| Patent application number | Description | Published |
|---|
| 20080254575 | ENCAPSULATION METHOD AND APPARATUS - A method and apparatus for encapsulating items such as electronic devices. A mold material is dispensed onto the electronic device and the device is situated between first and second molds. One mold is moved towards the other so as to vary the size of a cavity defined by the first and second molds. A vacuum is applied to the cavity and the vacuum is varied in response to the size of the cavity. The vacuum can be varied in response to a predetermined vacuum profile. For example, in certain embodiments the vacuum is varied in response to the position of the first mold relative to the second mold, wherein the vacuum is increased as the cavity height is reduced. | 10-16-2008 |
| 20090008793 | SEMICONDUCTOR DEVICE - A description is given of a device comprising a first semiconductor chip, a molding compound layer embedding the first semiconductor chip, a first electrically conductive layer applied to the molding compound layer, a through hole arranged in the molding compound layer, and a solder material filling the through hole. | 01-08-2009 |
| 20090039496 | METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE - A method for fabricating a semiconductor chip module and a semiconductor chip package is disclosed. One embodiment provides a first layer, a second layer, and a base layer. The first layer is disposed on the base layer, and the second layer is disposed on the first layer. A plurality of semiconductor chips is applied above the second layer, and the second layer with the applied semiconductor chips is separated from the first layer. | 02-12-2009 |
| 20090155956 | SEMICONDUCTOR DEVICE - A semiconductor device and method. One embodiment provides an encapsulation plate defining a first main surface and a second main surface opposite to the first main surface. The encapsulation plate includes multiple semiconductor chips. An electrically conductive layer is applied to the first and second main surface of the encapsulation plate at the same time. | 06-18-2009 |
| 20100025848 | METHOD OF FABRICATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A method of fabricating a semiconductor device and semiconductor device is provided. The method provides a first layer. The first layer includes through-holes. At least one semiconductor chip is provided. The semiconductor chip includes contact elements. The semiconductor chip is placed onto the first layer with the contact elements being aligned with the through-holes. An encapsulant material is applied over the semiconductor chip. | 02-04-2010 |
| 20100123217 | SEMICONDUCTOR DEVICE - A semiconductor package includes a semiconductor chip having an integrated circuit, a functional element electrically coupled with the integrated circuit, and an array of contact elements connected with the integrated circuit and the functional element. The functional element is configured to protect the integrated circuit from transient voltage. | 05-20-2010 |
| 20100178736 | METHOD OF FABRICATING A SEMICONDUCTOR DEVICE - One method includes fabricating a semiconductor device including providing a dielectric layer. At least one semiconductor chip is provided defining a first surface including contact elements and a second surface opposite to the first surface. The semiconductor chip is placed onto the dielectric layer with the first surface facing the dielectric layer. An encapsulant material is applied over the second surface of the semiconductor chip in a reel-to-reel process. | 07-15-2010 |
| 20100289095 | SEMICONDUCTOR DEVICE - The semiconductor device comprises a semiconductor chip defining a first face and a second face opposite to the first face, the semiconductor chip comprising at least one contact element on the first face of the semiconductor chip, an encapsulating body encapsulating the semiconductor chip, the encapsulating body having a first face and a second face opposite to the first face, a redistribution layer extending over the semiconductor chip and the first face of the encapsulating body and containing a metallization layer comprising contact areas connected with the contact elements of the semiconductor chip, and an array of external contact elements located on the second phase of the encapsulating body. | 11-18-2010 |
| 20110057304 | METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE - A method for fabricating a semiconductor chip module and a semiconductor chip package is disclosed. One embodiment provides a first layer, a second layer, and a base layer. The first layer is disposed on the base layer, and the second layer is disposed on the first layer. A plurality of semiconductor chips is applied above the second layer, and the second layer with the applied semiconductor chips is separated from the first layer. | 03-10-2011 |
