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John A. Interrante, Scotia, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20090100293 | METHOD AND SYSTEM FOR PREDICTING TURBOMACHINERY FAILURE EVENTS EMPLOYING GENETIC ALGORITHM - A method for predicting or detecting an event in turbomachinery includes the steps of obtaining operational data from at least one machine and at least one peer machine. The operational data comprises a plurality of performance metrics. A genetic algorithm (GA) analyzes the operational data, and generates a plurality of clauses, which are used to characterize the operational data. The clauses are evaluated as being either “true” or “false”. A fitness function identifies a fitness value for each of the clauses. A perturbation is applied to selected clauses to create additional clauses, which are then added to the clauses group. The steps of applying a fitness function, selecting a plurality of clauses, and applying a perturbation can be repeated until a predetermined fitness value is reached. The selected clauses are then applied to the operational data from the machine to detect or predict a past, present or future event. | 04-16-2009 |
John Alexander Interrante, Richardson, TX US
| Patent application number | Description | Published |
|---|---|---|
| 20080219248 | SYSTEM AND METHOD FOR RAPIDLY CONFIGURING WIRELESS TRANSCEIVERS - A system and method for configuring a wireless transceiver are disclosed. As one example, a system for configuring a wireless transceiver is disclosed, which includes a first data storage unit coupled to a configuration bus disposed in the wireless transceiver, a second data storage unit coupled to the configuration bus, a change detection unit coupled to the second data storage unit, the change detection configured to detect a change to a value stored in the second data storage unit, and output a signal responsive to the change, and a third data storage unit coupled to the first data storage unit, the second data storage unit, and the change detection unit. The third data storage unit is configured to store a plurality of predefined configuration data sets, and convey a predefined configuration data set to the first data storage unit responsive to the signal. | 09-11-2008 |
Mario J. Interrante, New Paltz, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20080206960 | REWORKABLE CHIP STACK - A method for removing a thinned silicon structure from a substrate, the method includes selecting the silicon structure with soldered connections for removal; applying a silicon structure removal device to the silicon structure and the substrate, wherein the silicon structure removal device comprises a pre-determined temperature setpoint for actuation within a range from about eighty percent of a melting point of the soldered connections to about the melting point; heating the silicon structure removal device and the soldered connections of the silicon structure to within the range to actuate the silicon structure removal device; and removing the thinned silicon structure. Also disclosed is a structure including a plurality of layers, at least one layer including a thinned silicon structure and solder coupling the layer to another layer of the plurality; wherein the solder for each layer has a predetermined melting point. | 08-28-2008 |
| 20090085202 | Methods and Apparatus for Assembling Integrated Circuit Device Utilizing a Thin Si Interposer - Methods of assembling an integrated circuit are provided. An interposer supported by an integrated handler is solder bumped onto one or more bond pads on a substrate. The integrated handler is removed from the interposer. A side of the interposer opposite that of the substrate is solder bumped to one or more bond pads on a chip. | 04-02-2009 |
| 20090184407 | METHOD TO RECOVER UNDERFILLED MODULES BY SELECTIVE REMOVAL OF DISCRETE COMPONENTS - Methods and reworked intermediate and resultant electronic modules made thereby, whereby a component in need of rework is located and removed from the module to reveal encapsulated solder connections residing within an underfill matrix. Heights of both the solder connections and underfill matrix are reduced, followed by etching the solder out of the solder connections to form openings within the underfill matrix. The underfill material is then removed to expose metallurgy of the substrate. A blank having a release layer with an array of solder connections is aligned with the exposed metallurgy, and this solder array is transferred from the blank onto the metallurgy. The transferred solder connections are then flattened using heat and pressure, followed by attaching solder connections of a new component to the flattened solder connections and underfilling these reworked solder connections residing between the new chip and substrate. | 07-23-2009 |
Mario John Interrante, New Paltz, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20100326702 | INTEGRATED CIRCUIT ASSEMBLY - Methods and apparatus for forming an integrated circuit assembly are presented, for example, three dimensional integrated circuit assemblies. Lower height 3DIC assemblies due Use of, for example, thinned wafers, low-height solder bumps, and through silicon vias provide for low height three dimensional integrated circuit assemblies. For example, a method for forming an integrated circuit assembly comprises forming first solder bumps on a first die, and forming a first structure comprising the first die, the first solder bumps, a first flux, and a first substratum. The first die is placed upon the first substratum. The first solder bumps are between the first die and the first substratum. The first flux holds the first die substantially flat and onto the first substratum. | 12-30-2010 |
Mark Francis Interrante, Redondo Beach, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20080270921 | PROVIDING REAL TIME INFORMATION IN A VISUAL INFORMATION UNIT - Embodiments of the invention enable a person to easily and without having any specialized knowledge configure a webpage to automatically provide real time information. More specifically, embodiments of the invention are directed to a remotely hosted element which may be easily configured and placed in a webpage by an un-sophisticated publisher. The remotely hosted element provides the real time information. In certain embodiments, the real time information is stock quotes, charts and associated news items. In certain embodiments, the real time information unit is interactive. In other words, it allows webpage viewers to interact with it in order to cause it to show additional, or differently organized information. | 10-30-2008 |