Patent application number | Description | Published |
20120195171 | METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATING REED, PIEZOELECTRIC VIBRATING REED, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - In a method of manufacturing a piezoelectric vibrating reed for forming electrodes on a surface of a piezoelectric plate using a photolithography technique, an electrode forming step of forming excitation electrodes includes: an exposure step of exposing a photoresist (mask material); a developing step of immersing the photoresist in a developing solution to selectively remove the photoresist to thereby form a mask pattern; and an etching step of forming the excitation electrodes. An immersing step of immersing a piezoelectric plate on which the photoresist is applied in a first solution that is dissolvable in the developing solution and has lower viscosity than the developing solution is performed between the exposure step and the developing step. | 08-02-2012 |
20120200365 | METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATING REED, PIEZOELECTRIC VIBRATING REED, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO TIMEPIECE - A photoresist film forming process is performed by the use of a forming apparatus that has a sprayer which generates an air flow toward metal film on a wafer to spray the photoresist material, and a plurality of spacers which is disposed between a work stage and the wafer. | 08-09-2012 |
20120204388 | METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATING REED, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO TIMEPIECE - A method of manufacturing a piezoelectric vibrating reed includes an electrode mark group detecting process of detecting a wafer side mark group and an electrode mask side mark group, and an electrode mask placing process of placing the electrode film mask on the wafer while aligning the wafer side mark group and the electrode mask side mark group, wherein the wafer side mark group and the electrode mask side mark group are constituted by marks having sizes different from each other, the smallest wafer side mark and the electrode mask side mark are used for the alignment of the mutual marks, respectively, and the wafer side mark and the electrode mask side mark except for the smallest wafer side mark and the electrode mask side mark are used in the electrode mark group detecting process. | 08-16-2012 |
20120217218 | PIEZOELECTRIC VIBRATING REED, PIEZOELECTRIC VIBRATING REED MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE AND RADIO TIMEPIECE - An electrode forming step of forming a pair of electrodes by patterning an electrode film on an outer surface of a piezoelectric plate includes: an electrode film forming step of forming the electrode film; a photoresist film forming step of forming a photoresist film on the electrode film; a first exposure step of exposing the photoresist film through a mask; and a second exposure step of further exposing the photoresist film through a correction mask on which a second opening is disposed at a position overlapping with a part of the first opening. An opening width of the second opening corresponding to a clearance between the pair of electrodes is equal to or less than an opening width of the first opening corresponding to the clearance. | 08-30-2012 |