Patent application number | Description | Published |
20150122835 | Variable Volume Container - A device and method of use for storing and/or dispensing any solid, liquid, and/or gas is disclosed. In one embodiment, the device for storing and/or dispensing any solid, liquid, and/or gas is comprised of a base member, one or more intermediate member(s), and a top member. In another embodiment, the device is also comprised of a flow value member that may be included in the base member, intermediate member(s), and/or top member. In another embodiment, the device is also comprised of a one or more sealing member(s) between the base member and the intermediate member, each intermediate member, and the intermediate member and the top member. In yet another embodiment, the base member and/or top member is comprised of one or more mixing member(s) that can be used to mix the contents of the container. Lastly, in another embodiment, the device may consist of a liner member inside the container. | 05-07-2015 |
Patent application number | Description | Published |
20110050255 | SYSTEM AND METHOD FOR MEASURING CAPACITANCE - A system and method for testing capacitance of a load circuit connected to an output pin of a driving circuit In one embodiment, the method may comprise driving a voltage at the output pin to a first voltage; a predetermined current to the output pin; comparing the voltage at the output pin to a reference voltage; and when the voltage at the output pin matches the reference voltage, generating an estimate of capacitance present at the output pin based on a number of clock cycles occurring between an onset of a timed voltage change period and a time at which the voltage at the output pin matches the reference voltage. | 03-03-2011 |
20140026649 | VERTICALLY INTEGRATED SYSTEMS - Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer. | 01-30-2014 |
20140034104 | VERTICALLY INTEGRATED SYSTEMS - Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer. | 02-06-2014 |
20140035630 | VERTICALLY INTEGRATED SYSTEMS - Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer. | 02-06-2014 |
20140175524 | VERTICALLY INTEGRATED SYSTEMS - Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer. | 06-26-2014 |
20140175600 | VERTICALLY INTEGRATED SYSTEMS - Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer. | 06-26-2014 |
20150121995 | VERTICALLY INTEGRATED SYSTEMS - Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer. | 05-07-2015 |
Patent application number | Description | Published |
20100308902 | REFERENCE VOLTAGE GENERATORS FOR INTEGRATED CIRCUITS - A reference voltage generator circuit may include at least one MOS transistor and at least one bipolar transistor coupled together to provide an electrical path from an input reference potential to an output of the generator circuit. The electrical path may extend through a gate-to-source path of the MOS transistor and further through a base-to-emitter path of the bipolar transistor. The MOS transistor may be biased by a bias current that is proportional to T | 12-09-2010 |
20110163811 | Fast Class AB Output Stage - A system for a Class AB Amplifier output stage that includes a first push pull system connected to an output terminal including a first driving transistor coupled to the output terminal and a second push pull system connected to the output terminal including a second driving transistor coupled to the output terminal. The amplifier also includes a current mode amplifier where the current mode amplifier's output is coupled to the first driving transistor's gate. The amplifier further includes a pair of resistors, a first resistor coupled to a first input terminal of the current mode amplifier, a second resistor coupled to a second input terminal of the current mode amplifier and coupled to the second driving transistor. | 07-07-2011 |
20120162947 | VERTICALLY INTEGRATED SYSTEMS - Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer. | 06-28-2012 |
20120223688 | HIGH POWER SUPPLY REJECTION RATIO (PSRR) AND LOW DROPOUT REGULATOR - A low dropout voltage regulator (LDO) includes first and second amplifiers and a current mirror. The first amplifier includes a first input receiving a reference voltage and a second input receiving a voltage proportional to an output of the LDO. The current mirror includes an input current at a first end of the current mirror to an output current at a second end of the current mirror, the input current controlled by an output of the first amplifier and the output current being supplied to the output of the LDO. The second amplifier includes a first input coupled to the first end of the current mirror and a second input coupled to the second end of the current mirror. | 09-06-2012 |
20120229264 | SMART LINEAR RESONANT ACTUATOR CONTROL - The present invention provides a haptics control system that may include a driver to generate a continuous drive signal and to output the drive signal to a mechanical system on an electrical signal line, wherein the continuous drive signal causes the mechanical system to vibrate to produce a haptic effect. The haptics control system may further include a monitor, coupled to the electrical signal line, to capture a Back Electromotive Force (BEMF) signal generated by the mechanical system in the electrical signal line, to measure a BEMF signals attribute, and to transmit an adjustment signal to the driver based on the BEMF signals attribute. The driver is further configured to adjust the continuous drive signal according to the adjustment signal. | 09-13-2012 |
20120249185 | PROTECTION CIRCUIT FOR DRIVING CAPACITIVE LOADS - A detection circuit is coupled to an output terminal of a driver circuit. The detection circuit includes a comparator to compare a signal at the output terminal to a reference signal corresponding to a signal that would be generated if a capacitive load having a relatively high capacitance value were connected to the output terminal. Output of the comparator is sampled at a predetermined time after the driver circuit provides the drive signal. An error signal is generated when the sampled output indicates that the capacitive load having the relatively high capacitance value is actually connected to the output terminal. | 10-04-2012 |
20140266140 | Voltage Generator, a Method of Generating a Voltage and a Power-Up Reset Circuit - A voltage generator is provided which is reliable, self starting and only requires a few components. The voltage generator comprises a first stage that provides a current to a second stage. The first stage has a temperature coefficient of one sign, such as positive, and the second stage has an opposing temperature coefficient, e.g. negative. The responses are summed such that the overall temperature coefficient is reduced. | 09-18-2014 |
20140266314 | Power Monitoring Circuit, and a Power Up Reset Generator - A power supply monitoring circuit for monitoring a voltage at a power supply node compared to a reference node, the power supply monitoring circuit comprising a first field effect transistor and first and second voltage dropping components arranged in current flow communication between the power supply node and the reference node and each having first and second nodes, and wherein a first node of the first voltage dropping component is connected to one of the first and second nodes of the field effect transistor, and a gate of the field effect transistor is connected to the second node of the first voltage dropping component, and an output signal is taken from a connection made with the first field effect transistor. | 09-18-2014 |