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Iri
Chika Iri, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090060642 | JOINT CONNECTION - In a joint connection | 03-05-2009 |
Junichiro Iri, Kanagawa-Ken JP
| Patent application number | Description | Published |
|---|---|---|
| 20090242111 | METHOD FOR DICING WAFER AND PROCESS FOR MANUFACTURING LIQUID-DISCHARGING HEAD USING THE DICING METHOD - A method for dicing a wafer having a first face in which opening are arranged along dicing streets. The method includes a step of affixing a dicing tape to the first face such that the dicing tape lies over the openings and adhesive regions of the dicing tape are exposed in the openings and a step of treating the dicing tape to reduce the adhesive strength of the adhesive regions. | 10-01-2009 |
| 20110027970 | METHOD FOR DICING WAFER AND PROCESS FOR MANUFACTURING LIQUID-DISCHARGING HEAD USING THE DICING METHOD - A method for dicing a wafer having a first face in which opening are arranged along dicing streets. The method includes a step of affixing a dicing tape to the first face such that the dicing tape lies over the openings and adhesive regions of the dicing tape are exposed in the openings and a step of treating the dicing tape to reduce the adhesive strength of the adhesive regions. | 02-03-2011 |
Junichiro Iri, Yokohama-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090309931 | PRINTING HEAD AND MANUFACTURING METHOD OF PRINTING HEAD - There is provided a printing head which improves durability and increases reliability by reducing stress occurring in a bonding part between an electrode pad and an inner lead at cooling. The electrode pad and the inner lead are electrically connected in such a manner that in the bonding portions between the electrode pad and a stud bump, only a part of contacting portions between the electrode and the stud bump is bonded. | 12-17-2009 |
| 20090314144 | DICING METHOD, PROGRAM FOR THE DICING METHOD, AND STORAGE MEDIUM FOR THE DICING METHOD - A dicing method includes the step of cutting a substrate with a blade along a scribe line free from metal before an inclination of the blade surface reaches a predetermined critical value. The blade surface becomes inclined when the blade cuts into a scribe line having metal thereon. The critical value is determined on the basis of the inclination of the blade surface which leads to a breakage of the blade. | 12-24-2009 |