| Patent application number | Description | Published |
|---|
| 20080218972 | Cooling device, system containing same, and cooling method - A cooling device includes a heat sink ( | 09-11-2008 |
| 20080238248 | MULTI-LAYER PIEZOELECTRIC ACTUATORS WITH CONDUCTIVE POLYMER ELECTRODES - A multi-layer piezoelectric actuator with conductive polymer electrodes is described. The piezoelectric actuator comprises a stack of alternating conductive electrode layers and piezoelectric layers. The conductive electrode layers are comprised of a polymeric electrically conductive material. A device for cooling by forced-air convection may comprise the piezoelectric actuator, a fan blade and an alternating current supply. The piezoelectric actuator coupled with the fan blade and the alternating current supply, which is provided for vibrating the fan blade. A method of cooling by forced-air convection comprises supplying an alternating current to the piezoelectric actuator, wherein the alternating current has a frequency and causes the fan blade to vibrate with the same frequency. | 10-02-2008 |
| 20080238256 | Dual direction rake piezo actuator - Methods and apparatus relating to use and/or provision of a rake piezo actuator are described. In one embodiment, a piezo patch may be coupled to a plurality of blades (e.g., to cause the blades to oscillate and provide air flow between fins of one or more heat sinks). Other embodiments are also described. | 10-02-2008 |
| 20090001576 | INTERCONNECT USING LIQUID METAL - A semiconductor package comprises a substrate that has a first protruding interconnect and a semiconductor die that has a second protruding interconnect that faces the first protruding interconnect. The package further comprises a spacer provided between the substrate and the die, wherein the spacer comprises a hole filled with liquid metal to couple the first protruding interconnect to the second protruding interconnect. | 01-01-2009 |
| 20090026881 | PIEZOELECTRIC FAN, METHOD OF COOLING A MICROELECTRONIC DEVICE USING SAME, AND SYSTEM CONTAINING SAME - A piezoelectric fan comprises a blade ( | 01-29-2009 |
| 20090034197 | HEATSINK, METHOD OF MANUFACTURING SAME, AND MICROELECTRONIC PACKAGE CONTAINING SAME - A heatsink comprises a base ( | 02-05-2009 |
| 20090080156 | Cooling Arrangement to Cool Components on Circuit Board - A circuit board including a blower thereon to cool a heat generating arrangement. The circuit board includes a board substrate; a blower disposed on the board substrate, the blower having an inlet adapted to take in coolant in a inlet direction, and an outlet adapted to blow out coolant in a first outlet direction extending at an angle with respect to the inlet direction; and a heat-generating arrangement disposed on the board substrate such that the blower is adapted to blow out coolant in the first outlet direction to cool the heat generating arrangement. | 03-26-2009 |
| 20090084931 | ENABLING BARE DIE LIQUID COOLING FOR THE BARE DIE AND HOT SPOTS - A liquid cooling device for a die including a support block supporting a plurality of substantially vertical channels transporting fluid to and from a bare die surface for heat removal. The device is mounted on top of a bare die using a frame or spring. In another embodiment, the device allows thermoelectric cooling of a dedicated fluid line. | 04-02-2009 |
| 20090085187 | LOADING MECHANISM FOR BARE DIE PACKAGES AND LGA SOCKET - Methods and associated apparatus of reducing stress in a package Those methods may comprise providing a package comprising a die coupled to a substrate, wherein the substrate is disposed on an LGA socket, and wherein a TIM is disposed on a top surface of the die, and then attaching a thermal solution to the TIM, wherein at least one standoff is attached between the thermal solution and the substrate. | 04-02-2009 |
| 20090085438 | PIEZOELECTRIC FAN, COOLING DEVICE CONTAINING SAME, AND METHOD OF COOLING A MICROELECTRONIC DEVICE USING SAME - A piezoelectric fan includes a piezoelectric actuator patch ( | 04-02-2009 |
| 20090096087 | MICROELECTRONIC ASSEMBLY AND METHOD OF PREPARING SAME - A microelectronic assembly includes a die ( | 04-16-2009 |
| 20090152713 | INTEGRATED CIRCUIT ASSEMBLY INCLUDING THERMAL INTERFACE MATERIAL COMPRISED OF OIL OR WAX - Embodiments of a thermal interface material layer comprised of an oil or a wax are disclosed. The thermal interface material may be used to thermally couple an integrated circuit die to a thermal component, such as a heat spreader. Other embodiments are described and claimed. | 06-18-2009 |
| 20090166855 | Cooling solutions for die-down integrated circuit packages - Systems for cooling the backside of a semiconductor die located in a die-down integrated circuit (IC) package are described. The IC package is attached to the topside of a printed circuit board (PCB) with the backside of the die residing below the topside surface of the PCB. A cooling plate is attached to the backside of the die and thermally connected to a heat sink located above the topside surface of the PCB via conduits that pass through openings in the PCB. | 07-02-2009 |
| 20090174999 | PIEZOELECTRIC AIR JET AUGMENTED COOLING FOR ELECTRONIC DEVICES - In some embodiments, piezoelectric air jet augmented cooling for electronic devices is presented. In this regard, an apparatus is introduced having a plurality of more than about one hundred lead-free piezoelectric layers and electrodes stacked on top of each other and formed around a central opening, and a diaphragm coupled to the piezoelectric layers and substantially covering the central opening to vibrate and blow air when an operating voltage is applied to the electrodes. Other embodiments are also disclosed and claimed. | 07-09-2009 |
| 20090230819 | COMPACT RAKE PIEZOELECTRIC ASSEMBLY AND METHOD OF MANUFACTURING SAME - A compact rake piezoelectric assembly comprises a body ( | 09-17-2009 |
| 20090273083 | ELECTRICALLY CONDUCTIVE FLUID INTERCONNECTS FOR INTEGRATED CIRCUIT DEVICES - Disclosed are embodiments of an electrically conductive fluid interconnect for coupling an integrated circuit (IC) device to a substrate. The IC device may be coupled to the substrate in a socketless manner or using a socket. The electrically conductive fluid interconnect may include, for example, a metal, an electrically conductive paste, or an electrically conductive polymer material. The fluid may be in a liquid or paste state over at least part of an operating temperature range of the IC device, and in other embodiments the fluid may be in the liquid or paste state at room temperature. Other embodiments are described and claimed. | 11-05-2009 |
| 20090279255 | PIEZO FANS FOR COOLING AN ELECTRONIC DEVICE - A cooling system including one or more piezo fans for an electronic assembly is disclosed. The electronic assembly may include heat-generating components coupled with a front side of a printed circuit board (PCB) and one or more piezo fans coupled with a back side of the PCB. One or more piezo fans may be capable of cooling the heat-generating components from the back side. The cooling system may further include a heat sink coupled with the back side of the PCB. | 11-12-2009 |
| 20100047092 | Piezoelectric fan, method of cooling a microelectronic device using same, and system containing same - A piezoelectric fan comprises a blade ( | 02-25-2010 |
| 20110109335 | Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same - An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material. | 05-12-2011 |
