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Ise, Tokyo
Fumiaki Ise, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20110242324 | IMAGE DISPLAY DEVICE, IMAGE DISPLAY METHOD, IMAGE DISPLAY PROGRAM, AND RECORDING MEDIUM - An image display apparatus includes an acquiring unit that acquires traffic information concerning a specified region; a displaying unit that displays a photographic image of the specified region; and a display controlling unit that, when a congestion state depicted in a road part of the photographic image of the specified region and a congestion state indicated by the traffic information acquired by the acquiring unit differ, processes the road part into an image depicting an actual congestion state according to the traffic information and causes the image to be displayed on the display unit. | 10-06-2011 |
Genjiro Ise, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20100158420 | METHOD OF MANUFACTURING MOTION GUIDE DEVICE AND MOTION GUIDE DEVICE MANUFACTURED BY THE METHOD - There is performed a treatment including a grinding working step of grinding at least a portion of a rolling surface and a sliding surface of a motion guide device using a rolling member by a grinding working using a grinding stone, and a surface treating step of effecting a peening treatment to a friction surface formed by the grinding working to render a defect on the friction surface caused by the grinding working harmless. By manufacturing a motion guide device through such treating steps, a defect such as flaw generated on the friction surface is made harmless, the fatigue strength, sliding performance and lifetime of the device can be improved. Even in a travelling distance test, a travelling distance largely over a calculated lifetime could be achieved. | 06-24-2010 |
| 20100314006 | STEEL FOR INDUCTION HARDENING WITH EXCELLENT COLD WORKABILITY, ROLLING MEMBER MADE OF THE SAME, AND MOTION GUIDE DEVICE USING ROLLING MEMBER - This steel for induction hardening contains, by percent by mass, C: 0.7 to 0.9%, Si: 0.4 to 1.0%, Mn: 0.5 to 1.25%, P: 0.030% or less, S: 0.030% or less, Cr: 0.4% or less, Al: 0.05% or less, Ti: 0.003% or less, and O: 0.0020% or less, wherein [Mn]≦0.5+0.35/[Si] is met, the steel further contains Fe and unavoidable impurity and the steel has annealing hardness of 93 HRB or less, and wherein an induction hardening layer after induction hardening has residual austenite of 20 to 40% and hardness of 61 HRC or more. This makes it possible to provide steel for induction hardening in which lowering of a fatigue life hardly occurs even though foreign objects incorporates into lubricating oil of a motion guide device and concentration of stress on its dent causes flaking due to lubrication failure to be generated on a steel surface of a device, or even though rolling/sliding contact occurs. | 12-16-2010 |
Hirotoshi Ise, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20110266140 | PROCESS FOR PRODUCING REFLECTIVE MASK BLANK FOR EUV LITHOGRAPHY - Provision of a process for producing an EUV mask blank wherein formation of scars of a glass substrate surface or a chuck surface due to sandwiching of foreign objects such as particles between an electrostatic chuck and the glass substrate, is suppressed. | 11-03-2011 |
Kotaro Ise, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20100125749 | COMPUTER PROGRAM PRODUCT, FAILURE DIAGNOSIS METHOD, AND COMMUNICATION APPARATUS - A first confirmation unit performs a first confirmation of confirming presence of a connection to a correspondent node in a first communication layer, presence of a connection to a correspondent node in a second communication layer, and presence of a connection to a correspondent node in a third communication layer. A locating unit locates a failure point in communication based on a result of the first confirmation. An output unit outputs a result of the location. | 05-20-2010 |
Makoto Ise, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20100261312 | MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - While an adhesive layer is provided over the rear surface of a semiconductor chip in die bonding, a lamination processing (main pressure bonding) is necessary for securing the adhesive state of the adhesive layer after the die bonding process (temporary pressure bonding). In this case, typically the hardening of the adhesive is developed by applying heat while pressing down the rear surface of the chip from above with a pressurization member. It has become clear that various problems exist in the lamination processing of the laminate chips by such a mechanical pressurization method as the chip becomes thinner. That is, the problems include chip damage at a part in an overhang state, a chip position shift caused by bending and non-uniform pressurization, and the like. | 10-14-2010 |
Masayuki Ise, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20100327056 | PAYMENT APPROVAL SYSTEM AND METHOD FOR APPROVING PAYMENT FOR CREDIT CARD - A payment approval system and a method for approving a payment for credit cards are provided for providing efficient processing while maintaining accuracy in detection of fraud usage of credit cards with an IC chip. Fraud parameters obtained by modeling a pattern of fraud usage is stored in the IC chip equipped in the IC credit card to use for payment approval to achieve improved reliability of offline approval. When offline approval process finds a possibility of fraud usage, online approval for more detailed statistical analysis processing is requested to a host computer. When update information of the fraud parameter used for the judgment is transmitted together with the request for approval and the newest fraud parameter created by analyzing the newest transaction trend etc. is confirmed to have been updated at the host computer, the newest fraud parameter along with the approval result from the host computer is transmitted to the IC terminal to update the fraud parameter in the IC chip to the up-to-date state. | 12-30-2010 |
Ryota Ise, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090048116 | GENE EXPRESSING ANALYSIS TOOL - The present invention provides a tool for analysis of expression of | 02-19-2009 |
Sadatake Ise, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20080251742 | Pressure Control Valve - There is disclosed a pressure control valve comprising: a valve body ( | 10-16-2008 |
Shinsuke Ise, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090008467 | Vehicular air conditioner - When there arises a need to change an air conditioner capability, a vehicular air conditioner capable of easily meeting this need is achieved. Also, even if some of a plurality of air conditioner units break down, a vehicular air conditioner capable of properly air conditioning a vehicular space using other air conditioner units, is achieved. | 01-08-2009 |
Tomokazu Ise, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090239433 | POLYLACTIC ACID COMPOSITION - A polylactic acid composition comprising (A) a polylactic acid-series resin and (B) an acrylic triblock copolymer is prepared. The composition fulfills the following requirements: (1) the acrylic triblock copolymer (B) is a triblock polymer comprising (B1) a polymer block having a glass-transition temperature of not higher than 25° C., (B2a) a polymer block which has a glass-transition temperature of not lower than 60° C. and is bound to a terminal of the polymer block (B1), and (B2b) a polymer block which has a glass-transition temperature of not lower than 60° C. and is bound to another terminal thereof; (2) the polymer block (B1) comprises a main structural unit derived from an acrylate, and the polymer block (B2a) and the polymer block (B2b) independently comprise a main structural unit derived from a methacrylate; and (3) both of the weight-average molecular weights of the polymer block (B2a) and polymer block (B2b) are smaller than the weight-average molecular weight of the polymer block (B1). The polylactic acid-series resin (A) and the acrylic triblock copolymer (B) may form a phase separation structure. | 09-24-2009 |
