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Irikura, JP

Akemi Irikura, Tokyo JP

Patent application numberDescriptionPublished
20080314402Artificial Hair, Wig Using the Same, and Method of Making Artificial Hair - An artificial hair bundle (12-25-2008
20090126749ARTIFICIAL HAIR AND WIG USING THE SAME - An artificial hair and a wig using the same are provided which have such feeling as appearance, tactile and texture and preferable physical properties similar to natural hair, wherein an artificial hair 05-21-2009
20090165810WIG - A hair material for a wig is preliminarily curled and then bound to a wig base to thereby orient the curled hair in a definite direction. A folded part (07-02-2009
20090320866ARTIFICIAL HAIR AND WIG USING THE SAME - An artificial hair and a wig using the same are provided which have the property of thermal deformation expanding upon heating by a hair drier or others used for hair styling.12-31-2009

Daisuke Irikura, Mino-Shi JP

Patent application numberDescriptionPublished
20090263784THREE-DIMENSIONAL STRUCTURE OF PROSTAGLANDIN D SYNTHASE AND UTILIZATION THEREOF - A method of designing an anti-allergic agent, sleep controlling agent, anti-obesity agent and remedy for brain injury acting via the inhibition of biosynthesis of prostaglandin D10-22-2009

Hagane Irikura, Ibaraki JP

Patent application numberDescriptionPublished
20100119712POLYUREA FILM AND METHOD FOR PREPARING SAME - It is an object of the invention to prepare a polyurea film with excellent transparency, light resistance and mass-scale productivity on a substrate of a resin-molded article by a method of vacuum deposition polymerization. A polyurea film obtained by vacuum deposition polymerization of an aromatic alkyl-, alicyclic- or aliphatic diisocyanate monomer and an aromatic alkyl-, alicyclic- or aliphatic diamine monomer, where the diisocyanate monomer and the diamine monomer are selected from diisocyanate monomers and diamine monomers in a relation such that the difference in the activation energy required for the elimination from a substrate between these monomers is 10 kJ or less.05-13-2010
20100209721METHOD FOR LAMINATION OF DECORATIVE METAL FILM ON RESIN BASE MATERIAL, AND RESIN BASE MATERIAL HAVING DECORATIVE METAL FILM THEREON - The present invention provides a method for laminating a decorative metal film on a resin base material with excellent adhesion to the resin base material and with a sufficient gloss imparted to the decorative metal film, and a resin base material having a decorative metal film. The method laminates a polymeric planarizing film on the resin base material using a vapor deposition polymerization method, and then laminates the decorative metal film on the planarizing film.08-19-2010

Hagane Irikura, Tsukuba-Shi JP

Patent application numberDescriptionPublished
20110091650METHOD OF FORMING ORGANIC POLYMER THIN FILM AND AN APPARATUS FOR FORMING THE ORGANIC POLYMER THIN FILM - A technique for forming an organic polymer thin film on a surface of a substrate with high film formation efficiency and excellent reproducibility and stability is provided. When a vacuum deposition polymerization for forming an organic polymer thin film is performed on a surface of a substrate 04-21-2011
20110091661APPARATUS FOR PRODUCING MULTILAYER SHEET AND METHOD OF PRODUCING THE MULTILAYER SHEET - An apparatus for producing a multilayer sheet including a resin film, a vapor-deposited metal film and a vapor-deposited polymer film at a low cost and with excellent productivity is provided which comprises: a vacuum chamber which is made to be in a vacuum state by exhaust means; a feeding roller; a take up roller; a first to third rollers, first metal vapor deposition means for forming a first vapor-deposited metal film on one surface of a resin film at a periphery of the first roller; vapor deposition polymerization means for forming a vapor-deposited polymer film on the first vapor-deposited metal film by vapor deposition polymerization at a periphery of the second roller; and second metal vapor deposition means for forming the second vapor-deposited metal film on the other surface of the resin film at a periphery of the third roller.04-21-2011

Hiroyuki Irikura, Ome-Shi JP

Patent application numberDescriptionPublished
20100302391Head-Separated Camera Device and Control Method Thereof - According to one embodiment, a camera control unit outputs serial data containing information for specifying a predetermined control target device to be controlled from among plural control target devices comprised in a camera head. The camera head identifies the control target device specified by the received serial data, and supplies the identified control target device with a select signal for an active state.12-02-2010
20110013037Head-Separated Camera Device - According to one embodiment, a head-separated camera device has an imaging unit, control unit configured to control the imaging unit and a connection unit configured to connect the imaging unit with the control unit, wherein the imaging unit comprises a sensor configured to capture an image, and a transmitter configured to transmit a video signal, a synchronization signal, and a clock signal, for recovering or reproducing the image captured by the sensor, and the control unit comprises detector configured to detect that the imaging unit is connected to the control unit if a preset value preset in the imaging unit is read via a control line, and a setting module configured to set a register setting in the sensor if the detector detects connection of the imaging unit.01-20-2011
20110013078HEAD-SEPARATED CAMERA DEVICE - According to one embodiment, a head-separated camera device includes an imaging unit, a control unit configured to control the imaging unit and a connection unit configured to connect the imaging unit and the control unit. The imaging unit includes a sensor configured to capture an image to provide a video signal, a superimposition module configured to superimpose, on serial data, the video signal, the synchronization signal, and the clock signal, the serial data serving to reproduce the image captured by the sensor, and a transmitter configured to transmit the serial data to the control unit. The control unit includes a receiver configured to receive the serial data and a separation module configured to separate the serial data received by the receiver, into the video signal, the synchronization signal, and the clock signal.01-20-2011
20110050877HEAD SEPARATED CAMERA APPARATUS - According to one embodiment, a head-separated device has an imaging unit, a control unit configured to control the imaging unit and a connection unit configured to connect the imaging unit with the control unit, wherein the imaging unit comprises sensor configured to capture an image, and a transmitter configured to transmit a video signal, a sync signal (HD, VD) and a clock signal to restore or to reproduce the image captured by the sensor, and the control unit comprises a determining module configured to determine whether a waveform of the video signal has a level that the video processor is processable, and a setting module configured to set the transmitter to perform enhancement correction to the video signal, if the determining module determines that the waveform of the video signal does not have the level that the video processor is processable.03-03-2011
20110122262METHOD AND APPARATUS FOR INFORMATION REPRODUCTION - According to one embodiment, a camera apparatus includes, an imaging unit which acquires videos, a cable which connects the imaging unit to a control unit, and the control unit which comprises an asynchronous FIFO memory and a signal processing module and controls the imaging unit, the control unit performing transmitting to the imaging unit a drive signal configured to control an image sensor included in the imaging unit, and receiving a video signal including a clock signal or a synchronous signal output from the image sensor and converting this signal into a video signal standardized via the signal processing module.05-26-2011

Hiroyuki Irikura, Tokyo JP

Patent application numberDescriptionPublished
20110025907Camera Head Separated Type Camera Device - According to an aspect of the present invention, there is provided a camera head separated type camera device including: a camera head; a camera control unit; and a cable connecting the camera head and the camera control unit with each other, wherein the camera control unit includes: a control portion which feeds a predetermined DC (Direct Current) voltage to the camera head, and wherein the camera head includes: an LVDS conversion driver portion which transmits an LVDS (Low Voltage Differential Signaling) signal to the camera control unit; a correction control portion which outputs a correction value for the LVDS signal; and an LVDS control portion which controls the LVDS conversion driver portion based on the correction value.02-03-2011

Koji Irikura, Hyogo-Ken JP

Patent application numberDescriptionPublished
20090165452Axle Driving Apparatus - An axle driving apparatus comprises a housing. The housing contains a hydrostatic transmission, a differential unit driven by the hydrostatic transmission, a pair of axles mutually differentially connected through the differential unit, and a restricting mechanism for selectively restricting differential motion of the axles by manual operation. The differential unit comprises a ring gear serving as an input gear and a pair of bevel gears which can be differentially rotated by rotation of the ring gear. The restricting mechanism engages one of the bevel gears with the ring gear. If a pair of differential side gears fixed on the respective axles serve as the bevel gears, the restricting mechanism engages one of the bevel gear to the ring gear through a claw clutch or a friction clutch.07-02-2009

Koji Irikura, Amagasaki JP

Patent application numberDescriptionPublished
20090199678Automatic traction enhancement for a transaxle - A transaxle for a working vehicle including a housing, an integrated hydrostatic transmission (IHT) disposed within the housing, and a bi-directional overrunning clutch disposed within the housing and coupled to an output shaft of the IHT. The bi-directional overrunning clutch includes an input gear having a central opening, a roller assembly disposed within the central opening of the input gear, a plurality of rollers for selective engagement with the input gear, and a pair of hubs. Each hub is disposed at least partially within the roller assembly. The transaxle further includes a pair of clutch covers. Each clutch cover is disposed at either end of the roller assembly and each clutch cover is coupled directly to the roller assembly. The bi-directional overrunning clutch further includes a pair of friction members. Each friction member is disposed between one of the hubs and respective clutch cover. The transaxle also includes a pair of shaft segments of a primary drive axle.08-13-2009

Koji Irikura, Hyogo JP

Patent application numberDescriptionPublished
20080296080Hydraulic Transaxle And Vehicle Comprising It - A hydraulic transaxle comprises a transaxle casing for supporting left and right axles, a pair of hydraulic motors disposed in the transaxle casing so as to drive the respective left and right axles, hydraulic ports provided in the transaxle casing so as to fluidly connect the pair of hydraulic motors in parallel to a common hydraulic pump, and a system for restricting or canceling differential rotation of the pair of hydraulic motors.12-04-2008
20090047151Hydraulic Steering Transaxle And Hydraulic Driving Vehicle - A fluid passage member includes a pump mounting surface onto which a hydraulic pump having a rotary axis is mounted; first and second kidney ports opened at the pump mounting surface; a first fluid extraction port outwardly opened and connected to the first kidney port; a motor mounting surface onto which a hydraulic motor having a rotary axis is mounted so that the rotary axis of the hydraulic motor is parallel to the rotary axis of the hydraulic pump; third and fourth kidney ports opened at the motor mounting surface; and a second fluid extraction port outwardly opened and connected to the third kidney port.02-19-2009
20090145124Hydraulic Transaxle - A hydraulic transaxle comprises: a housing having a fluid sump therein, the housing including mutually joined housing parts; a pair of first wheels disposed at one of front and rear portions of the vehicle; an axle disposed in the housing; a center section disposed in the housing, the center section being formed therein with a pair of fluid ducts; a hydraulic pump disposed in the housing, fitted to the center section, and communicating with the fluid ducts; and a hydraulic motor disposed in the housing, fitted to the center section, and communicating with the fluid ducts so as to be fluidly connected to the hydraulic pump. The hydraulic motor includes a cylindrical motor shaft relatively rotatably and coaxially penetrated by the axle and drivingly connected to the axle.06-11-2009
20090194360Multi-Wheel Vehicle - A vehicle comprises a steering operation device, a pair of running-driving wheels, which differentially drive when the steering operation device is manipulated, a pair of steerable running wheels interlocking with the steering operation device, and a steering mechanism interposed between the steering operation device and the pair of running-driving wheels. The steering mechanism includes a pair of drive gears interlocking with the steering operation device and a pair of follower gears interlocking with the respective steerable running wheels. The drive gears mesh with the respective follower gears so as to control lateral turning of the respective steerable running wheels. A gear radius of the drive gear may be greater than that of the follower gear meshing with it. A gear ratio between the mutually meshing drive and follower gears may be variable. The lateral turning centers of both the steerable running wheels may coincide with each other, and further coincide with a lateral turning center of the vehicle body caused by differential rotation of the running-driving wheels.08-06-2009

Patent applications by Koji Irikura, Hyogo JP

Masato Irikura, Itami-Shi JP

Patent application numberDescriptionPublished
20090127564GaN Substrate Manufacturing Method, GaN Substrate, and Semiconductor Device - A GaN substrate manufacturing method characterized in including a step of processing the surface of a substrate composed of a GaN single crystal into a concavely spherical form, based on differences in orientation of the crystallographic axis across the substrate surface. Processing the GaN substrate surface into a concavely spherical form reduces, in the post-process GaN substrate surface, differences in orientation of the crystallographic axis with respect to a normal. Furthermore, employing to manufacture semiconductor devices a GaN substrate in which differences in orientation of the crystallographic axis have been reduced makes it possible to uniformize in device characteristics a plurality of semiconductor devices fabricated from a single GaN substrate, which contributes to improving yields in manufacturing the semiconductor devices.05-21-2009
20090273060GROUP III NITRIDE CRYSTAL AND METHOD FOR SURFACE TREATMENT THEREOF, GROUP III NITRIDE STACK AND MANUFACTURING METHOD THEREOF, AND GROUP III NITRIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A method for surface treatment of a group III nitride crystal includes the steps of lapping a surface of a group III nitride crystal using a hard abrasive grain with a Mohs hardness higher than 7, and abrasive-grain-free polishing the lapped surface of the group III nitride crystal using a polishing solution without containing abrasive grain, and the polishing solution without containing abrasive grain has a pH of not less than 1 and not more than 6, or not less than 8.5 and not more than 14. Accordingly, the method for surface treatment of a group III nitride crystal can be provided according to which hard abrasive grains remaining at the lapped crystal can be removed to reduce impurities at the crystal surface.11-05-2009
20100013058Semiconductor Wafer and Semiconductor Wafer Inspection Method - Affords semiconductor wafers that achieve uniformization of semiconductor films. In a semiconductor wafer (01-21-2010
20110133207GROUP III NITRIDE SUBSTRATE, EPITAXIAL LAYER-PROVIDED SUBSTRATE, METHODS OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A group III nitride substrate on which an epitaxially grown layer of good quality can be formed, and a method of manufacturing the same are obtained. A GaN substrate (06-09-2011
20110133209GaN SUBSTRATE, EPITAXIAL LAYER-PROVIDED SUBSTRATE, METHODS OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A GaN substrate on which an epitaxially grown layer of good quality can be formed is obtained. A GaN substrate as a group III nitride substrate has a surface in which the number of chlorine atoms per square centimeter of the surface is not more than 2×1006-09-2011
20110146565GROUP III NITRIDE CRYSTAL AND METHOD FOR SURFACE TREATMENT THEREOF, GROUP III NITRIDE STACK AND MANUFACTURING METHOD THEREOF, AND GROUP III NITRIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A method for surface treatment of a group III nitride crystal includes the steps of lapping a surface of a group III nitride crystal using a hard abrasive grain with a Mohs hardness higher than 7, and abrasive-grain-free polishing the lapped surface of the group III nitride crystal using a polishing solution without containing abrasive grain, and the polishing solution without containing abrasive grain has a pH of not less than 1 and not more than 6, or not less than 8.5 and not more than 14. Accordingly, the method for surface treatment of a group III nitride crystal can be provided according to which hard abrasive grains remaining at the lapped crystal can be removed to reduce impurities at the crystal surface.06-23-2011

Patent applications by Masato Irikura, Itami-Shi JP

Masato Irikura, Hyogo JP

Patent application numberDescriptionPublished
20090218659CHAMFERED FREESTANDING NITRIDE SEMICONDUCTOR WAFER AND METHOD OF CHAMFERING NITRIDE SEMICONDUCTOR WAFER - Technology of making freestanding gallium nitride (GaN) wafers has been matured at length. Gallium nitride is rigid but fragile. Chamfering of a periphery of a GaN wafer is difficult. At present edges are chamfered by a rotary whetstone of gross granules with weak pressure. Minimum roughness of the chamfered edges is still about Ra 10 μm to Ra 6 μm. The large edge roughness causes scratches, cracks, splits or breaks in transferring process or wafer process. A wafer of the present invention is bevelled by fixing the wafer to a chuck of a rotor, bringing an edge of the wafer into contact with an elastic whetting material having a soft matrix and granules implanted on the soft matrix, rotating the wafer and feeding the whetting material. Favorably, several times of chamfering edges by changing the whetting materials of smaller granules are given to the wafer. The chamfering can realize small roughness of Ra 10 nm and Ra 5 μm at edges of wafers.09-03-2009
20100187540GROUP III NITRIDE SUBSTRATE, EPITAXIAL LAYER-PROVIDED SUBSTRATE, METHODS OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A group III nitride substrate on which an epitaxially grown layer of good quality can be formed, and a method of manufacturing the same are obtained. A GaN substrate is one of the following: a group III nitride substrate, wherein the number of atoms of an acid material per square centimeter of a surface is not more than 2×1007-29-2010

Patent applications by Masato Irikura, Hyogo JP