION APPARATUS, AND CONTROL METHOD OF TRANSMISSION SYSTEM - A transmission system includes: a sending apparatus; a receiving apparatus; and an intermediate apparatus, the sending apparatus, the receiving apparatus and the intermediate apparatus being connected in a ring shape via a first transmission line used to transmit a first channel signal and a second channel signal in one direction and a second transmission line used to transmit the first channel signal and the second channel signal in another direction opposite to the one direction, the receiving apparatus including a first phase adjustment unit that adjusts a phase difference between the first channel signal of the first transmission line and the first channel signal of the second transmission line, and the intermediate apparatus including a second phase adjustment unit that adjusts a phase difference between the second channel signal of the first transmission line and the second channel signal of the second transmission line.05-27-2010

Takao Ishikawa, Kawasaki JP

Patent application numberDescriptionPublished
20120088335MANUFACTURING METHOD OF THE ELECTRONIC COMPONENT - Manufacturing method of an electronic component including connecting one lead of a pair of leads to a surface parallel with a pn connection layer of an electronic element having a structure where the p-type layer and the n-type layer are connected by the pn connection layer provided between the p-type layer and the n-type layer, connecting another lead to another surface parallel with the pn connection layer; and forming a supporting part of the pair of the leads that is connected to and supporting the electronic element, and an electrode part functioning as an electrode, by bending the pair of the leads to an outside.04-12-2012

Takehisa Ishikawa, Kawasaki JP

Patent application numberDescriptionPublished
20090233658MOBILE TERMINAL DEVICE - A mobile terminal device including a first housing, a second housing and a hinge foldably connecting the first housing and the second housing is provided. The mobile terminal device includes a hinge including a hinge mechanism which rotatably connects the first housing and the second housing. The device includes a flexible joint which liquid-tightly connects the first housing and the second housing and liquid-tightly contains the hinge mechanism.09-17-2009
20100248795INFORMATION PROCESSING TERMINAL - An information processing terminal includes a first housing, and a second housing which is movably connected to the first housing via a connection mechanism, wherein the connection mechanism includes a guide pin which is protrusively formed on a side of the first housing, and wherein the first housing includes a guide groove which controls a moving direction of the first housing and the second housing by being engaged with the guide pin, and a dust-proof sheet which seals the guide groove.09-30-2010
20100248798INFORMATION PROCESSING TERMINAL - An information processing terminal includes a first housing, a second housing that has a projecting unit which projects toward a side of the first housing, and a connection mechanism which movably connects the first housing to the second housing, wherein the connection mechanism includes a slide leg unit which slidably connects the first housing by being engaged with a slide rail included in the first housing, and a guide pin which controls a moving direction of the first housing by being engaged with a guide groove provided in the first housing, and wherein the first housing abuts on the slide leg unit, the guide pin, and the projecting unit when the first housing and the second housing are in a closed state.09-30-2010
20110051455ILLUMINATION PANEL - An illumination panel includes: a light-collecting section for collecting light emitted from a light source; an optical guide for optically guiding the light collected by the light-collecting section in a direction away from the light source; and a radiation section for radiating the light optically guided by the optical guide; wherein the optical guide has a plurality of grooves for reflecting the light optically guided by the optical guide to the radiation section.03-03-2011
20110210902MOBILE COMMUNICATION DEVICE AND METHOD FOR ASSEMBLING THE MOBILE COMMUNICATION DEVICE - A mobile terminal device includes a circuit board accommodated in a casing and an antenna disposed on the outside of the casing electrically connected to each other via a opening formed in the casing, a first conductive member fixed to an inner surface of the casing while being connected to the circuit board, a second conductive member detachably attached to an outer surface of the casing while being connected to the antenna, and a conductive fastening member fitted into the opening from outside the casing and fastening the first conductive member and the second conductive member together.09-01-2011
20110211324MOBILE TERMINAL DEVICE - A mobile terminal device includes a display unit having a first engaging latch, a case having a slide groove that allows the first engaging latch to slide therein and a second engaging latch that engages the first engaging latch that slides in the slide groove, and a component located in a gap that appears between the case and the display unit as a result of sliding the first engaging latch in the slide groove.09-01-2011
20110212755MOBILE TERMINAL DEVICE - A mobile terminal device includes a housing formed with an opening, a base plate provided inside the housing and having an audio component attached thereon, a cushion part provided around the opening of an inside wall surface of the housing, a frame part that includes a face near a surface of the audio component and forms an audio path between the audio component and the opening, one end portion near the face of the frame part being attached to the base plate, and another end portion abutting the inside wall surface of the housing via the cushion part.09-01-2011

Patent applications by Takehisa Ishikawa, Kawasaki JP

Tetsuji Ishikawa, Kawasaki JP

Patent application numberDescriptionPublished
20080225500Printed circuit board unit and printed wiring board - An electronic component has a pair of electrically-conductive terminals. Electrically-conductive pads are opposed to each other on the surface of a substrate at the inner edges defined along parallel first reference lines. Solder is placed on the electrically-conductive pads for bonding the electrically-conductive terminals to the electrically-conductive pads, respectively. The electrically-conductive pad includes protruding sections formed continuous with a main section having the side edges along parallel second reference lines intersecting with the first reference lines. The protruding sections protrude outside the second reference lines along corresponding one of the first reference line. The surface tensions of the melted solder on the main section and the protruding sections are balanced with each other. The electronic component is thus prevented from standing up. The electronic component is prevented from suffering from tombstone phenomenon.09-18-2008
20090020588Method for manufacturing product involving solder joining, solder joining apparatus, soldering condition verification method, reflow apparatus, and solder joining method - A method for manufacturing a product involving solder joining wherein components placed on a board on which the components are to be mounted are solder-joined to the board by subjecting the board to reflow heating under prescribed heating conditions, the method comprising: calculating, at each designated site on the board, a component volume that is occupied by the components mounted within a given area; determining the heating conditions in accordance with the calculated component volume; and performing the reflow heating based on the determined heating conditions.01-22-2009
20090084831SOLDERING METHOD AND APPARATUS FOR MOUNTING DEVICES ON PRINTED CIRCUIT BOARD - In a case of soldering for mounting a device on a printed circuit board, a printed circuit board to which a device is soldered is heated in a high oxygen concentration atmosphere to form oxide films on surfaces of joints, by which detachment of a device soldered onto the surface of the printed circuit board, positional deviation, and rise from the printed circuit board at the time of reflow of the printed circuit board are prevented.04-02-2009
20090289100Method and apparatus for rework soldering - A method is disclosed for performing rework soldering for removing an electronic component from a printed circuit board and re-soldering the electronic component to the printed circuit board. The method includes the steps of positioning a dual structure body including a heating member and a cooling member between a rework target and a non-rework target placed on the printed circuit board, the heating member and the cooling member being arranged facing each other with a slight space provided therebetween, the heating member being situated toward the rework target, the cooling member being situated toward the non-rework target; heating the heating member; and cooling the cooling member.11-26-2009
20100170939JOINING METHOD AND REFLOW APPARATUS - A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten state.07-08-2010
20110192536JOINING METHOD AND REFLOW APPARATUS - A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten state.08-11-2011

Patent applications by Tetsuji Ishikawa, Kawasaki JP

Tomohisa Ishikawa, Kawasaki JP

Patent application numberDescriptionPublished
20080265132LIGHT SOURCE ERROR DETECTION APPARATUS AND METHOD - A light source error detection system and method including monitoring a plurality of characteristics of a light source and controlling the light source based on a plurality of monitored results. The system and method control the light source differently for a first case when only one of the monitored characteristics is abnormal than a second case when more than two of the monitored characteristics are abnormal. In controlling the light source, an output power of the light source is decreased with different time constant for the first case and the second case.10-30-2008
20110052207Wavelength control method and optical transmission device - An optical transmission device in which: a first cyclic filter with a fixed transmission wavelength characteristic and a second cyclic filter with a variable transmission wavelength characteristic are combined, and the transmission wavelength characteristic of the second cyclic filter is changed according to a target wavelength, to thereby control the relative phase relationship of the transmission wavelength characteristics of the first and second cyclic filters. Moreover a light source is controlled according to a monitored value of the transmittance of the second cyclic filter with respect to the control target light, to thereby match the wavelength of the control target light with the target wavelength. Consequently, it is possible, with a simple configuration using a combination of two cyclic filters, to variably control wavelength at arbitrary wavelength intervals at a high level of precision.03-03-2011

Yoichiro Ishikawa, Kawasaki JP

Patent application numberDescriptionPublished
20080250366NOISE CHECKING METHOD AND APPARATUS, AND COMPUTER-READABLE RECORDING MEDIUM IN WHICH NOISE CHECKING PROGRAM IS STORED - There is provided a technique in which internal wires of a large cell are spuriously patterned and treated as object of a noise check. Internal wires of a large cell are spuriously determined based on terminal information and wiring forbidden information of the large cell and are added to chip wires to be checked, from which an object wire to be checked and at least one affecting wire are selected, a noise value representing a degree at which the at least one affecting wire induces noise onto the signal of the object wire is calculated and the noise check is performed on the basis of the calculated noise check.10-09-2008
20100333054CIRCUIT DESIGN ASSISTING APPARATUS - A circuit design assisting apparatus for assisting a circuit design of a semiconductor by using a noise check result corresponding to a plurality of wiring arrangements, the circuit design assisting apparatus includes a database unit that stores the wiring arrangement data, a wire specifying unit that specifies a first wire from the wiring arrangement data, a wire extracting unit that extracts a plurality of second wires respectively including a wire portion influencing noise to the specified first wire from the wiring arrangement data, and a display controlling unit that generates display information to display the specified first wire and the extracted second wire.12-30-2010

Patent applications by Yoichiro Ishikawa, Kawasaki JP